Patents by Inventor Yu-Jui Chen

Yu-Jui Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170210612
    Abstract: The present disclosure relates to a MEMS package with a rough metal anti-stiction layer, to improve stiction characteristics, and an associated method of formation. In some embodiments, the MEMS package includes a MEMS IC bonded to a CMOS IC. The CMOS IC has a CMOS substrate and an interconnect structure disposed over the CMOS substrate. The interconnect structure includes a plurality of metal layers disposed within a plurality of dielectric layers. The MEMS IC is bonded to an upper surface of the interconnect structure and, in cooperation with the CMOS IC, enclosing a cavity between the MEMS IC and the CMOS IC. The MEMS IC has a moveable mass arranged in the cavity. The MEMS package further includes an anti-stiction layer disposed on the upper surface of the interconnect structure under the moveable mass. The anti-stiction layer is made of metal and has a rough top surface.
    Type: Application
    Filed: January 26, 2016
    Publication date: July 27, 2017
    Inventors: Yu-Jui Chen, I-Shi Wang, Ren-Dou Lee, Jen-Hao Liu
  • Patent number: 9481567
    Abstract: A micro electro mechanical system (MEMS) structure is provided, which includes a first substrate, a second substrate, a MEMS device and a hydrophobic semiconductor layer. The first substrate has a first portion. The second substrate is substantially parallel to the first substrate and has a second portion substantially aligned with the first portion. The MEMS device is between the first portion and the second portion. The hydrophobic semiconductor layer is made of germanium (Ge), silicon (Si) or a combination thereof on the first portion, the second portion or the first portion and the second portion and faces toward the MEMS device. A cap substrate for a MEMS device and a method of fabricating the same are also provided.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: November 1, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: I-Shi Wang, Yu-Jui Chen, Ting-Ying Chien, Jen-Hao Liu, Ren-Dou Lee
  • Publication number: 20160222334
    Abstract: A fermentation monitoring device includes a cap body for sealing an opening of a bottle in which a fermentation process is to occur, a detecting unit and a processor. The detecting unit is configured to continuously monitor an environment parameter in a fermentation space defined by the cap body and the bottle. The processor is operable to: estimate when the fermentation process is to be completed, based on a value of the environment parameter; determine whether the value of the environment parameter is within a predetermined range; and generate an alert response when the determination is affirmative.
    Type: Application
    Filed: December 2, 2015
    Publication date: August 4, 2016
    Inventors: Tsan-Hao YANG, Ching-Yen CHANG, Yu-Jui CHEN, Yu-Wen HUANG
  • Publication number: 20150360938
    Abstract: A micro electro mechanical system (MEMS) structure is provided, which includes a first substrate, a second substrate, a MEMS device and a hydrophobic semiconductor layer. The first substrate has a first portion. The second substrate is substantially parallel to the first substrate and has a second portion substantially aligned with the first portion. The MEMS device is between the first portion and the second portion. The hydrophobic semiconductor layer is made of germanium (Ge), silicon (Si) or a combination thereof on the first portion, the second portion or the first portion and the second portion and faces toward the MEMS device. A cap substrate for a MEMS device and a method of fabricating the same are also provided.
    Type: Application
    Filed: June 12, 2014
    Publication date: December 17, 2015
    Inventors: I-Shi Wang, Yu-Jui Chen, Ting-Ying Chien, Jen-Hao Liu, Ren-Dou Lee