Patents by Inventor Yu-Iuan Lin

Yu-Iuan Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrostatic discharge structure for touch panel module
    Patent number: 8320097
    Abstract: The present invention discloses an electrostatic discharge structure for a touch panel module to prevent ESD current flowing from the touch panel to the circuit board and damaging the electronic elements. The touch panel module comprises a touch panel and a circuit board. The circuit board has a connection portion connecting the circuit board with the touch panel. The connection portion has a plurality of sensing wires, two ends of each sensing wire are respectively electrically connected with one sensing unit of the touch panel and one sensor chip of the circuit board. The connection portion comprises at least one grounding solder pad and an electric-conduction structure covering thereon. The electric-conduction structure electrically connects the grounding solder pads to direct away the static.
    Type: Grant
    Filed: May 5, 2010
    Date of Patent: November 27, 2012
    Assignee: Cando Corporation
    Inventors: Chien-Chih Lin, Yung-Chan Chou, Yu-Iuan Lin
  • ELECTROSTATIC DISCHARGE STRUCTURE FOR TOUCH PANEL MODULE
    Publication number: 20110194226
    Abstract: The present invention discloses an electrostatic discharge structure for a touch panel module to prevent ESD current flowing from the touch panel to the circuit board and damaging the electronic elements. The touch panel module comprises a touch panel and a circuit board. The circuit board has a connection portion connecting the circuit board with the touch panel. The connection portion has a plurality of sensing wires, two ends of each sensing wire are respectively electrically connected with one sensing unit of the touch panel and one sensor chip of the circuit board. The connection portion comprises at least one grounding solder pad and an electric-conduction structure covering thereon. The electric-conduction structure electrically connects the grounding solder pads to direct away the static.
    Type: Application
    Filed: May 5, 2010
    Publication date: August 11, 2011
    Inventors: Chien-Chih LIN, Yung-Chan Chou, Yu-Iuan Lin