Abstract: A method for forming a packaging structure is provided. The method includes providing a first substrate and a second substrate. The first substrate includes a first base material and a first dielectric layer on the first base material, and the second substrate includes a second base material and a second dielectric layer on the second base material. The second base material has a first through hole. The first dielectric layer and the second dielectric layer have a first hole and a second hole, respectively. The method further includes connecting the second substrate to the first substrate in such a way that the second dielectric layer is connected to the first dielectric layer to form a first composite structure; thinning the top surface of the first composite structure to expose the first through hole; and forming a first conductive member in the first through hole.

Abstract: A design coordination engine coordinates design implementation among a manufacturing facility, a customer, an IP vendor, and a design group during the design phase of a semiconductor device. The design coordination engine includes a tracking module configured to track design information updates in a design database. The design coordination engine also includes an alert module configured to notify a customer who has accessed a file associated with information updates that occurred during a predefined period of time.