Abstract: An electric heating material processing device includes a material transporting module, a material feeding controller, a material discharging controller, a gas vent, and an electric heating thermal desorption device. The material transporting module has a material inlet and a material outlet. The material feeding controller is connected to the material inlet, and is configured to control a feeding quantity and a feeding speed of the materials. The material discharging controller is connected to the material outlet, and is configured to control a discharging quantity and a discharging speed of the materials. The gas vent is disposed on an end of the material transporting module. The electric heating thermal desorption device is disposed on an outer surface of the material transporting module, and is configured to perform a thermal desorption process on the materials. The electric heating thermal desorption device includes an electric heating acceptor and plural electric heaters.

Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: Two types of blue light blocking contact lenses are provided and are formed by curing different compositions. The first composition includes a blue light blocking component formed by mixing or reacting a first hydrophilic monomer and a yellow dye, a first colored dye component formed by mixing or reacting a second hydrophilic monomer and a first colored dye, at least one third hydrophilic monomer, a crosslinker, and an initiator. The first colored dye includes a green dye, a cyan dye, a blue dye, an orange dye, a red dye, a black dye, or combinations thereof. The second composition includes a blue light blocking component, at least one hydrophilic monomer, a crosslinker, and an initiator. The blue light blocking component is formed by mixing or reacting glycerol monomethacrylate and a yellow dye. Further, methods for preparing the above contact lenses are provided.

Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.

Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: An external power supply system for spindles is revealed. The external power supply system includes a tool holder, a rectifier circuit, an overvoltage protection circuit. and a buck/boost converter. The tool holder receives an external power source of a spindle while the rectifier circuit converts the external power source into a rectified output signal with a power factor through step-down transformation. The overvoltage protection circuit is used to check whether the rectified output signal is larger than an overvoltage signal for outputting an operating potential or a non-operating potential. The buck/boost converter is used for receiving the rectified output signal with the power factor and converting the rectified output signal to an output voltage according to the power factor. Then the output voltage is provided to a load of a low voltage power supply, a high voltage power supply, or a constant voltage power supply.

Abstract: The subject application relates to a server, terminal and non-transitory computer-readable medium. The server for handling streaming data for a live streaming, comprising one or a plurality of processors, wherein the one or plurality of processors execute a machine-readable instruction to perform: recording the streaming data for the live streaming; storing the streaming data as archive contents with first identifier; receiving interaction information during the live streaming; storing the interaction information as contexts with second identifier, transmitting the archive contents with first identifier to a first user terminal; and transmitting the contexts to the first user terminal according to the first identifier and the second identifier. According to the subject application, the archive contents may be more immersive and the user experience may be enhanced.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A semiconductor device according to embodiments of the present disclosure includes a first die including a first bonding layer and a second die including a second hybrid bonding layer. The first bonding layer includes a first dielectric layer and a first metal coil embedded in the first dielectric layer. The second bonding layer includes a second dielectric layer and a second metal coil embedded in the second dielectric layer. The second hybrid bonding layer is bonded to the first hybrid bonding layer such that the first dielectric layer is bonded to the second dielectric layer and the first metal coil is bonded to the second metal coil.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A power-on method for a server device includes generating a stand-by power to a server module of the server device when a blade enable signal is asserted; asserting, by the server module, a power-on signal to a storage module of the server device; performing, by the storage module, a first boot-on process when the storage module receives the asserted power-on signal; transmitting, by the storage module, an asserted ready signal to the server module when the first boot-on process finishes; and performing, by the server module, a second boot-on process via a normal power when the server module receives the asserted ready signal.

Abstract: A detection system for storage device includes a case, one or more storage modules, one or more transmission cables, and one or more detection modules. The case defines one or more receiving slots and includes one or more position detectors. The position detector is installed adjacently to the receiving slot. The storage module is received by the receiving slot. The storage module includes a base board and a connecting module installed on the base board. The position detector generates a first error signal when the storage module is not correctly seated in the receiving slot. The transmission cable is coupled to the connecting module. The detection module is electrically connected to the transmission cable. The detection module generates a second error signal when the transmission cable is not correctly connected to the connecting module. Accordingly, service personnel can identify and resolve the errors quickly to enhance service efficiency.

Abstract: A power-on method for a server device includes generating a stand-by power to a server module of the server device when a blade enable signal is asserted; asserting, by the server module, a power-on signal to a storage module of the server device; performing, by the storage module, a first boot-on process when the storage module receives the asserted power-on signal; transmitting, by the storage module, an asserted ready signal to the server module when the first boot-on process finishes; and performing, by the server module, a second boot-on process via a normal power when the server module receives the asserted ready signal.

Abstract: A data writing method for a flash memory, and a flash memory controller and a flash memory storage apparatus using the same are provided. First, data is received from a host system. Next, the data is divided into at least one frame. Afterwards, an error checking and correcting (ECC) code corresponding to the frame is generated so as to form at least one ECC frame. Then, the ECC frame is divided into a plurality of frame segments. Finally, the frame segments are written into a flash memory chip according to a non-sequentially ranking order.

Abstract: A data writing method for a flash memory, and a flash memory controller and a flash memory storage apparatus using the same are provided. First, data is received from a host system. Next, the data is divided into at least one frame. Afterwards, an error checking and correcting (ECC) code corresponding to the frame is generated so as to form at least one ECC frame. Then, the ECC frame is divided into a plurality of frame segments. Finally, the frame segments are written into a flash memory chip according to a non-sequentially ranking order.

Abstract: The conventional I/O devices of a storage element, such as memory card, have a built-in microprocessor control unit (MCU) for executing the I/O commands. The demand of MCU increases the cost. Besides, the capacity of the storage element supported by the device is depend on the firmware inside the MCU. Since the updating of firmware is a tough job, the supportability is lack of elasticity. This invention discloses a method for driving the I/O device of storage element that strengthens the device driver to get rid of the MCU. The capacity supported hence can be raised by merely updating the device driver.

Abstract: The conventional apparatus for reading/writing storage devices need a built-in microprocessor control unit (MCU) to process commands. Thus, the flexiability (e.g.: supporting capacity of storage device) and the cost of the apparatus are not satisfied. The present invention employs a driver and a hardwire circuit to replace the MCU for money saving without changing other units in the apparatus. Moreover, the apparatus of the present invention can raise the supporting capacity of storage device and compatibility by just updating the driver.