Patents by Inventor Yu Hua

Yu Hua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11111588
    Abstract: An electrolytic reactor of an oxyhydrogen machine includes a main body with an internal chamber for accommodating a liquid, a carrier installed to the chamber for arranging even numbered electrode plates which are spaced from each other and two adjacent electrode plates having different polarities, a multiple of partitions extending to an appropriate length from the top surface to the bottom surface of the main body and spaced from each other, a communicating channel formed by each electrode plate and the main body and disposed between the bottom surface of the main body and each electrode plate, a liquid storage portion formed by the space between the partitions and the chamber and communicated to the communicating channel and a gas extraction unit installed on the main body and having independent first and second gas collection chambers for collecting hydrogen and oxygen respectively.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: September 7, 2021
    Assignee: SHENZHEN QIANHAI YINDUN ENERGY SAVING ENVR. PROT.
    Inventors: Xin Li, Hung Yueh Lo, Yu Hua Chu
  • Patent number: 11109171
    Abstract: A semiconductor device and its manufacturing method are presented. The manufacturing method includes providing a substrate structure; forming a first metal layer on the substrate structure; forming a second metal layer on the first metal layer; forming a first oxide layer on the second metal layer at a first temperature; and conducting the remaining manufacturing processes including thermal processes at a second temperature that is higher than the first temperature. This method reduces the concentration of the first metal diffused into the surface of the second metal layer during the thermal processes, thus reducing the amount of the oxide of the first metal formed on the surface of the second metal layer. Therefore, it is beneficial to the establishment of metal wire connections.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: August 31, 2021
    Inventors: Yijun Chen, Yu Hua, Kuanchieh Yu, Chao Wang, Shan Zhang
  • Patent number: 11088135
    Abstract: An electrostatic discharge (ESD) protection apparatus and an integrated passive device (IPD) with capacitor(s) are provided. The ESD protection apparatus includes a transistor, an impedance, and a capacitor disposed in a redistribution layer (RDL) structure of a package. The first terminal and the second terminal of the transistor are respectively coupled to a first power rail and a second power rail of the RDL structure. A first terminal of the impedance is coupled to the first power rail. A second terminal of the impedance is coupled to a control terminal of the transistor. A first terminal of the capacitor is coupled to the second terminal of the impedance. A second terminal of the capacitor is coupled to the second power rail.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: August 10, 2021
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Hua Chung, Tai-Jui Wang, Chieh-Wei Feng
  • Patent number: 11078259
    Abstract: The invention provides methods and compositions relating to molecular targets identified as being capable of increasing or decreasing thermogenic potential in cells, including preadipocytes. Included in the invention are methods and compositions relating to inhibiting or suppressing the activity of an uncoupling protein 1 (UCP1) negative regulator, such as cardiac actin 1 (ACTC1), somatostatin receptor 1 (SSTR1), FAT atypical cadherin 1 (FAT1), and protein tyrosine phosphatase receptor type B (PTPRB). Also included in the invention are methods and compositions relating to activating a UCP1 positive regulator, such as phosphatidylinositol-3,4,5-triphosphate-dependent Rac exchange factor 1 (PREX1), cortactin binding protein 2 (CTTNBP2), doublesex and mab-3-related transcription factor-like family A1 (DMRTA1), and endothelin receptor type B (ENDRB). The invention also provides methods and compositions relating to enrichment of cells having thermogenic potential based on cell surface markers, e.g.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: August 3, 2021
    Assignee: Joslin Diabetes Center, Inc.
    Inventors: Yu-Hua Tseng, Matthew Lynes, Ruidan Xue
  • Patent number: 11073459
    Abstract: Provided is a method for evaluating a pretreatment effect for organic solid waste based on fractal dimension, relating to biological conversion of organic solid waste. Samples of the organic solid waste are collected, and dried and broken up to obtain dried samples. The mixtures obtained are analyzed using a laser particle size analyzer, so as to measure a wave vector Q and a scattering intensity I of each of the mixtures. According to a fractal theory, the wave vector Q and the scattering intensity I obtained are analyzed using a data processing software to obtain a two-dimensional fractal dimension Df of each of the samples. Based on data from documents and experiments, a total organic carbon or an apparent activated energy is evaluated, so as to evaluate the pretreatment effects of samples of the organic solid waste.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: July 27, 2021
    Assignee: TONGJI UNIVERSITY
    Inventors: Xiaohu Dai, Yu Hua, Chen Cai, Shuxian Chen
  • Publication number: 20210224574
    Abstract: An electronic apparatus and an operating method thereof are provided. The electronic apparatus includes an optical fingerprint sensor and a processor. The optical fingerprint sensor is configured to obtain a fingerprint image. The processor is coupled to the optical fingerprint sensor and analyzes the fingerprint image to calculate at least one of a color pixel ratio and a light reflectance corresponding to the fingerprint image. The processor searches a background database according to at least one of the color pixel ratio and the light reflectance to obtain a background image. The processor corrects the fingerprint image according to the background image to obtain a corrected fingerprint image.
    Type: Application
    Filed: November 2, 2020
    Publication date: July 22, 2021
    Applicant: Egis Technology Inc.
