Patents by Inventor Yu-Jhan Lin

Yu-Jhan Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Channel structure for signal transmission
    Patent number: 11348868
    Abstract: A channel structure for signal transmission is provided. The channel structure includes a first common pad, disposed on a first layer; a second common pad, disposed on a second layer; a via, for electrically connecting the first common pad and the second common pad; a first device path pad, disposed on the second layer and located in a first direction of the second common pad; and a second device path pad disposed on the second layer and located in a second direction of the second common pad. The channel structure includes a first electrical element electrically coupled between the second common pad and the first device path pad, or includes a second electrical element electrically coupled between the second common pad and the second device path pad.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: May 31, 2022
    Assignee: Wistron Corporation
    Inventors: Kun-Hung Tsai, Yu-Jhan Lin
  • Channel Structure for Signal Transmission
    Publication number: 20220115318
    Abstract: A channel structure for signal transmission is provided. The channel structure includes a first common pad, disposed on a first layer; a second common pad, disposed on a second layer; a via, for electrically connecting the first common pad and the second common pad; a first device path pad, disposed on the second layer and located in a first direction of the second common pad; and a second device path pad disposed on the second layer and located in a second direction of the second common pad. The channel structure includes a first electrical element electrically coupled between the second common pad and the first device path pad, or includes a second electrical element electrically coupled between the second common pad and the second device path pad.
    Type: Application
    Filed: November 17, 2020
    Publication date: April 14, 2022
    Inventors: Kun-Hung Tsai, Yu-Jhan Lin