Patents by Inventor Yu Iwai

Yu Iwai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11487202
    Abstract: A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: November 1, 2022
    Assignee: FUJIFILM Corporation
    Inventors: Takeshi Kawabata, Kenta Yoshida, Yu Iwai, Akinori Shibuya
  • Patent number: 11480876
    Abstract: Provided are a photosensitive resin composition in which warping of a cured film after curing is decreased and lithographic properties in a case of forming a pattern are excellent, a cured film, a laminate, a method for producing a cured film, and a semiconductor device. The photosensitive resin composition includes a polyimide precursor including a repeating unit including a biphenyl structure and a photopolymerization initiator having an oxime structure capable of generating an aryl radical by being irradiated with light.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: October 25, 2022
    Assignee: FUJIFILM Corporation
    Inventors: Kei Fukuhara, Yu Iwai
  • Patent number: 10780679
    Abstract: Provided is a laminate that excels in adhesion among a plurality of resin layers formed as insulating layers containing polyimide and so forth, a method for manufacturing the laminate, a semiconductor device, and, a method for manufacturing the semiconductor device. The laminate comprises a substrate, and at least two resin layers, each of the resin layers is independently brought into contact, in at least a part of the surface thereof, with other resin layer, and the layers independently has a Young's modulus exceeding 2.8 GPa and not exceeding 5.0 GPa, and, an elongation after fracture exceeding 50% and not exceeding 200%, and further has a three-dimensional radical crosslinked structure, and at least one of the resin layers contains at least either polyimide or polybenzoxazole.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: September 22, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Yu Iwai, Takeshi Kawabata, Akinori Shibuya
  • Publication number: 20200089113
    Abstract: A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.
    Type: Application
    Filed: November 20, 2019
    Publication date: March 19, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Takeshi KAWABATA, Kenta YOSHIDA, Yu IWAI, Akinori SHIBUYA
  • Patent number: 10580640
    Abstract: Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40° C.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: March 3, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Yoshitaka Kamochi, Yu Iwai, Ichiro Koyama, Atsushi Nakamura
  • Patent number: 10538627
    Abstract: A photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition are provided. In the polyimide precursor composition, the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole. In General Formula (1-2), A1 and A2 each independently represents an oxygen atom or NH, R111 and R112 each independently represents a single bond or a divalent organic group, and R113 and R114 each independently represents a hydrogen atom or a monovalent organic group.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: January 21, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Takeshi Kawabata, Takuma Amemiya, Hidekazu Oohashi, Yu Iwai, Akinori Shibuya
  • Publication number: 20200019057
    Abstract: Provided are a photosensitive resin composition in which warping of a cured film after curing is decreased and lithographic properties in a case of forming a pattern are excellent, a cured film, a laminate, a method for producing a cured film, and a semiconductor device. The photosensitive resin composition includes a polyimide precursor including a repeating unit including a biphenyl structure and a photopolymerization initiator having an oxime structure capable of generating an aryl radical by being irradiated with light.
    Type: Application
    Filed: September 24, 2019
    Publication date: January 16, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Kei FUKUHARA, Yu Iwai
  • Patent number: 10526448
    Abstract: Provided are photosensitive resin compositions having a wide exposure latitude, a precursor composition for providing such a photosensitive resin composition, a method for producing a precursor composition, a cured film, a method for producing a cured film; and a semiconductor device. The precursor composition is a precursor composition containing at least one kind of heterocycle-containing polymer precursor, in which the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor; and the dispersity which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor is 2.5 or more.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: January 7, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Akinori Shibuya, Yu Iwai, Takeshi Kawabata, Ichiro Koyama
  • Patent number: 10501580
    Abstract: A photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition are provided. In the polyimide precursor composition, the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole. In General Formula (1-2), A1 and A2 each independently represents an oxygen atom or NH, R111 and R112 each independently represents a single bond or a divalent organic group, and R113 and R114 each independently represents a hydrogen atom or a monovalent organic group.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: December 10, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Takeshi Kawabata, Takuma Amemiya, Hidekazu Oohashi, Yu Iwai, Akinori Shibuya
  • Publication number: 20190369496
    Abstract: Provided are a photosensitive resin composition in which the progress of cyclization reaction is fast and storage stability over time is excellent, a heterocyclic ring-containing polymer precursor, a cured film, a laminate, a method for producing a cured film, and a semiconductor device, using the photosensitive resin composition. The photosensitive resin composition includes a heterocyclic ring-containing polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor, and a solvent, in which a solid content of the photosensitive resin composition has an amine value of 0.0002 to 0.0200 mmol/g.