    Inventors: Chen Yang, Kuan-Yi Lin, Chia-Wei Lin, Yu-Hua Lin
  • Publication number: 20210224514
    Abstract: An anti-counterfeiting method and a system for under-screen fingerprint identification are provided. A fingerprint sensing apparatus includes a display device and a fingerprint sensor, and the method includes the following steps. A fingerprint sensing image is captured for an object on the display device through the fingerprint sensor. The fingerprint sensing image is calibrated by using a color calibration parameter to generate a calibrated image. Whether the object is a real finger is determined by using an anti-counterfeiting algorithm and the calibrated image.
    Type: Application
    Filed: November 23, 2020
    Publication date: July 22, 2021
    Applicant: Egis Technology Inc.
    Inventors: Chen Yang, Kuan-Yi Lin, Chia-Wei Lin, Yu-Hua Lin
  • Publication number: 20210207074
    Abstract: A system for high-value utilization of organic solid waste includes an anaerobic digestion unit, a biogas measurement and collection unit and a methane purification and liquefaction unit. The anaerobic digestion unit includes an organic solid waste pretreatment system and an anaerobic digestion device. The biogas measurement and collection unit includes a gas flow meter and a high-pressure biogas collection device. The methane purification and liquefaction unit includes a high-pressure separation tank, a liquefaction pretreatment system, a heavy hydrocarbon and benzene removal device, a two-stage rectification system, a low-temperature pressure liquid storage tank device and a buffer storage tank. The organic solid waste undergoes an anaerobic digestion treatment to produce methane followed by collection, purification and liquefaction.
    Type: Application
    Filed: January 8, 2021
    Publication date: July 8, 2021
    Inventors: XIAOHU DAI, YU HUA, SHUXIAN CHEN, HUIPING LI, CHEN CAI
  • Patent number: 11053989
    Abstract: The present invention discloses a locking device, a power assembly, a power transmission system and a vehicle. The locking device includes: a first flange, the first flange being adapted to be fixed on the first shaft; a second flange, the second flange being adapted to be fixed on the second shaft; a synchronizing ring, the synchronizing ring being normally connected to the first flange to be adapted to rotate synchronously with the first flange, and the synchronizing ring being slidable relative to the first flange; and a driving component, the driving component selectively pushing the synchronizing ring to slide from an unlocked position to a locked position in an axial direction of the first flange. When the synchronizing ring is in the locked position, the synchronizing ring is connected to the second flange be adapted to rotate the second flange synchronously with the first flange. When the synchronizing ring is in the unlocked position, the synchronizing ring is separated from the second flange.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: July 6, 2021
    Inventors: Yanyan Zhu, Yu Hua, Jing Liu, Lingdao Chai, Jintao Zhang
  • Publication number: 20210193608
    Abstract: A manufacturing method of a circuit board element including the following steps is provided: placing a circuit substrate on a carrier, wherein the circuit substrate includes an insulating layer and a circuit layer disposed thereon, a protective layer disposed on the circuit layer and having a plurality of openings exposing thereof, and a plurality of solder balls disposed on the protective layer and embedded in the openings; forming a trench penetrating the circuit substrate to expose the carrier; forming a photoresist material layer to cover the circuit substrate and filling the spaces between each of the solder balls and the protective layer and is filling in the trench to cover the carrier; curing a portion of the photoresist material layer filled in the spaces to form a dielectric layer; removing a portion of the photoresist material layer filled in the trench to expose the carrier; and removing the carrier.
    Type: Application
    Filed: March 9, 2021
    Publication date: June 24, 2021
    Applicant: Unimicron Technology Corp.
    Inventors: Yu-Chung Hsieh, Chun-Hsien Chien, Yu-Hua Chen
  • Publication number: 20210172849
    Abstract: Provided is a method for evaluating a pretreatment effect for organic solid waste based on fractal dimension, relating to biological conversion of organic solid waste. Samples of the organic solid waste are collected, and dried and broken up to obtain dried samples. The mixtures obtained are analyzed using a laser particle size analyzer, so as to measure a wave vector Q and a scattering intensity I of each of the mixtures. According to a fractal theory, the wave vector Q and the scattering intensity I obtained are analyzed using a data processing software to obtain a two-dimensional fractal dimension Df of each of the samples. Based on data from documents and experiments, a total organic carbon or an apparent activated energy is evaluated, so as to evaluate the pretreatment effects of samples of the organic solid waste.
    Type: Application
    Filed: December 3, 2020
    Publication date: June 10, 2021
    Inventors: Xiaohu DAI, Yu HUA, Chen CAI, Shuxian CHEN
  • Publication number: 20210164877
    Abstract: Provided is a method for evaluating a bioavailability of organic solid waste by an anaerobic conversion based on fractal dimension, relating to anaerobic digestion of organic solid waste. Organic solid waste is broken up and dried, and the organic solid waste is analyzed using a laser particle size analyzer, so as to measure a wave vector Q and a scattering intensity I. The wave vector Q and the scattering intensity I are analyzed using a data processing software, and a two-dimensional fractal dimension Df is obtained based on a fractal theory. A volatile fatty acid maximum VFAmax and a biochemical methane potential BMP of the organic solid waste are predicted according to the two-dimensional fractal dimension Df, so as to evaluate a bioavailability of organic solid waste by an anaerobic conversion.
