Patents by Inventor Yu-Hui Chien

Yu-Hui Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11977423
    Abstract: Methods and systems for thermal management of hardware resources that may be used to provide computer implemented services are disclosed. The disclosed thermal management method and systems may improve the likelihood of data processing systems providing desired computer implemented services by improving the thermal management of the hardware resources without impairment of storage devices. To improve the likelihood of the computer implemented services being provided, the systems may proactively identify whether storage devices subject to impairment due to dynamic motion are present. If such storage devices are present, then the system may automatically take action to reduce the likelihood of the storage devices being subject to dynamic motion sufficient to impair their operation.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: May 7, 2024
    Assignee: Dell Products L.P.
    Inventors: Hung-Pin Chien, Jyh-Yinn Lin, Yu-Wei Chi Liao, Chien Yen Hsu, Ming-Hui Pan
  • Patent number: 11912006
    Abstract: A continuous manufacturing equipment of an elastic three-dimensional fabric and a continuous manufacturing method thereof are disclosed. The continuous manufacturing equipment includes: a film conveying device having a thermal melting film and a conveying mechanism; a cutting device used for cutting a plurality of cutting gaps on the thermal melting film; a first fabric laminating device adhering an outer fabric on one surface of the thermal melting film; and a second fabric laminating device adhering an elastic fabric on another surface of the thermal melting film in a manner of elastically stretching and then elastically recovering. As such, effects of automatic, continuous, and simple steps in manufacturing and having a high yield rate are provided.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: February 27, 2024
    Assignee: TAIWAN TEXTILE FEDERATION, R.O.C.
    Inventors: Shu-Hui Huang, Hung-Kung Chien, Yu-Han Tsai
  • Patent number: 6900982
    Abstract: A multipurpose memory card connector includes an electrically insulative housing defining a front-open receiving open chamber, the housing having a first set of terminals disposed at the rear side inside and second and third sets of terminals disposed near the front open side of the receiving open chamber, and a slide slidably mounted inside the receiving open chamber, the slide having a first stop face disposed at a rear bottom side thereof and second and third stop faces respectively spaced from the first stop face at a distance adapted to receive insertion force from one of a number of memory cards for enabling the slide to be moved in the receiving open chamber at a distance subject to the type of the memory card being inserted into the receiving open chamber.
    Type: Grant
    Filed: October 29, 2003
    Date of Patent: May 31, 2005
    Assignee: Teconn Electronics Inc.
    Inventors: Cheng-Tsai Chang, Chun-Chih Huang, Yu-Hui Chien, Yi-Fen Huang
  • Publication number: 20050094364
    Abstract: A multipurpose memory card connector includes an electrically insulative housing defining a front-open receiving open chamber, the housing having a first set of terminals disposed at the rear side inside and second and third sets of terminals disposed near the front open side of the receiving open chamber, and a slide slidably mounted inside the receiving open chamber, the slide having a first stop face disposed at a rear bottom side thereof and second and third stop faces respectively spaced from the first stop face at a distance adapted to receive insertion force from one of a number of memory cards for enabling the slide to be moved in the receiving open chamber at a distance subject to the type of the memory card being inserted into the receiving open chamber.
    Type: Application
    Filed: October 29, 2003
    Publication date: May 5, 2005
    Applicant: Teconn Electronics Inc.
    Inventors: Cheng-Tsai Chang, Chun-Chih Huang, Yu-Hui Chien, Yi-Fen Huang