Patents by Inventor Yu-Huan Liu

Yu-Huan Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10572333
    Abstract: A method for diagnosing faults in products of one type includes determining a fault type of the products and all of the underlying reasons for the fault which correspond to the fault type. A probability of each underlying reason is calculated and a decision tree is constructed, a root node of the decision tree being the determined fault type and all the underlying reasons being child nodes of the root node. When the decision tree is solved, the underlying reasons for the fault of that type of product can be presented.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: February 25, 2020
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Xin Lu, Huan-Huan Zhang, Hui-Feng Liu, Yu-Yong Zhang
  • Publication number: 20200010759
    Abstract: The present invention relates to novel phosphor mixtures and to a light-emitting device which comprises at least one of the novel phosphor mixtures. The phosphor mixtures can be used in phosphor-converted LEDs with a semiconductor that emits in the violet spectral region. The present invention furthermore relates to a lighting system which may comprise the light-emitting devices according to the invention, and to a dynamic lighting system. The present invention furthermore relates to a process for the preparation of the phosphor mixtures according to the invention and to the use thereof in light-emitting devices for use in general lighting and/or in specialty lighting.
    Type: Application
    Filed: March 5, 2018
    Publication date: January 9, 2020
    Applicant: MERCK PATENT GMBH
    Inventors: Andreas BENKER, Ralf PETRY, Ingo KOEHLER, Irene (Yu Huan) LIU, Christof HAMPEL, Aleksander ZYCH
  • Publication number: 20200013869
    Abstract: A semiconductor device has a semiconductor substrate with a dielectric layer disposed thereon. A trench is defined in the dielectric layer. A metal gate structure is disposed in the trench. The metal gate structure includes a first layer and a second layer disposed on the first layer. The first layer extends to a first height in the trench and the second layer extends to a second height in the trench; the second height is less than the first height.
    Type: Application
    Filed: September 16, 2019
    Publication date: January 9, 2020
    Inventors: Yu-Lien HUANG, Chi-Wen LIU, Clement Hsingjen WANN, Ming-Huan TSAI, Zhao-Cheng CHEN
  • Publication number: 20190363973
    Abstract: A system and method for ensuring reliable network communication for a multi-node server is disclosed. The multi-node server includes a first node having a port operable to transmit data packets. A first internal switch has a downstream port coupled to the port of the first node, an interconnection port, and uplink ports coupled to the network. The uplink ports routes data packets from the first node to the network. A second internal switch has a downstream port, an interconnection port coupled to the interconnection port of the first internal switch, and an uplink port coupled to the network. On failure of network communication at the uplink ports of the first internal switch, data packets from the first node are routed through the interconnection ports and through the uplink port of the second internal switch to the network.
    Type: Application
    Filed: September 21, 2018
    Publication date: November 28, 2019
    Inventors: Meng-Huan HSIEH, Yu-Jung CHANG, Te-Kuai LIU
  • Patent number: 10418456
    Abstract: A method of forming a semiconductor device having a semiconductor substrate with a dielectric layer disposed thereon. A trench is defined in the dielectric layer. A metal gate structure is formed in the trench. The metal gate structure includes a first layer and a second layer disposed on the first layer. The first layer extends to a first height in the trench and the second layer extends to a second height in the trench; the second height is greater than the first height. In some embodiments, the second layer is a work function metal and the first layer is a dielectric. In some embodiments, the second layer is a barrier layer.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: September 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Lien Huang, Chi-Wen Liu, Clement Hsingjen Wann, Ming-Huan Tsai, Zhao-Cheng Chen
  • Publication number: 20190200002
    Abstract: A 3D depth image acquiring method and apparatus, and an image acquisition device are provided. The method is applied to an image acquisition device comprising a VIS-NIR picture sensor and an infrared structured light projection component. The VIS-NIR picture sensor comprises a plurality of dot matrix units each having a blue light photosensitive component, a green light photosensitive component, a red light photosensitive component and an NIR photosensitive component distributed thereon. The method comprises: controlling the blue light photosensitive component, the green light photosensitive component, the red light photosensitive component, the NIR photosensitive component and the infrared structured light projection component to operate, to obtain an optimum NIR image and an optimum VIS image; and processing the optimum VIS image and a depth image which is obtained by performing calculation on the optimum NIR image using a 3D depth mode, to obtain a 3D depth image.