    Type: Application
    Filed: August 15, 2019
    Publication date: December 5, 2019
    Applicant: FUJIFILM Corporation
    Inventors: Takeshi KAWABATA, Yu IWAI, Akinori SHIBUYA
  • Patent number: 10450417
    Abstract: Provided is a resin capable of yielding a cured film with less warp and good uniformity, and of yielding a cured film (pattern) with less scum; a composition using the resin; a cured film; and a method for manufacturing a cured film and a semiconductor device. The resin is selected from polyimide precursor, polyimide, polybenzoxazole precursor, and, polybenzoxazole, and has a polymerizable group, and has a total content of a component with a molecular weight of 1,000 or smaller of 0.005 to 1.0% by mass.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: October 22, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Takeshi Kawabata, Yu Iwai, Akinori Shibuya
  • Patent number: 10442961
    Abstract: Provided are a composition which has good elastomer solubility, is thus capable of increasing a concentration of solid contents, and is capable of forming a film having excellent drying properties, surface morphology, and heat resistance, a process for producing a sheet, a sheet, a laminate, and a laminate with a device wafer. This composition includes an elastomer having a 5% thermal mass reduction temperature of 375° C. or higher when heated at an elevation rate of 20° C./min from 25° C., a solvent represented by the following General Formula (1) and having a boiling point of 160° C. or higher, and a solvent having a boiling point of lower than 120° C. In General Formula (1), R1 to R6 each independently represent a hydrogen atom or an aliphatic hydrocarbon group.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: October 15, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Yoshitaka Kamochi, Ichiro Koyama, Yu Iwai, Atsushi Nakamura, Mitsuru Sawano
  • Publication number: 20190153210
    Abstract: Provided are a resin composition which allows laser ablation processing, allows removal of a protective film itself after the processing, and is capable of forming a protective film having peeling resistance, and a protective film. The resin composition for forming a protective film contains polyvinyl acetal, a light absorbing agent, and a solvent.
    Type: Application
    Filed: January 25, 2019
    Publication date: May 23, 2019
    Applicant: FUJIFILM Corporation
    Inventors: Yu IWAI, Mitsuru SAWANO
  • Patent number: 10287458
    Abstract: A laminate includes, sequentially and adjacent to each other: a first base material; a temporary adhesion film; and a second base material, in which the tensile elastic modulus E of the temporary adhesion film at 25° C. in conformity with JIS K 7161:1994 is in a range of 25 to 2000 MPa. A base material is peeled off by fixing any one of the first base material and the second base material of the laminate at 25° C. and pulling an end portion of the other base material up in a direction perpendicular to the surface of the other base material from an interface with the temporary adhesion film at a speed of 50 mm/min, and the force applied during the pulling is measured using a force gauge and the value is 0.33 N/mm or less.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: May 14, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Yoshitaka Kamochi, Yu Iwai, Mitsuru Sawano, Ichiro Koyama, Atsushi Nakamura
  • Patent number: 10151367
    Abstract: A friction material includes a fiber base material, a friction modifier and a binder. The friction modifier includes two or more kinds of titanate compounds. The two or more kinds of titanate compounds have a median diameter (D50) of 20 ?m or more. At least one of the two or more kinds of titanate compounds is a porous titanate compounds. The friction material includes no copper component.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: December 11, 2018
    Assignee: AKEBONO BRAKE INDUSTRY CO., LTD.
