Abstract: The present invention relates to a package structure and method for manufacturing the same. The package structure can minimize the area of the circuit board used for packaging, by stacking a passive element directly on a chip. The disclosed package structure comprises: a circuit board having a first surface, where a plurality of first connecting pads being disposed thereon; a chip unit having an active surface, a non-active surface and a plurality of conductive vias, while a plurality of second connecting pads and a plurality of electric pads being disposed on the active surface, and a plurality of third connecting pads being disposed on the non-active surface; a plurality of solder balls electrically connected with the first connecting pads and the second connecting pads; and a passive element being electrically connected with the third connecting pads. The passive element and the chip unit both electrically connect to the chip unit.

Abstract: The present invention relates to a Single Inductor Double Output (SIDO) power converter, which comprises a power-stage circuit, a current detector, a slope compensation device, at least two error amplifiers, a comparing unit, a mode exchange circuit, a logical device and a driver. The SIDO current converter achieves an optimal SIDO power converting efficiency by controlling a full-current mode. Furthermore, different power transferring modes, under a variety of loadings, are used to address the issue of cross regulation and at meanwhile solving output voltage ripples and transient response to ensure the SIDO power converter a more flexible usage environment and better output performance.

Abstract: A voltage converting circuit including a power stage, a filter, a comparator, a first and a second feedback units. The power stage receives an input voltage and outputs the input voltage according to a duty cycle. The filter receives the input voltage to convert the input voltage into a current, and filters the current to obtain an output voltage. The first feedback unit amplifies a difference between a reference voltage and the output voltage to obtain an error voltage. The second feedback unit calculates the quadratic differential and integration of the output voltage to obtain a sensing voltage. The comparator compares the error voltage and the sensing voltage, and outputs a comparing result to adjust a duty ratio. Herein, a ripple of the output voltage is linearly proportional to that of the current, and DC divided voltage level of the output voltage is substantially equal to the reference voltage.

Abstract: A voltage converting circuit including a power stage, a filter, a comparator, a first and a second feedback units. The power stage receives an input voltage and outputs the input voltage according to a duty cycle. The filter receives the input voltage to convert the input voltage into a current, and filters the current to obtain an output voltage. The first feedback unit amplifies a difference between a reference voltage and the output voltage to obtain an error voltage. The second feedback unit calculates the quadratic differential and integration of the output voltage to obtain a sensing voltage. The comparator compares the error voltage and the sensing voltage, and outputs a comparing result to adjust a duty ratio. Herein, a ripple of the output voltage is linearly proportional to that of the current, and DC divided voltage level of the output voltage is substantially equal to the reference voltage.

Abstract: A voltage conversion apparatus includes a DC-to-DC conversion circuit, a sensing circuit, and a compensation circuit. The voltage conversion apparatus is capable of adaptively adjusting the system bandwidth according to the load. The system bandwidth is increased to make the converted voltage responding to the load rapidly when the voltage conversion apparatus is operated at a transient state; and the system bandwidth is decreased to increase the system stability when the voltage conversion circuit is operated at a steady state.