    Type: Application
    Filed: November 27, 2018
    Publication date: June 27, 2019
    Inventors: Hao-Che Liu, Liu-Yuh Lin, Liang-Chih Weng, Tzu-Huan Cheng, Chen-Hsin Wu, Chien-Chun Liu, Chien-Yao Huang, Leon A. Chiu, Sau-Mou Wu, Ti-Hsien Tai, Yu-Hsiang Pan
  • Publication number: 20190199942
    Abstract: A living organism image monitoring system is provided, relating to the technical field of medical equipment. The living organism image monitoring system comprises a display module, a processor and a CIGS chip, the CIGS chip, the processor and the display module being electrically connected, the CIGS chip being used for detecting a near infrared light signal of a living organism and generating a current signal after having detected the near infrared light signal, the processor being used for generating a first pulse signal according to the current signal, and the display module being used for displaying an image according to the first pulse signal. The living organism image monitoring system provided by the present disclosure has the advantages of being capable of synchronously transmitting the images of a living organism to the display module for display and enabling the images to be clearer.
    Type: Application
    Filed: November 6, 2018
    Publication date: June 27, 2019
    Inventors: Chien-Chun LIU, Liu-Yuh LIN, Liang-Chih WENG, Tzu-Huan CHENG, Chen-Hsin WU, Hao-Che LIU, Chien-Yao HUANG, Leon A CHIU, Sau-Mou WU, Ti-Hsien TAI, Yu-Hsiang PAN
  • Patent number: 9279081
    Abstract: A phosphor composition and a white light emitting device using the same are disclosed. The white light emitting device includes a blue light emitting diode and a phosphor composition disposed on the blue light emitting diode, wherein the phosphor composition includes a yellow lanthanum silicon nitride, a yellow ?-SiAlON and a red CaAlSiN, and the weight proportion of the yellow lanthanum silicon nitride, the yellow ?-SiAlON and the red CaAlSiN is 1: 1:0.3˜0.45.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: March 8, 2016
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Yao-Yu Yang, Yu-Huan Liu
  • Patent number: 8604510
    Abstract: A light-emitting diode (LED) and manufacturing method thereof are disclosed. The LED includes a transparent substrate, a plurality of transparent conductive layers, a plurality of metal circuits, and a LED chip. The LED chip is suitable for emitting a light and a portion of the light emits toward the transparent substrate. The manufacturing method of LED includes the following steps. First, a transparent conductive layer is formed on the transparent substrate. Next, a conductive pattern is formed by etching transparent conductive layer. The intersection metal circuit is formed by disposing the metal on a portion of the transparent conductive layer. Finally, the LED chip is disposed on the metal circuit so that the LED chip is electrically connected to the metal circuit.
    Type: Grant
    Filed: October 11, 2012
    Date of Patent: December 10, 2013
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Ssu-Yuan Weng, Yu-Huan Liu
  • Patent number: 8431948
    Abstract: A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: April 30, 2013
    Assignee: Everlight Electronics Co., Ltd.
    Inventor: Yu-Huan Liu
  • Patent number: 8389307
    Abstract: A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: March 5, 2013
    Assignee: Everlight Electronics Co., Ltd.
    Inventor: Yu-Huan Liu
  • Publication number: 20130045603
    Abstract: A semiconductor process is described as follows. A material layer is provided on a substrate. A low-temperature oxidation treatment is performed to the material layer. A photoresist layer is formed on the material layer after the low-temperature oxidation treatment. The photoresist layer is patterned.
    Type: Application
    Filed: August 19, 2011
    Publication date: February 21, 2013
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chao-Yu Tsai, Chih-Chung Huang, Tsz-Yuan Chen, Kung-Hsun Tsao, Huan-Hsin Yeh, Yu-Huan Liu
  • Publication number: 20130032850
    Abstract: A light-emitting diode (LED) and manufacturing method thereof are disclosed. The LED includes a transparent substrate, a plurality of transparent conductive layers, a plurality of metal circuits, and a LED chip. The LED chip is suitable for emitting a light and a portion of the light emits toward the transparent substrate. The manufacturing method of LED includes the following steps. First, a transparent conductive layer is formed on the transparent substrate. Next, a conductive pattern is formed by etching transparent conductive layer. The intersection metal circuit is formed by disposing the metal on a portion of the transparent conductive layer. Finally, the LED chip is disposed on the metal circuit so that the LED chip is electrically connected to the metal circuit.
    Type: Application
    Filed: October 11, 2012
    Publication date: February 7, 2013
    Applicant: EVERLIGHT ELECTRONICS CO., LTD.
