Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.

Abstract: A semiconductor device according to embodiments of the present disclosure includes a first die including a first bonding layer and a second die including a second hybrid bonding layer. The first bonding layer includes a first dielectric layer and a first metal coil embedded in the first dielectric layer. The second bonding layer includes a second dielectric layer and a second metal coil embedded in the second dielectric layer. The second hybrid bonding layer is bonded to the first hybrid bonding layer such that the first dielectric layer is bonded to the second dielectric layer and the first metal coil is bonded to the second metal coil.

Abstract: A semiconductor device includes a first die having a first bonding layer; a second die having a second bonding layer disposed over and bonded to the first bonding layer; a plurality of bonding members, wherein each of the plurality of bonding members extends within the first bonding layer and the second bonding layer, wherein the plurality of bonding members includes a connecting member electrically connected to a first conductive pattern in the first die and a second conductive pattern in the second die, and a dummy member electrically isolated from the first conductive pattern and the second conductive pattern; and an inductor disposed within the first bonding layer and the second bonding layer. A method of manufacturing a semiconductor device includes bonding a first inductive coil of a first die to a second inductive coil of a second die to form an inductor.

Abstract: A middle frame includes an inner frame, a blocking member, and a covering member. The inner frame includes an outer surface and an inner surface opposite the outer surface. The inner frame further comprises at least one mounting hole penetrating the outer surface and the inner surface, the at least one mounting hole comprises an opening at the outer surface. The covering member covers the outer surface, and the blocking member is disposed between the covering member and the outer surface so as to cover the opening of the at least one mounting hole at the outer surface. An electronic device including the middle frame and a method for manufacturing the middle frame are also provided.

Abstract: An illuminating system having an electronic shield illuminating apparatus comprises a semiconductor light-emitting source, a reflector, an electronic shield, a shield driving control circuit, and a projection lens. The reflector is intended for reflecting a portion of the light reflected by the semiconductor light-emitting source, and has a reflecting surface facing the semiconductor light-emitting source. The electronic shield is intended for generating different shield patterns to mask the light emitted by the semiconductor light-emitting source, and the light reflected by the reflector, and has a main surface facing the semiconductor light-emitting source and the reflecting surface of the reflector. The shield driving control circuit drives the electronic shield to generate different shield patterns in response to a signal information. The projection lens projects the light passing through the electronic shield.

Abstract: An LED luminescent device includes an LED light source, a reflector, a light shade and a projecting lens. The LED light source includes at least one LED element having a light-emitting surface emitting light. The reflector faces the light-emitting surface of the at least one LED element and has multiple reflection surfaces of different curvatures reflecting the light from the light-emitting surface of the at least one LED element. The light shade adjusts the light reflected by the reflector to provide a required light distribution pattern. The projecting lens project the required light distribution pattern. Thus, the device and a vehicle lamp including the device can prevent losing light energy.

Abstract: An LED luminescent device comprises an LED light source, a reflector, a light shade and a projecting lens. The LED light source comprises at least one LED element having a light-emitting surface emitting light. The reflector faces the light-emitting surface of the at least one LED element and has multiple reflection surfaces of different curvatures reflecting the light form the light-emitting surface of the at least one LED element. The light shade adjusts the light reflected by the reflector to provide a required light distribution pattern. The projecting lens projects the required light distribution pattern. Thus the device and a vehicle lamp comprising the device can prevent light energy from losing.

Abstract: A direct type backlight module. The backlight module includes a first plate, a second plate, a plurality of light sources and a third plate. The second plate connects to the first plate and forming a space between. The plurality of light sources is disposed in the space. The third plate is disposed outside the space, connects to the surface of the first plate and has a plurality of openings.

Abstract: A direct type backlight module. The backlight module includes a first plate, a second plate, a plurality of light sources and a third plate. The second plate connects to the first plate and forming a space between. The plurality of light sources is disposed in the space. The third plate is disposed outside the space, connects to the surface of the first plate and has a plurality of openings.