Patents by Inventor Yu-Hung Lo

Yu-Hung Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240119875
    Abstract: A mending method for a display includes the steps of making a display device light to make a plurality of light emitting positions thereof shine, searching out a plurality of defect positions among the light emitting positions, providing a transferring device having a transferring surface with a plurality of miniature light emitting elements positioned correspondingly to the light emitting positions, planning a mending procedure which includes in the area the transferring surface corresponds to, choosing in chief the largest number of defect positions able to be mended at a single time according to the positions of the miniature light emitting elements and then in the area the transferring surface corresponds to, planning the rest of the defect positions according to the rest of the miniature light emitting elements, and according to the mending procedure, moving the transferring device to weld the miniature light emitting elements at the defect positions.
    Type: Application
    Filed: October 5, 2023
    Publication date: April 11, 2024
    Inventors: Tsan-Jen CHEN, Chih-Hao TSAI, Yu-Cheng YANG, Jen-Hung Lo, Yan-Ru TSAI
  • Publication number: 20240113034
    Abstract: A method for forming a semiconductor package is provided. The method includes forming a first alignment mark in a first substrate of a first wafer and forming a first bonding structure over the first substrate. The method also includes forming a second bonding structure over a second substrate of a second wafer and trimming the second substrate, so that a first width of the first substrate is greater than a second width of the second substrate. The method further includes attaching the second wafer to the first wafer via the first bonding structure and the second bonding structure, thinning the second wafer until a through-substrate via in the second substrate is exposed, and performing a photolithography process on the second wafer using the first alignment mark.
    Type: Application
    Filed: February 8, 2023
    Publication date: April 4, 2024
    Inventors: Yu-Hung LIN, Wei-Ming WANG, Chih-Hao YU, PaoTai HUANG, Pei-Hsuan LO, Shih-Peng TAI
  • Patent number: 11934034
    Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion, a driving assembly, and an assist assembly. The movable portion is used for connecting to an optical element having a main axis. The movable portion is movable relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion. The assist assembly limits the movement of the movable portion relative to the fixed portion.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chen-Hsien Fan, Yueh-Lin Lee, Yu-Chiao Lo, Sung-Mao Tsai, Shang-Hung Chen
  • Patent number: 8027398
    Abstract: The method contains the following steps. First, in a MCM system with N sub-carriers, the baseband signal blocks Xj, j=1, 2, . . . ,B are supplemented with zeros and processed with LN-point IFFT, respectively, to obtain L-time oversampled time-domain signal blocks xj, j=1,2, . . . ,B. Then, xj undergoes Q Time Domain Circular Shifts or Frequency Domain Circular Shifts to obtain Q signal blocks {tilde over (x)}j(ij), ij=1, ?, Q. Subsequently, a B×B unitary transform is performed against ( x1, {tilde over (x)}2(i2), . . . , {tilde over (x)}B(iB)). After the unitary transform, for each (i2, . . . , iB) a combination having B time-domain signal blocks is obtained as follows: ({tilde over (y)}1(i2, . . . , iB), {tilde over (y)}2(i2, . . . , iB), . . . , {tilde over (y)}B(i2, . . . ,iB))=( x1, {tilde over (x)}2(i2), . . . , {tilde over (x)}B(iB)) cU where U is the B×B unitary matrix, and c is an arbitrary constant (c?0).
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: September 27, 2011
    Assignee: National Taiwan University
    Inventors: Mao-Chao Lin, Shang-Kang Deng, Tien-Hui Chen, Yu-Hung Lo
  • Publication number: 20090147870
    Abstract: The method contains the following steps. First, in a MCM system with N sub-carriers, the baseband signal blocks Xj, j=1, 2, . . . ,B are supplemented with zeros and processed with LN-point IFFT, respectively, to obtain L-time oversampled time-domain signal blocks xj, j=1,2, . . . ,B. Then, xj undergoes Q Time Domain Circular Shifts or Frequency Domain Circular Shifts to obtain Q signal blocks {tilde over (x)}j(ij), ij=1,?,Q. Subsequently, a B×B unitary transform is performed against ( x1,{tilde over (x)}2(i2), . . . ,{tilde over (x)}B(iB)). After the unitary transform, for each (i2, . . . ,iB) a combination having B time-domain signal blocks is obtained as follows: ({tilde over (y)}1(i2, . . . ,iB),{tilde over (y)}2(i2, . . . ,iB), . . . ,{tilde over (y)}B(i2, . . . ,iB)=( x1,{tilde over (x)}2(i2), . . . ,{tilde over (x)}B(iB)) cU where U is the B×B unitary matrix, and c is an arbitrary constant (c?0).
    Type: Application
    Filed: June 19, 2008
    Publication date: June 11, 2009
    Inventors: Mao-Chao LIN, Shang-Kang Deng, Tien-Hui Chen, Yu-Hung Lo