Abstract: A heat insulation pad applied to an electronic device is provided. The electronic device includes a housing and a heat source. The housing includes an inner side surface. The heat insulation pad includes a first contact layer, a second contact layer, and a hole layer stack structure. The first contact layer is adapted to attach to the inner side surface. The second contact layer is adapted to contact the heat source. The hole layer stack structure includes a plurality of hole layers stacked in sequence and is located between the first contact layer and the second contact layer. An electronic device with the heat insulation pad is further provided.

Abstract: An oral pharmaceutical composition includes a metal complex and an outer layer. The metal complex is formed by coordinate bonding of an organic compound to a metal ion, and the organic compound is an aromatic compound and includes at least two oxygen atoms. The outer layer includes a ?-glucan, and the ?-glucan is dispersed outside the metal complex and coordinately bonded to the metal complex to form the outer layer.

Abstract: Provided is an herbal composition including an extract from an herbal raw material including at least one of Artemisia argyi, Ohwia caudata, Anisomeles indica (L.) O. Ktze, Ophiopogon japonicus, Houttuynia cordata, Platycodon grandiflorus, Glycyrrhiza uralensis, Perilla frutescens, and chrysanthemum. Also provided is a method for preparing the herbal composition and a method for preventing or treating a viral infection by administering an effective amount of the herbal composition to a subject in need thereof.

Abstract: Provided is a pre-conditioned mesenchymal stem cell (MSC), an exosome derived therefrom, and a cell-protective composition including the pre-conditioned MSC or the exosome. Also provided is a method for preparing the pre-conditioned MSC by contacting an MSC with an effective amount of ginkgolide A. Still provided is a method for promoting recovery or reducing death of damaged nerve cells, including administering to the damaged nerve cells a composition including the pre-conditioned MSC or the exosome.

Abstract: The various embodiments provide a semiconductor chip holder that holds semiconductor chips. The chip holder protects the semiconductor chips from possible damage during transport and/or storage. The chip holder is flexible and may be wound around a reel for convenient transport and storage. In one embodiment, the chip holder includes a support substrate with receptacles that receive semiconductor chips, a cover layer that seals the receptacles and holds the semiconductor chips within the receptacles, and plugs to securely couple the support substrate and the cover layer together.

Abstract: An immunomagnetic nanocapsule includes a core, a shell and an outer layer. The shell is formed by a complex, and the complex is fabricated by a combination of fucoidan, oxidized dextran, and a plurality of superparamagnetic iron oxide nanoparticles via a hydrophobic interaction. The core is encapsulated in the shell. The outer layer includes at least one antibody immobilized to outside of the shell to form the outer layer, wherein the antibody is an immune checkpoint inhibitor and/or a T cell expansion antibody.

Abstract: The various embodiments provide a semiconductor chip holder that holds semiconductor chips. The chip holder protects the semiconductor chips from possible damage during transport and/or storage. The chip holder is flexible and may be wound around a reel for convenient transport and storage. In one embodiment, the chip holder includes a support substrate with receptacles that receive semiconductor chips, a cover layer that seals the receptacles and holds the semiconductor chips within the receptacles, and plugs to securely couple the support substrate and the cover layer together.

Abstract: Packaging method and wafer structures are described. A semiconductor wafer having dies, scribe streets surrounding the dies and between the dies and test pads in the scribe streets is provided. Wafer testing is performed to the semiconductor wafer through the test pads. A laser grooving process is performed to the semiconductor wafer along the scribe streets and the test pads in the scribe streets are removed to form laser scanned regions in the scribe streets. A mechanical dicing process is performed cutting through the semiconductor wafer along the scribe streets to singulate the dies. The singulated dies are packaged.

Abstract: An immunomagnetic nanocapsule includes a core, a shell and an outer layer. The shell is formed by a complex, and the complex is fabricated by a combination of fucoidan, oxidized dextran, and a plurality of superparamagnetic iron oxide nanoparticles via a hydrophobic interaction. The core is encapsulated in the shell. The outer layer includes at least one antibody immobilized to outside of the shell to form the outer layer, wherein the antibody is an immune checkpoint inhibitor and/or a T cell expansion antibody.

Abstract: The present disclosure provides a temperature-responsive composition including a nitric oxide donor and a carrier. The nitric oxide donor is a pH-dependent material, and the carrier is provided for carrying the nitric oxide donor with an effective amount. The carrier includes a protective agent and an organic protic acid. A transition temperature of the temperature-responsive composition is larger than or equal to 28° C. and less than or equal to 37° C.

Abstract: Methods of treating brain ischema or hypoxia by using an inhibitor of cysteine-glutamate transporter (i.e. system xc?) is provided. The inhibitor includes sorafenib and a derivative thereof, erastin, and suifasalazine. These inhibitors can effectively decrease a concentration of extracellular glutamate, so that excitotoxicity to central nervous system (CNS) and a cortical infarct volume in brains can be reduced.