    Inventors: Ssu-Yuan Weng, Yu-Huan Liu
  • Publication number: 20120168804
    Abstract: A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression.
    Type: Application
    Filed: March 7, 2012
    Publication date: July 5, 2012
    Applicant: EVERLIGHT ELECTRONICS CO., LTD.
    Inventor: Yu-Huan Liu
  • Patent number: 8154033
    Abstract: A light emitting diode (LED) device including a transparent substrate, a plurality of LED chips, a circuit, and a transparent encapsulant is provided. The LED chips are fixed on the transparent substrate, and utilized for radiating at least a light beam. The circuit is disposed on the transparent substrate and electrically connected to the LED chips. The transparent encapsulant is utilized for packaging the LED chips. The light beam of the LED chips can propagate from two opposite sides of the transparent substrate. Blue LED chips and the circuit of the transparent substrate can be directly soldered, and the phosphors are arranged to convert the wavelength of blue light, so a dual-side white light emitting device can therefore be provided.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: April 10, 2012
    Assignee: Everlight Electronics Co., Ltd.
    Inventor: Yu-Huan Liu
  • Patent number: 7965028
    Abstract: A white-light emitting device comprises a substrate, a short wavelength light source, a protective layer, a first structure, and a second structure. The short wavelength light source is disposed on the substrate for generating a first light, and the protective layer covering the short wavelength light source is pervious to the first light. The first structure is disposed on the protective layer for generating a second light, in which the first structure includes a first quantum well and a transmission layer. The second structure is disposed on the first structure for generating a third light. Finally, the first light, the second light, and the third light are mixed to generate a white light.
    Type: Grant
    Filed: April 21, 2008
    Date of Patent: June 21, 2011
    Assignee: Au Optronics Corporation
    Inventors: Yu-Huan Liu, Chieh-Hsiu Lin, Chih-Lin Wang, Yun-Yi Tien
  • Publication number: 20110121349
    Abstract: A light-emitting diode (LED) and manufacturing method thereof are disclosed. The LED includes a transparent substrate, a plurality of transparent conductive layers, a plurality of metal circuits, and a LED chip. The LED chip is suitable for emitting a light and a portion of the light emits toward the transparent substrate. The manufacturing method of LED includes the following steps. First, a transparent conductive layer is formed on the transparent substrate. Next, a conductive pattern is fromed by etching transparent conductive layer. The intersection metal circuit is formed by disposing the metal on a portion of the transparent conductive layer. Finally, the LED chip is disposed on the metal circuit so tat the LED chip is electrically connected to the metal circuit.
    Type: Application
    Filed: May 17, 2010
    Publication date: May 26, 2011
    Applicant: EVERLIGHT ELECTRONICS CO., LTD.
    Inventors: Szu-Yuan Weng, Yu-Huan Liu
  • Publication number: 20100264429
    Abstract: A light emitting device and an electronic device using the same are provided. The light emitting device includes a light emitting chip having a wavelength between 460 nm and 650 nm and phosphor powders, in which the phosphor powders can be stimulated by light emitted from the chip to emit light with a wavelength between 700 nm and 1200 nm. The phosphor powders are selected from the group consisting of Cu-doped CdS, Cu-doped SeS, Cu-doped CdTe and combinations thereof.
    Type: Application
    Filed: October 26, 2009
    Publication date: October 21, 2010
    Applicant: EVER LIGHT ELECTRONICS CO., LTD.
    Inventor: Yu-Huan Liu
  • Publication number: 20100193816
    Abstract: A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression.
    Type: Application
    Filed: October 26, 2009
    Publication date: August 5, 2010
    Applicant: EVERLIGHT ELECTRONICS CO., LTD.
    Inventor: Yu-Huan Liu
  • Publication number: 20100163892
    Abstract: A light emitting diode (LED) device including a transparent substrate, a plurality of LED chips, a circuit, and a transparent encapsulant is provided. The LED chips are fixed on the transparent substrate, and utilized for radiating at least a light beam. The circuit is disposed on the transparent substrate and electrically connected to the LED chips. The transparent encapsulant is utilized for packaging the LED chips. The light beam of the LED chips can propagate from two opposite sides of the transparent substrate. Blue LED chips and the circuit of the transparent substrate can be directly soldered, and the phosphors are arranged to convert the wavelength of blue light, so a dual-side white light emitting device can therefore be provided.
    Type: Application
    Filed: December 29, 2009
    Publication date: July 1, 2010
    Inventor: Yu-Huan Liu