Abstract: A projection apparatus is provided. The projection apparatus includes a light-emitting unit array, an optical sensor, and a control unit. The light-emitting unit array is for emitting an image beam. The optical sensor is for detecting electromagnetic waves so as to generate a signal. The control unit is electrically coupled to the light-emitting unit array and the optical sensor for controlling emission of the light-emitting unit array according to the signal from the optical sensor.

Abstract: A projection apparatus is provided. The projection apparatus includes a light-emitting unit array, an optical sensor, and a control unit. The light-emitting unit array is for emitting an image beam. The optical sensor is for detecting electromagnetic waves so as to generate a signal. The control unit is electrically coupled to the light-emitting unit array and the optical sensor for controlling emission of the light-emitting unit array according to the signal from the optical sensor.

Abstract: A light-emitting unit array includes a plurality of light-emitting units arranged and integrated monolithically in an array, and each of the light-emitting units includes a first doped type layer, a second doped type layer, a light-emission layer, and a photonic crystal structure. The light emission layer is disposed between the first doped type layer and the second doped type layer, wherein the second doped type layer has a surface facing away from the light emission layer. The photonic crystal structure is disposed on the surface of the second doped type layer.

Abstract: A flexible electronic assembly including a flexible circuit board and at least one electronic component is provided. The flexible circuit board includes at least one dielectric film layer and at least one patterned conductive layer disposed on the dielectric film layer. The electronic component is disposed on the flexible circuit board and electrically connected to the flexible circuit board. The flexible angle of the flexible electronic assembly is greater than 5 degrees.

Abstract: A projection display chip comprises a micro light emitting array comprising a plurality of micro LEDs, a micro collimation array comprising a plurality of micro collimation devices, and a projection micro lens array comprising a plurality of micro lenses. Each micro LED has a corresponding driving circuit device. The plurality of micro lenses has different optical axes to enlarge projected images.

Abstract: A flexible electronic assembly including a flexible circuit board and at least one electronic component is provided. The flexible circuit board includes at least one dielectric film layer and at least one patterned conductive layer disposed on the dielectric film layer. The electronic component is disposed on the flexible circuit board and electrically connected to the flexible circuit board. The flexible angle of the flexible electronic assembly is greater than 5 degrees.

Abstract: A component for the inkjet print head and the manufacturing method thereof are disclosed where photosensitive polymer is used as the substrate. Orifices and ink chambers are made on the substrate by photolithography. Conductive traces for interconnection to a print head chip are integrated to the substrate by combining photolithography and electroforming procedures.

Abstract: A component for the inkjet print head and the manufacturing method thereof are disclosed where photosensitive polymer is used as the substrate. Orifices and ink chambers are made on the substrate by photolithography. Conductive traces for interconnection to a print head chip are integrated to the substrate by combining photolithography and electroforming procedures.