Patents by Inventor Yu-Huei Jiang

Yu-Huei Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip-on-film package structure and display device
    Patent number: 10692807
    Abstract: A chip-on-film (COF) package structure includes a first COF and a second COF. The first COF includes a first flexible substrate having a first external terminal and a first internal terminal opposite to each other, first outer leads disposed at the first external terminal, first inner leads disposed at the first internal terminal, and a first chip disposed between the first external terminal and the first internal terminal. The second COF includes a second flexible substrate having a second external terminal and a second internal terminal opposite to each other, second outer leads disposed at the second external terminal, second inner leads disposed at the second internal terminal, and a second chip disposed between the second external terminal and the second internal terminal. The first COF is partially overlapped with the second COF. A display device having the COF package structure is also provided.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: June 23, 2020
    Assignee: Au Optronics Corporation
    Inventors: Chang-Hui Wu, Yu-Huei Jiang, Hsiao-Chung Cheng
  • CHIP-ON-FILM PACKAGE STRUCTURE AND DISPLAY DEVICE
    Publication number: 20200152553
    Abstract: A chip-on-film (COF) package structure includes a first COF and a second COF. The first COF includes a first flexible substrate having a first external terminal and a first internal terminal opposite to each other, first outer leads disposed at the first external terminal, first inner leads disposed at the first internal terminal, and a first chip disposed between the first external terminal and the first internal terminal. The second COF includes a second flexible substrate having a second external terminal and a second internal terminal opposite to each other, second outer leads disposed at the second external terminal, second inner leads disposed at the second internal terminal, and a second chip disposed between the second external terminal and the second internal terminal. The first COF is partially overlapped with the second COF. A display device having the COF package structure is also provided.
    Type: Application
    Filed: February 26, 2019
    Publication date: May 14, 2020
    Applicant: Au Optronics Corporation
    Inventors: Chang-Hui Wu, Yu-Huei Jiang, Hsiao-Chung Cheng
  • Method for forming extended gate field effect transistor (EGFET) based sensor and the sensor therefrom
    Patent number: 8133750
    Abstract: The invention provides a method for forming an extended gate field effect transistor (EGFET) based sensor, including: (a) providing a substrate; (b) forming a sensing film including titanium dioxide, ruthenium doped titanium dioxide or ruthenium oxide on the substrate; and (c) forming a conductive wire extended from the sensing film for external contact.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: March 13, 2012
    Assignee: National Yunlin University of Science and Technology
    Inventors: Jung-Chuan Chou, Cheng-Wei Chen, Yu-Huei Jiang
  • METHOD FOR FORMING EXTENDED GATE FIELD EFFECT TRANSISTOR (EGFET) BASED SENSOR AND THE SENSOR THEREFROM
    Publication number: 20090278175
    Abstract: The invention provides a method for forming an extended gate field effect transistor (EGFET) based sensor, including: (a) providing a substrate; (b) forming a sensing film including titanium dioxide, ruthenium doped titanium dioxide or ruthenium oxide on the substrate; and (c) forming a conductive wire extended from the sensing film for external contact.
    Type: Application
    Filed: December 23, 2008
    Publication date: November 12, 2009
    Applicant: NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Jung-Chuan Chou, Cheng-Wei Chen, Yu-Huei Jiang