Patents by Inventor Yu-Jen Tsai
Yu-Jen Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240119875Abstract: A mending method for a display includes the steps of making a display device light to make a plurality of light emitting positions thereof shine, searching out a plurality of defect positions among the light emitting positions, providing a transferring device having a transferring surface with a plurality of miniature light emitting elements positioned correspondingly to the light emitting positions, planning a mending procedure which includes in the area the transferring surface corresponds to, choosing in chief the largest number of defect positions able to be mended at a single time according to the positions of the miniature light emitting elements and then in the area the transferring surface corresponds to, planning the rest of the defect positions according to the rest of the miniature light emitting elements, and according to the mending procedure, moving the transferring device to weld the miniature light emitting elements at the defect positions.Type: ApplicationFiled: October 5, 2023Publication date: April 11, 2024Inventors: Tsan-Jen CHEN, Chih-Hao TSAI, Yu-Cheng YANG, Jen-Hung Lo, Yan-Ru TSAI
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Publication number: 20240113071Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.Type: ApplicationFiled: January 5, 2023Publication date: April 4, 2024Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao
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Patent number: 11947886Abstract: A development system and a method of an offline software-in-the-loop simulation are disclosed. A common firmware architecture generates a chip control program. The common firmware architecture has an application layer and a hardware abstraction layer. The application layer has a configuration header file and a product program. A processing program required by a peripheral module is added to the hardware abstraction layer during compiling. The chip control program is provided to a controller chip or a circuit simulation software to be executed to control the product-related circuit through controlling the peripheral module.Type: GrantFiled: June 28, 2022Date of Patent: April 2, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Yu-Jen Lin, Chang-Chung Lin, Chia-Wei Chu, Terng-Wei Tsai, Feng-Hsuan Tung
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Publication number: 20240100352Abstract: A phototherapy device includes a base, at least one light conversion device and a light source module. The base has an installation slot. The light conversion device is detachably arranged in the installation slot. Each light conversion device includes a plurality of light conversion patterns. The light source module is arranged on a side of the base and configured to provide an excitation beam to the light conversion patterns, so that each of the light conversion patterns emits a converted beam. In this way, the light conversion device of the phototherapy device can be replaced according to the user's needs.Type: ApplicationFiled: September 19, 2023Publication date: March 28, 2024Inventors: CHUNG-JEN OU, YU-MIN CHEN, MING-WEI TSAI, CHIEN-CHIH CHEN
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Patent number: 11942451Abstract: A semiconductor structure includes a functional die, a dummy die, a redistribution structure, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The redistribution structure is disposed over and electrically connected to the functional die. The seal ring is disposed over the dummy die. The alignment mark is between the seal ring and the redistribution structure, wherein the alignment mark is electrically isolated from the dummy die, the redistribution structure and the seal ring. The insulating layer encapsulates the functional die and the dummy die.Type: GrantFiled: August 30, 2021Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Mao-Yen Chang, Yu-Chia Lai, Cheng-Shiuan Wong, Ting Hao Kuo, Ching-Hua Hsieh, Hao-Yi Tsai, Kuo-Lung Pan, Hsiu-Jen Lin
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Publication number: 20240094783Abstract: An example computing device includes a first housing portion, a second housing portion moveably connected to the first housing portion, a link to selectively secure the second housing portion to the first housing portion to inhibit movement of the second housing portion relative to the first housing portion, and a shape-memory alloy element to release the link to allow the second housing portion to move relative to the first housing portion.Type: ApplicationFiled: September 15, 2022Publication date: March 21, 2024Inventors: Yu-Wen LIN, Chia-Ming TSAI, Shih-Jen CHOU, John Joseph GRODEN
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Publication number: 20240096781Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.Type: ApplicationFiled: March 20, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
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Patent number: 9557852Abstract: A method of identifying a palm area for a touch panel has steps of: receiving sensing frame information having multiple touching sensing points from the touch panel; selecting one of the touching sensing points; outwardly extending a distance from an outline of the selected touching sensing point to define a searching range; checking whether other touching sensing points are within the searching range; marking the touching sensing points in the searching range and expanding the searching range based on the currently marked touching sensing points; sequentially selecting and checking each touching sensing point if it is within the present searching range; and finally merging all the outlines of the marked touching sensing points to form a final outline as a palm area. Other unmarked touching sensing points are defined as touching reference points.Type: GrantFiled: December 30, 2015Date of Patent: January 31, 2017Assignee: ELAN MICROELECTRONICS CORPORATIONInventors: Yu-Jen Tsai, Hsueh-Wei Yang
