Patents by Inventor Yu-Jen WEI

Yu-Jen WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assembly structure of transformer and circuit board as well as assembly method thereof
    Patent number: 11778746
    Abstract: An assembly structure of a transformer and a circuit board includes: a circuit board, a packaging chip, a transformer, a first conductive plate, a second conductive plate and a first heat sink. The packaging chip is disposed on the circuit board. The transformer has at least one first output electrode and at least one second output electrode connected to the first output electrode. The first conductive plate is disposed on the transformer and connected to the at least one first output electrode. The second conductive plate is disposed on the transformer and connected to the at least one second output electrode and the circuit board. The first heat sink is connected to the packaging chip and the first conductive plate, is disposed on the circuit board, and is connected to the circuit board and the first conductive plate.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: October 3, 2023
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventors: Tsung-Po Hsu, Yung-Chou Li, Yu-Jen Wei, Chih-Chun Yang
  • ASSEMBLY STRUCTURE OF TRANSFORMER AND CIRCUIT BOARD AS WELL AS ASSEMBLY METHOD THEREOF
    Publication number: 20220201862
    Abstract: An assembly structure of a transformer and a circuit board includes: a circuit board, a packaging chip, a transformer, a first conductive plate, a second conductive plate and a first heat sink. The packaging chip is disposed on the circuit board. The transformer has at least one first output electrode and at least one second output electrode connected to the first output electrode. The first conductive plate is disposed on the transformer and connected to the at least one first output electrode. The second conductive plate is disposed on the transformer and connected to the at least one second output electrode and the circuit board. The first heat sink is connected to the packaging chip and the first conductive plate, is disposed on the circuit board, and is connected to the circuit board and the first conductive plate.
    Type: Application
    Filed: April 9, 2021
    Publication date: June 23, 2022
    Inventors: Tsung-Po HSU, Yung-Chou LI, Yu-Jen WEI, Chih-Chun YANG