Patents by Inventor Yu Hua YIN

Yu Hua YIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240113112
    Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.
    Type: Application
    Filed: December 1, 2023
    Publication date: April 4, 2024
    Inventors: Ryan Chia-Jen Chen, Cheng-Chung Chang, Shao-Hua Hsu, Yu-Hsien Lin, Ming-Ching Chang, Li-Wei Yin, Tzu-Wen Pan, Yi-Chun Chen
  • Publication number: 20240099149
    Abstract: Semiconductor structure and methods of forming the same are provided. An exemplary method includes receiving a workpiece including a magnetic tunneling junction (MTJ) and a conductive capping layer disposed on the MTJ, depositing a first dielectric layer over the workpiece, performing a first planarization process to the first dielectric layer, and after the performing of the first planarization process, patterning the first dielectric layer to form an opening exposing a top surface of the conductive capping layer, selectively removing the conductive capping layer. The method also includes depositing an electrode layer to fill the opening and performing a second planarization process to the workpiece such that a top surface of the electrode layer and a top surface of the first dielectric layer are coplanar.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 21, 2024
    Inventors: Yu-Feng Yin, Min-Kun Dai, Chien-Hua Huang, Chung-Te Lin
  • Patent number: 10624866
    Abstract: The present disclosure relates to a pharmaceutical composition or food composition including Evans blue for prevention or treatment of chronic pain diseases. The administration of Evans blue according to the present disclosure can effectively reduce chronic pain, such as neuropathic pain. In particular, Evans blue targets mainly VNUT protein of dorsal root ganglia, which plays an important role in the secretion of ATP from the distal end of the afferent nerve and can relieve the pain using drugs continuously without side effects so that it can be efficiently used as an analgesic for various kinds of pain caused by chronic pain diseases.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: April 21, 2020
    Assignee: THE INDUSTRY & ACADEMIC COOPERATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC)
    Inventors: Won Hyung Lee, Dong Woon Kim, Jin Pya Hong, Yu Hua Yin
  • Publication number: 20190269633
    Abstract: The present disclosure relates to a pharmaceutical composition or food composition including Evans blue for prevention or treatment of chronic pain diseases. The administration of Evans blue according to the present disclosure can effectively reduce chronic pain, such as neuropathic pain. In particular, Evans blue targets mainly VNUT protein of dorsal root ganglia, which plays an important role in the secretion of ATP from the distal end of the afferent nerve and can relieve the pain using drugs continuously without side effects so that it can be efficiently used as an analgesic for various kinds of pain caused by chronic pain diseases.
    Type: Application
    Filed: March 5, 2018
    Publication date: September 5, 2019
    Inventors: Won Hyung LEE, Dong Woon KIM, Jin Pyo HONG, Yu Hua YIN