    Type: Application
    Filed: December 2, 2020
    Publication date: June 3, 2021
    Inventors: Xiaohu DAI, Yu HUA, Chen CAI
  • Publication number: 20210159191
    Abstract: A package structure includes a redistribution structure, a chip, one or more structural reinforcing elements, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The one or more structural reinforcing elements are disposed over the redistribution structure. The structural reinforcing element has a Young's modulus in a range of 30 to 200 GPa. The protective layer overlays the chip and a sidewall of the structural reinforcing element.
    Type: Application
    Filed: February 8, 2021
    Publication date: May 27, 2021
    Inventors: Pu-Ju LIN, Cheng-Ta KO, Yu-Hua CHEN, Tzyy-Jang TSENG, Ra-Min TAIN
  • Publication number: 20210121578
    Abstract: The present invention relates to a pulmonary surfactant-based anticancer drug. The anticancer drug encapsulated in a liposome made of a pulmonary surfactant can effectively target lung cancer cells, especially adenocarcinomas derived from type II alveolar cells, and has low toxicity and excellent structural stability.
    Type: Application
    Filed: May 17, 2019
    Publication date: April 29, 2021
    Inventors: Ji Ho PARK, Jiyoung LIM, Chan Hee OH, Daeho JUNG, Hyun Koo KIM, Yu Hua QUAN
  • Publication number: 20210127443
    Abstract: A mobile communication device including a Radio Frequency (RF) device and a controller is provided. The controller activates a predetermine Application (APP), and provides a Packet-Switched (PS) data service for the predetermined APP using a first subscriber identity via the RF device. Also, the controller establishes a Radio Resource Control (RRC) connection using a second subscriber identity via the RF device to enable the mobile communication device to enter an RRC connected mode after the predetermined APP is activated, and keeps the mobile communication device in the RRC connected mode associated with the second subscriber identity while providing the PS data service for the predetermined APP using the first subscriber identity.
    Type: Application
    Filed: October 24, 2019
    Publication date: April 29, 2021
    Inventors: Yu-Hua HUANG, Chin-Wei HSU
  • Patent number: 10983571
    Abstract: A display with a rotatable camera structure has a display region and includes a bezel with a lens and a rear cover connected to the bezel, and the rear cover has an opening. The bezel is disposed around the display region. The rotatable camera structure is between the bezel and the rear cover. The rotatable camera structure includes a dome holder, a camera and a dome cover. The dome holder with an opening is configured on the bezel and covers the lens. The camera is in the dome holder. The dome cover covers the opening of the dome holder, and the dome cover is connected to the camera through the opening of the dome holder. The dome cover has an angle adjustment structure exposed from the opening of the rear cover to adjust the filming angle of the camera for users.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: April 20, 2021
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Yu-Hsiang Lai, Chia-Chen Chen, Tse-Yu Wu, Chi-Zen Peng, Ching-Yu Hua
  • Patent number: 10957658
    Abstract: A package structure includes a redistribution structure, a chip, one or more structural reinforcing elements, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The one or more structural reinforcing elements are disposed over the redistribution structure. The structural reinforcing element has a Young's modulus in a range of 30 to 200 GPa. The protective layer overlays the chip and a sidewall of the structural reinforcing element.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: March 23, 2021
    Assignee: UNIMICRON TECHNOLOGY CORP.
    Inventors: Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, Ra-Min Tain
  • Publication number: 20210082810
    Abstract: A package substrate includes a substrate, an insulating protective layer and an interposer. The substrate has a first surface and a second surface opposing to the first surface. The substrate includes a plurality of first conductive pads embedded in the first surface. The insulating protective layer is disposed on the first surface of the substrate. The insulating protective layer has an opening for exposing the first conductive pads embedded in the first surface of the substrate. The interposer has a top surface and a bottom surface opposing to the top surface. The interposer includes a plurality of conductive vias and a plurality of second conductive pads located on the bottom surface. The interposer is located in a recess defined by the opening of the insulating protective layer and the first surface of the substrate. Each of the second conductive pads is electrically connected to corresponding first conductive pad.
    Type: Application
    Filed: November 12, 2020
    Publication date: March 18, 2021
    Applicants: Industrial Technology Research Institute, Unimicron Technology Corp.
    Inventors: Yu-Hua Chen, Wei-Chung Lo, Tao-Chih Chang, Yu-Min Lin, Sheng-Tsai Wu
  • Patent number: 10950687
    Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: March 16, 2021
    Assignee: Unimicron Technology Corp.
    Inventors: Yu-Hua Chen, Fu-Yang Chen, Chun-Hsien Chien, Chien-Chou Chen, Wei-Ti Lin
  • Patent number: D920174
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: May 25, 2021
    Assignee: Gogoro Inc.
    Inventors: Hsun-Hsueh Lin, Ting-Ping Ku, Yu-Hua Chen, Liang-Yi Hsu