Abstract: Some implementations described herein include systems and techniques for fabricating a semiconductor die package that includes a cooling interface region formed in surface of an integrated circuit die. The cooling interface region, which includes a combination of channel regions and pillar structures, may be directly exposed to a fluid above and/or around the semiconductor die package.

Abstract: A system and a method for measuring a void fraction of an inside of a heat conduction member are provided. The system is used to measure the heat conduction member and includes: a heating device configured as a heat source to heat an evaporation end of the heat conduction member; a cooling device configured for cooling a condensation end of the heat conduction member; at least one pair of electrode pads respectively attached to two opposite surfaces of the heat conduction member; and an LCR meter electrically connected to the at least one pair of the electrode pads for measuring impedances of the heat conduction member. Each of the impedances is converted into the void fraction that corresponds to a measured position of the heat conduction member.

Abstract: A system and a method for measuring a void fraction of an inside of a heat conduction member are provided. The system is used to measure the heat conduction member and includes: a heating device configured as a heat source to heat an evaporation end of the heat conduction member; a cooling device configured for cooling a condensation end of the heat conduction member; at least one pair of electrode pads respectively attached to two opposite surfaces of the heat conduction member; and an LCR meter electrically connected to the at least one pair of the electrode pads for measuring impedances of the heat conduction member. Each of the impedances is converted into the void fraction that corresponds to a measured position of the heat conduction member.