Abstract: An interposer, including a redistribution layer structure, first conductive terminals, and second conductive terminals, is provided. The first conductive terminals are disposed on a first surface and are electrically connected to the second conductive terminals. An orthographic projection area of the first conductive terminals on the redistribution layer structure is inside a circuit range outline. There is a first pitch between the adjacent first conductive terminals. The second conductive terminals are disposed on a second surface. An orthographic projection area of a first part of the second conductive terminals on the redistribution layer structure is inside the circuit range outline. An orthographic projection area of a second part of the second conductive terminals on the redistribution layer structure is outside the circuit range outline. There is a second pitch between the adjacent second conductive terminals. The second pitch is greater than the first pitch. A semiconductor package is also provided.

Abstract: An interface of integrated circuit (IC) die includes a plurality of the contact elements formed as a contact element pattern corresponding to a parallel bus. The contact elements are arranged in an array of rows and columns and divided into a transmitting group and a receiving group. The contact elements of the transmitting group have a first contact element sequence and the contact elements of the receiving group have a second contact element sequence, the first contact element sequence is identical to the second contact element sequence. The contact elements with the first contact element sequence and the second contact element sequence are matched when the contact element pattern is geometrically rotated by 180° with respect to a row direction and a column direction.

Abstract: An interposer, including a redistribution layer structure, first conductive terminals, and second conductive terminals, is provided. The first conductive terminals are disposed on a first surface and are electrically connected to the second conductive terminals. An orthographic projection area of the first conductive terminals on the redistribution layer structure is inside a circuit range outline. There is a first pitch between the adjacent first conductive terminals. The second conductive terminals are disposed on a second surface. An orthographic projection area of a first part of the second conductive terminals on the redistribution layer structure is inside the circuit range outline. An orthographic projection area of a second part of the second conductive terminals on the redistribution layer structure is outside the circuit range outline. There is a second pitch between the adjacent second conductive terminals. The second pitch is greater than the first pitch. A semiconductor package is also provided.

Abstract: A circuit board device includes a multilayer structure, a main ground area and a circuit module. The multilayer structure includes a plurality of plates. The main ground area is arranged in the multilayer structure. The circuit module includes a differential signal circuit and a surrounding circuit module. The differential signal circuit is located in the multilayer structure, and includes a positive signal pad and a negative signal pad. The positive signal pad is located on a configuration surface of one of the plates. The negative signal pad is located on the disposition surface, and is separated from the positive signal pad. The surrounding circuit module is located on the disposition surface, and electrically connected to the main ground area. The surrounding circuit module surrounds the positive signal pad and the negative signal pad in an enclosing way, and is physically separated from the differential signal circuit.

Abstract: An interface of integrated circuit (IC) die includes a plurality of the contact elements formed as a contact element pattern corresponding to a parallel bus. The contact elements are arranged in an array of rows and columns and divided into a transmitting group and a receiving group. The contact elements of the transmitting group have a first contact element sequence and the contact elements of the receiving group have a second contact element sequence, the first contact element sequence is identical to the second contact element sequence. The contact elements with the first contact element sequence and the second contact element sequence are matched when the contact element pattern is geometrically rotated by 180° with respect to a row direction and a column direction.

Abstract: A hard drive disk carrier for reducing airflow-induced vibration of a hard disk drive includes a bracket assembly configured to removably secure the hard disk drive to a receiving component within an enclosure. The bracket assembly is configured for substantially exposing major surfaces of the hard drive to yield exposed surfaces and for mounting within the enclosure so that a first end of the hard disk drive faces the first end of the enclosure and a second end of the hard disk drive faces the second end of the enclosure. The bracket assembly also includes at least one end member associated with the second end of the hard disk drive. The carrier also includes an airfoil assembly with one or more louvers configured to extend from at least the second end of the hard disk drive and partially cover at least one of the exposed surfaces.

Abstract: A hard drive disk carrier for reducing airflow-induced vibration of a hard disk drive includes a bracket assembly configured to removably secure the hard disk drive to a receiving component within an enclosure. The bracket assembly is configured for substantially exposing major surfaces of the hard drive to yield exposed surfaces and for mounting within the enclosure so that a first end of the hard disk drive faces the first end of the enclosure and a second end of the hard disk drive faces the second end of the enclosure. The bracket assembly also includes at least one end member associated with the second end of the hard disk drive. The carrier also includes an airfoil assembly with one or more louvers configured to extend from at least the second end of the hard disk drive and partially cover at least one of the exposed surfaces.

Abstract: A monitoring system for determining numbers of captured or killed living creatures includes at least one living-creature capture device having functions of luring, or capturing or killing living creatures; at least one camera for capturing images of the living-creature capture devices, the images including photos; an input interface unit connected to the camera for receiving the images from the camera; an operation unit performing logic operations of the system; the operation unit includes a timer for recording times for capturing images; a comparison unit for determining a number of living creatures of the image; and the comparison unit containing a sample database; and a memory unit built in a memory for storing related data of the system. The system can be realized by a specific image processing unit which is combined with a cloud structure; or by a handset; or by a computer; or by a cloud structure.

Abstract: In one aspect of the invention, an LED includes a substrate, an n-type semiconductor layer, a light emitting layer, a p-type semiconductor layer and a transparent conductive layer sequentially stacked on the substrate, and p-type and n-type electrodes. The p-type semiconductor layer has a rough surface region and at least one flat surface region. The transparent conductive layer has a rough surface region and a flat surface region corresponding to the rough surface region and the at least one flat surface region of the p-type semiconductor layer, respectively. The p-type electrode is disposed on the flat surface region of the transparent conductive layer. The n-type electrode is electrically couple to the n-type semiconductor layer.

Abstract: A method for manufacturing a light-emitting diode is described, comprising the following steps. A substrate is provided. An illuminant epitaxial structure is formed on the substrate, wherein the illuminant epitaxial structure comprises a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer stacked on the substrate in sequence, a surface of the second conductivity type semiconductor layer includes at least one epitaxial defect formed therein, and the first conductivity type semiconductor layer and the second conductivity type semiconductor layer are opposite conductivity types. Then, an insulation layer is formed to fill into the epitaxial defect in the second conductivity type semiconductor layer. A transparent electrode layer is formed on the surface of the second conductivity type semiconductor layer.