Patents by Inventor Yu-Jie Ji

Yu-Jie Ji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8933539
    Abstract: An integrated circuit (IC) and a seal ring thereof are provided. The IC includes a first seal ring. The first seal ring is disposed in the IC. The first seal ring includes at least one stagger structure. The at least one stagger structure includes at least one stagger unit. The at least one stagger unit makes staggered connection with another neighboring stagger unit.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: January 13, 2015
    Assignee: VIA Telecom Co., Ltd.
    Inventors: Bing-Jye Kuo, Hong-Wen Lin, Yu-Jie Ji
  • Publication number: 20140077341
    Abstract: An integrated circuit (IC) and a seal ring thereof are provided. The IC includes a first seal ring. The first seal ring is disposed in the IC. The first seal ring includes at least one stagger structure. The at least one stagger structure includes at least one stagger unit. The at least one stagger unit makes staggered connection with another neighboring stagger unit.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 20, 2014
    Applicant: VIA TELECOM, INC.
    Inventors: Bing-Jye Kuo, Hong-Wen Lin, Yu-Jie Ji