    Inventors: Yu Iwai, Saki Maruta, Yoichi Kawashima, Hiroshi Isobe
  • Patent number: 10096776
    Abstract: A method is provided for photolithographic patterning of an organic layer, comprising: providing a shielding layer on the organic layer; providing a photoresist layer on the shielding layer; illuminating the photoresist layer through a shadow mask; developing the photoresist layer, thereby forming a patterned photoresist layer; performing a first dry etching step using the patterned photoresist layer as a mask, thereby removing at least an upper portion of the photoresist layer and completely removing the shielding layer at locations not covered by the photoresist layer; performing a second dry etching step using the patterned shielding layer as a mask, thereby removing the organic layer at locations not covered by the shielding layer; and removing the shielding layer, wherein removing the shielding layer comprises exposing it to water. A method of the present disclosure may advantageously be used in a process for fabricating organic semiconductor based devices and circuits.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: October 9, 2018
    Assignee: FUJIFILM Corporation
    Inventors: Pawel Malinowski, Atsushi Nakamura, Yu Iwai
  • Publication number: 20180222164
    Abstract: Provided is a laminate that excels in adhesion among a plurality of resin layers formed as insulating layers containing polyimide and so forth, a method for manufacturing the laminate, a semiconductor device, and, a method for manufacturing the semiconductor device. The laminate comprises a substrate, and at least two resin layers, each of the resin layers is independently brought into contact, in at least a part of the surface thereof, with other resin layer, and the layers independently has a Young's modulus exceeding 2.8 GPa and not exceeding 5.0 GPa, and, an elongation after fracture exceeding 50% and not exceeding 200%, and further has a three-dimensional radical crosslinked structure, and at least one of the resin layers contains at least either polyimide or polybenzoxazole.
    Type: Application
    Filed: March 29, 2018
    Publication date: August 9, 2018
    Applicant: FUJIFILM Corporation
    Inventors: Yu IWAI, Takeshi KAWABATA, Akinori SHIBUYA
  • Publication number: 20180215874
    Abstract: Provided is a resin capable of yielding a cured film with less warp and good uniformity, and of yielding a cured film (pattern) with less scum; a composition using the resin; a cured film; and a method for manufacturing a cured film and a semiconductor device. The resin is selected from polyimide precursor, polyimide, polybenzoxazole precursor, and, polybenzoxazole, and has a polymerizable group, and has a total content of a component with a molecular weight of 1,000 or smaller of 0.005 to 1.0% by mass.
    Type: Application
    Filed: March 28, 2018
    Publication date: August 2, 2018
    Applicant: FUJIFILM Corporation
    Inventors: Takeshi KAWABATA, Yu IWAI, Akinori SHIBUYA
  • Patent number: 9966295
    Abstract: A temporary bonding laminate for use in the manufacture of semiconductor devices and a method for manufacturing semiconductor devices are provided. A member to be processed (a semiconductor wafer or the like) can be temporarily supported securely and readily during a mechanical or chemical process of the member, and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process. The laminate includes: (A) a release layer and (B) an adhesive layer. The release layer contains (a1) a compound being liquid at 25° C. and having a 5% mass reduction temperature of 250° C. or more when measured in a nitrogen gas stream under heating conditions of a constant heating rate of 20° C./min; and (a2) a binder having a 5% mass reduction temperature of 250° C. or more when measured under the same conditions.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: May 8, 2018
    Assignee: FUJIFILM Corporation
    Inventors: Ichiro Koyama, Yu Iwai, Kazuhiro Fujimaki
  • Publication number: 20180119764
    Abstract: A friction material includes a fiber base material, a friction modifier and a binder. The friction modifier includes two or more kinds of titanate compounds. The two or more kinds of titanate compounds have a median diameter (D50) of 20 ?m or more. At least one of the two or more kinds of titanate compounds is a porous titanate compounds. The friction material includes no copper component.
    Type: Application
    Filed: October 31, 2017
    Publication date: May 3, 2018
    Applicant: AKEBONO BRAKE INDUSTRY CO., LTD.
    Inventors: Yu IWAI, Saki MARUTA, Yoichi KAWASHIMA, Hiroshi ISOBE