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Publication number: 20160239149Abstract: A method of identifying edge touch gesture has steps of scanning the touch device under a hover mode; scanning the touch device under a touch mode; determining if there is a touch object on the touch device according to a scanning result of the touch mode; and when there is a touch object on the touch device, identifying the gesture according to a scanning result of the hover mode and the scanning result of the touch mode. Accordingly, the method can perform valid touch on the edge area, rendering effective identification of edge touch gesture and an increased success rate of the identification.Type: ApplicationFiled: March 24, 2016Publication date: August 18, 2016Applicant: ELAN MICROELECTRONICS CORPORATIONInventors: I-Hau YEH, Yu-Jen TSAI
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Patent number: 9323383Abstract: A method of identifying edge swipe gesture has steps of respectively reading sensing signals on an edge area under a hover mode and on a non-edge area under a touch mode; determining if a touch object has appeared on the edge area after determining that the object has appeared on the non-edge area, calculating a displacement of the object moving from the edge area to the non-edge area within a preset time and determining if the displacement exceeds a preset distance, and determining that the movement of the touch is identified as an edge swipe gesture if the displacement meets the condition. Accordingly, the present invention can perform valid touch on the edge area, rendering effective identification of edge swipe gesture and an increased success rate of the identification.Type: GrantFiled: March 17, 2014Date of Patent: April 26, 2016Assignee: ELAN MICROELECTRONICS CORPORATIONInventors: I-Hau Yeh, Yu-Jen Tsai
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Publication number: 20160110017Abstract: A method of identifying a palm area for a touch panel has steps of: receiving sensing frame information having multiple touching sensing points from the touch panel; selecting one of the touching sensing points; outwardly extending a distance from an outline of the selected touching sensing point to define a searching range; checking whether other touching sensing points are within the searching range; marking the touching sensing points in the searching range and expanding the searching range based on the currently marked touching sensing points; sequentially selecting and checking each touching sensing point if it is within the present searching range; and finally merging all the outlines of the marked touching sensing points to form a final outline as a palm area. Other unmarked touching sensing points are defined as touching reference points.Type: ApplicationFiled: December 30, 2015Publication date: April 21, 2016Applicant: ELAN MICROELECTRONICS CORPORATIONInventors: Yu-Jen Tsai, Hsueh-Wei Yang
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Publication number: 20160054831Abstract: A capacitive touch device and a method identifying touch object on the touch device read sensing information of multiple traces of a touch panel corresponding to a touch object, in which the sensing information includes a sensing cluster corresponding to a portion on the touch panel touched by the touch object, identify a hover cluster of the sensing information corresponding to a portion adjacent to and surrounding the sensing cluster, determine if the hover cluster meets a first characteristic, and determine that the touch object is a specific touch object when the hover cluster meets the first characteristic. Given the foregoing device and method, a palm rejection operation can be more accurately performed and is also applicable to object detection at corners of the touch panel.Type: ApplicationFiled: August 3, 2015Publication date: February 25, 2016Applicant: ELAN MICROELECTRONICS CORPORATIONInventors: YU-JEN TSAI, I-HAU YEH, HSUEH-WEI YANG, SHENG-FENG LI
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Patent number: 9256315Abstract: A method of identifying a palm area for a touch panel has steps of: receiving sensing frame information having multiple touching sensing points from the touch panel; selecting one of the touching sensing points; outwardly extending a distance from an outline of the selected touching sensing point to define a searching range; checking whether other touching sensing points are within the searching range; marking the touching sensing points in the searching range and expanding the searching range based on the currently marked touching sensing points; sequentially selecting and checking each touching sensing point if it is within the present searching range; and finally merging all the outlines of the marked touching sensing points to form a final outline as a palm area. Other unmarked touching sensing points are defined as touching reference points.Type: GrantFiled: May 10, 2012Date of Patent: February 9, 2016Assignee: ELAN MICROELECTRONICS CORPORATIONInventors: Yu-Jen Tsai, Hsueh-Wei Yang
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Patent number: 9173313Abstract: A waterproof structure of a casing has a case body and a cover pivotally mounted on the case body. The case body has a recess, a water collecting sump defined in the recess and two abutting protrusions respectively formed on two opposite inner sidewalls of the case body. The cover has an outer shell, and an inner stop and two side stops formed on an inner surface of the outer shell. When the cover pivots to cover the recess of the case body, the inner stop and the side stops prevent moisture and dust from entering the case body from a clearance formed between a pivot edge of the outer shell and the water collecting side surface of the case body.Type: GrantFiled: October 3, 2012Date of Patent: October 27, 2015Assignee: Gemtek Technology Co., Ltd.Inventor: Yu-Jen Tsai
