Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A wafer container includes a frame, a door and at least a pair of shelves. The frame has opposite sidewalls. The pair of the shelves are respectively disposed and aligned on the opposite sidewalls of the frame. Various methods and devices are provided for holding at least one wafer to the shelves during transport.

Abstract: A wearable positioning device includes an inertial sensor, a storage device and a processor. The inertial sensor senses an acceleration signal and an angular velocity signal. The storage device stores a previous positioning signal and a current coordinate. The processor is electrically connected to the inertial sensor and the storage device. A wearable positioning method is executed by the processor, which includes: determining whether the wearable positioning device is in one of an under-water mode and an above-water mode according to a pressure sensing signal; calculating, when in the under-water mode, a current acceleration and a current direction according to the acceleration signal, the angular velocity signal, and a swimming posture signal representing a swimming posture; and calculating a current positioning signal according to the current acceleration, the current direction and the previous positioning signal, and updating the current coordinate with the current positioning signal.

Abstract: A wearable positioning device includes an inertial sensor, a storage device and a processor. The inertial sensor senses an acceleration signal and an angular velocity signal. The storage device stores a previous positioning signal and a current coordinate. The processor is electrically connected to the inertial sensor and the storage device. A wearable positioning method is executed by the processor, which includes: determining whether the wearable positioning device is in one of an under-water mode and an above-water mode according to a pressure sensing signal; calculating, when in the under-water mode, a current acceleration and a current direction according to the acceleration signal, the angular velocity signal, and a swimming posture signal representing a swimming posture; and calculating a current positioning signal according to the current acceleration, the current direction and the previous positioning signal, and updating the current coordinate with the current positioning signal.