Patents by Inventor Yu-Huang Peng

Yu-Huang Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080105413
    Abstract: A porous microchannel structure adopts a first casing and a second casing to form a water block. Water inlet and outlet pipes are extended from both ends of the first casing respectively. The second casing has a porous microchannel structure made by sintering a heat conducting powder and formed on an internal side of the second casing. The second casing has a contact surface on its external side for absorbing and conducting a heat source to the porous microchannel structure, such that a coolant can flow from the water inlet pipe into the water block. The porous microchannel structure produces turbulent flows to the coolant, so as to extend the staying time of the coolant in the water block, and allow the coolant to fully exchange heat with the porous microchannel structure and flow out from the water outlet pipe.
    Type: Application
    Filed: January 9, 2008
    Publication date: May 8, 2008
    Inventor: Yu-Huang PENG
  • Publication number: 20080041480
    Abstract: A buffering means for a water-cooling system is capable of buffering the volume expansion and pressure generated by heating a cooling liquid. The buffering means includes a tube that is formed into a rectangular pillar. The surfaces on both ends of the tube are provided with an inlet and an outlet respectively. The tube is provided thereon with a plurality of side faces. Each of the side face is provided with a metallic sheet that is recessed toward the interior of the tube under normal temperature. When the cooling liquid absorbs heat via a heat-exchanging action, the volume of the cooling liquid expands due to the increase in temperature.
    Type: Application
    Filed: July 19, 2007
    Publication date: February 21, 2008
    Inventor: Yu-Huang PENG
  • Publication number: 20080024990
    Abstract: A water block heat-dissipating structure includes a first cover body, a second cover body, and a hollow seat body. The first cover body has a first board body and a plurality of first heat-dissipating fins formed on the first board body. The second cover body has a second board body, a plurality of second heat-dissipating fins formed on the second board body, and at least one water inlet and at least one water outlet respectively penetrated through the second board body, wherein the first heat-dissipating fins and the second heat-dissipating fins are alternate each other. The hollow seat body is sealed and disposed between the first board body and the second board body for completely sealing the first heat-dissipating fins and the second heat-dissipating fins.
    Type: Application
    Filed: July 31, 2006
    Publication date: January 31, 2008
    Inventors: Yu-Huang Peng, Yi-Shen Chien
  • Publication number: 20070209784
    Abstract: A water-cooling heat dissipation device includes a water block and a pump communicated with the water block and having cooling liquid therein. The water-cooling includes a casing and a metal panel, where the casing includes a hollow and closed cavity, a water inlet and a water outlet outside the casing and communicated with the cavity. The metal panel includes a plurality of continuously-bent heat-dissipating plates, a heat-dissipating channel defined between two adjacent heat-dissipating plates, one end of the heat-dissipating plate is attached to bottom of the cavity of the casing. Therefore, the heat-dissipating plate has more contact area with the cooling liquid in a limited space to increase heat exchange effect.
    Type: Application
    Filed: February 6, 2007
    Publication date: September 13, 2007
    Inventor: Yu-Huang Peng
  • Publication number: 20070124934
    Abstract: In a water block and its manufacturing method, a porous microchannel structure adopts a first casing and a second casing to form a water block. Water inlet and outlet pipes are extended from both ends of the first casing respectively. The second casing has a porous microchannel structure made by sintering a heat conducting powder and formed on an internal side of the second casing. The second casing has a contact surface on its external side for absorbing and conducting a heat source to the porous microchannel structure, such that a coolant can flow from the water inlet pipe into the water block. The porous microchannel structure produces turbulent flows to the coolant, so as to extend the staying time of the coolant in the water block, and allow the coolant to fully exchange heat with the porous microchannel structure and flow out from the water outlet pipe.
    Type: Application
    Filed: October 16, 2006
    Publication date: June 7, 2007
    Inventor: Yu-Huang Peng
  • Publication number: 20070107873
    Abstract: A water-cooling head and a method for making the same. A first cover and a second cover form a water-cooling head. An intake pipe and a drainpipe extend from both ends of the first cover. A plurality of heat-conducting particles is fixedly provided inside of the second cover and irregularly stacks to form a flowing path microstructure. The outside of the second cover has a contacting surface for absorbing the heat generated by the heat source and conducting the heat to the heat-conducting particles. When the cooling liquid enters the water-cooling head via the intake pipe, the flowing path microstructure disturbs the flow of the cooling liquid to prolong the staying time of the cooling liquid within the water-cooling head. In this way, the cooling liquid can be sufficiently heat-exchanged with the heat-conducting particles and then drains out from the drainpipe.
    Type: Application
    Filed: September 11, 2006
    Publication date: May 17, 2007
    Inventor: Yu-Huang Peng
  • Publication number: 20070107874
    Abstract: A water cooling type heat dissipation apparatus includes a heat dissipation stage having an upper cover and a lower cover. A first passageway and a second passageway extend from two ends of the upper cover. The upper cover includes a concave on inner side thereof. The lower cover includes a contact face and a heat conduction post arranged on inner bottom side of the lower cover. A plurality of heat dissipation fins is arranged on the heat conduction post and separated to each other to define parallel runners therebetween. Heat from heat source is absorbed by the contact face and conducted to the heat conduction fins through the heat conduction post. Liquid coolant flows into the parallel runners through the first passageway and resisted by the heat conduction post. Therefore, liquid coolant has sufficient heat exchange with the heat conduction fins and then exits through the second passageway.
    Type: Application
    Filed: September 19, 2006
    Publication date: May 17, 2007
    Inventor: Yu-Huang Peng