Patents by Inventor Yu-Hung Ting

Yu-Hung Ting has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mold apparatus including mold sensor cooling structure
    Patent number: 11858187
    Abstract: A mold apparatus including a mold, a cooling flow path, and a sensing module is provided. The mold has a cavity. The sensing module is adapted to sense at least one of a temperature and a pressure in the cavity. The sensing module is surrounded by the cooling flow path.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: January 2, 2024
    Assignee: Chung Yuan Christian University
    Inventors: Shia-Chung Chen, Yung-Hsiang Chang, Yan-Xiang Liang, Yu-Hung Ting
  • MOLD APPARATUS WITH SENSORS BUILT THEREIN COAXIALLY
    Publication number: 20230330907
    Abstract: A mold apparatus including a mold, a bearing structure, and a sensing module is provided. The mold has a cavity. The sensing module includes a temperature sensor and a pressure sensor. The temperature sensor has a sensing portion and an abutting portion. The sensing portion is located in the mold and corresponds to a position in the cavity, and the abutting portion is located in the bearing structure. The pressure sensor is disposed in the bearing structure and corresponds to the abutting portion. The abutting portion is adapted to abut against the pressure sensor by a pressure of the position in the cavity.
    Type: Application
    Filed: June 24, 2022
    Publication date: October 19, 2023
    Applicant: Chung Yuan Christian University
    Inventors: Shia-Chung Chen, Yung-Hsiang Chang, Yan-Xiang Liang, Yu-Hung Ting
  • MOLD APPARATUS INCLUDING MOLD SENSOR COOLING STRUCTURE
    Publication number: 20230330904
    Abstract: A mold apparatus including a mold, a cooling flow path, and a sensing module is provided. The mold has a cavity. The sensing module is adapted to sense at least one of a temperature and a pressure in the cavity. The sensing module is surrounded by the cooling flow path.
    Type: Application
    Filed: June 24, 2022
    Publication date: October 19, 2023
    Applicant: Chung Yuan Christian University
    Inventors: Shia-Chung Chen, Yung-Hsiang Chang, Yan-Xiang Liang, Yu-Hung Ting