Abstract: The present disclosure provides display device. The display device includes a substrate having an upper surface and a circuit layer stacked on the upper surface of the substrate. The circuit layer includes a dielectric layer and a wire. The wire extends in a Y direction, wherein the Y direction is different from an X direction. The X direction is perpendicular to the upper surface of the substrate. The wire includes a plurality of conductive interconnects disposed in the dielectric layer, the adjacent conductive interconnects are electrically connected, and adjacent conductive interconnects are disposed at different distances from the upper surface of the substrate.

Abstract: A method of removing a photoresist layer is provided. An ion implantation process has been performed on the photoresist layer to transform a surface of the photoresist layer to a crust and a soft photoresist layer remains within the crust. The method includes performing a first removing step to remove the crust, such that the soft photoresist layer is exposed. Thereafter, a second removing step is performed to remove the soft photoresist layer. The first and the second removing steps are performed in difference chambers, and a temperature for performing the first removing step is lower than that for performing the second removing step and lower than a gasification temperature of a solvent in the soft photoresist layer.