Abstract: Disclosure is related to a thermoelectric power generator. The generator essentially includes a thermoelectric thin-film element which is such as a thin film used to generate voltages according to a temperature difference. The output electric signals are converted to energy stored in an energy storage element. An output circuit is included to output power. In an exemplary embodiment, the thermoelectric power generator has a contact interface for sensing external temperate. The thermoelectric thin-film element is enabled to output voltages when temperature difference is induced. The generator further has a switch, which is used to control if the power is output. The output element is such as a light-emitting element.

Abstract: Disclosure is to a thin-film coil component, and a charging apparatus. The thin-film coil is composed of spiral thin-film winding. Within the spiral windings, a gap exists between adjacent spiral structure, A first thin-film winding forms a first connection port for connecting external circuit at an external end, and has a first winding terminal at an internal end. An induced electric field can be formed by supplying electric current via the connection port. Further, a thin-film coil component is made when two thin-film coils with the same spiral direction are fabricated on two opposite surfaces of a substrate. An adhesive layer mixed with Ferromagnetic material is used to combine coils and the substrate. An induced electric field is also created when powering this thin-film coil component. Assembly of one or more thin-film coil components can make the charging apparatus used to electrically charge an electronic device which includes a device-end thin-film coil component.

Abstract: A spoke fastening device includes a spoke fastening hole drilled through a spoke bed of a wheel rim for receiving a head and a stem of a nipple and a collar of a ferrule, the collar includes an inner peripheral wall and an outer peripheral wall each having a lower portion for engaging into the spoke fastening hole of the spoke bed, the inner peripheral wall includes an outwardly curved rim for engaging with the spoke bed of the wheel rim, and the outer peripheral wall of the collar includes another outwardly curved rim for engaging with the curved rim of the inner peripheral wall, the head of the nipple flares and deforms the lower portions of the peripheral walls to engage with the spoke bed of the wheel rim.

Abstract: A package structure for a multi-chip integrated circuit (IC) is disclosed and the structure includes substrate having a position for bonding with chips for chip-bonding and having at least a hole for the passage of a gold wire in the course of wire-bonding, a first chip attached to the substrate with a chip bonding agent and being wire-bonded on the substrate and the chip bonding position being opposite to the 2nd chip with the substrate in-between, and the gold wire of the wire-bonding passed through the hole of the substrate from the substrate bonding pad at the substrate and on the same lateral side of the second chip and being connected to the pin pad of the first chip, at least a second chip being flip-chip bonded onto the substrate and the bonding position being at different sides of the bonding between the substrate and the first chip, and a package body including filler of the second chip extended to cover the hole of the substrate and the first chip and the gold wire connected to the substrate and th

Abstract: A fabrication method for solder bump pattern of rear section wafer package is disclosed and the method includes the steps of: (a) pattern-etching the wafer at a passivation layer for the positioning of the solder bump; (b) depositing the entire under bump metal layer,

Abstract: A method of wire bonding of a semiconductor device for resolving oxidation of copper bonding pad is disclosed. The method comprises the steps of exposing the copper bonding pad of a wafer which has been completed with semiconductor circuit fabrication; covering the copper bonding pad of the wafer with a protective anti-oxidization film which will be vaporized when heated; performing wire bonding directly without requiring the removal of the protective film, employing ultrasonic vibration energy, pressurizing deformation energy and heat energy in the course of bonding to vaporize the protective film so that the metal wire and the copper pad form a large area intermetallic compound layer for bonding.

Abstract: An open-typed multi-chip stack-packaging is disclosed and the packaging comprises a substrate having a first surface and a second surface, at least a through opening formed on the substrate, and including at least two layers of circuitry to electrically transmit signals; at least a first chip positioned on the upper section of the opening of the first surface and a plurality of protruded blocks being soldered onto the circuitry on the first surface of the substrate at the external region of the substrate for electrically connection; at least a second chip stacked onto the first chip and the second chip being connected electrically to the circuitry of the first surface with gold lines; at least a third chip positioned at the lower section of the opening of the second surface and having a size smaller than the first chip, and a plurality of protruded blocks being used to electrically bond with the center position of the first chip, and adhesive being used to fill the first chip and the third chip, and the regio