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Publication number: 20140375577Abstract: A method of identifying edge swipe gesture has steps of respectively reading sensing signals on an edge area under a hover mode and on a non-edge area under a touch mode; determining if a touch object has appeared on the edge area after determining that the object has appeared on the non-edge area, calculating a displacement of the object moving from the edge area to the non-edge area within a preset time and determining if the displacement exceeds a preset distance, and determining that the movement of the touch is identified as an edge swipe gesture if the displacement meets the condition. Accordingly, the present invention can perform valid touch on the edge area, rendering effective identification of edge swipe gesture and an increased success rate of the identification.Type: ApplicationFiled: March 17, 2014Publication date: December 25, 2014Inventors: I-Hau YEH, Yu-Jen TSAI
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Patent number: 8879264Abstract: A stacked heat dissipating module of an electronic device has a holding frame, and at least one first heat conducting medium layer, a heat dissipating medium layer, a first heat sink layer, at least one second heat conducting medium layer and at least one second heat sink layer stacked with each other. The at least one first heat conducting medium layer is mounted on at least one heating component of the electronic device to dissipate heat generated from the at least one heating component. Moreover, the holding frame, the heat conducting medium layers and the heat sink layers have corresponding housing holes for exposing an exposed component of the electronic device to bring the exposed component's function into full play.Type: GrantFiled: October 4, 2012Date of Patent: November 4, 2014Assignee: Gemtek Technology Co., Ltd.Inventor: Yu-Jen Tsai
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Publication number: 20130301222Abstract: A stacked heat dissipating module of an electronic device has a holding frame, and at least one first heat conducting medium layer, a heat dissipating medium layer, a first heat sink layer, at least one second heat conducting medium layer and at least one second heat sink layer stacked with each other. The at least one first heat conducting medium layer is mounted on at least one heating component of the electronic device to dissipate heat generated from the at least one heating component. Moreover, the holding frame, the heat conducting medium layers and the heat sink layers have corresponding housing holes for exposing an exposed component of the electronic device to bring the exposed component's function into full play.Type: ApplicationFiled: October 4, 2012Publication date: November 14, 2013Applicant: GEMTEK TECHNOLOGY CO., LTDInventor: Yu-Jen TSAI
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Publication number: 20130293073Abstract: A waterproof structure of a casing has a case body and a cover pivotally mounted on the case body. The case body has a recess, a water collecting sump defined in the recess and two abutting protrusions respectively formed on two opposite inner sidewalls of the case body. The cover has an outer shell, and an inner stop and two side stops formed on an inner surface of the outer shell. When the cover pivots to cover the recess of the case body, the inner stop and the side stops prevent moisture and dust from entering the case body from a clearance formed between a pivot edge of the outer shell and the water collecting side surface of the case body.Type: ApplicationFiled: October 3, 2012Publication date: November 7, 2013Applicant: GEMTEK TECHNOLOGY CO., LTD.Inventor: Yu-Jen Tsai
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Publication number: 20120293454Abstract: A method of identifying a palm area for a touch panel has steps of: receiving sensing frame information having multiple touching sensing points from the touch panel; selecting one of the touching sensing points; outwardly extending a distance from an outline of the selected touching sensing point to define a searching range; checking whether other touching sensing points are within the searching range; marking the touching sensing points in the searching range and expanding the searching range based on the currently marked touching sensing points; sequentially selecting and checking each touching sensing point if it is within the present searching range; and finally merging all the outlines of the marked touching sensing points to form a final outline as a palm area. Other unmarked touching sensing points are defined as touching reference points.Type: ApplicationFiled: May 10, 2012Publication date: November 22, 2012Applicant: ELAN MICROELECTRONICS CORPORATIONInventors: YU-JEN TSAI, HSUEH-WEI YANG
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Publication number: 20120293971Abstract: An electronic device including a circuit board, a frame, at least one shielding cover, a shielding case and a plurality of electronic components is provided. The frame is disposed on the circuit board for forming a plurality of first containing spaces on the circuit board. The shielding cover is disposed on the frame and covers at least a part of the first containing spaces. The shielding cover comprises a plurality of folded portions. The folded portions are disposed in a part of the first containing spaces for dividing the first containing spaces into a plurality of second containing spaces. The shielding case is disposed on the circuit board and covers the shielding cover and the frame. The electronic components are disposed on the circuit board and located in at least one of the first containing spaces and the second containing spaces.Type: ApplicationFiled: July 12, 2011Publication date: November 22, 2012Applicant: GEMTEK TECHNOLOGY CO., LTD.Inventor: Yu-Jen Tsai