Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.

Abstract: In a method for obtaining the equivalent oxide thickness of a dielectric layer, a first semiconductor capacitor including a first silicon dioxide layer and a second semiconductor capacitor including a second silicon dioxide layer are provided and a modulation voltage is applied to the semiconductor capacitors to measure a first scanning capacitance microscopic signal and a second scanning capacitance microscopic signal. According to the equivalent oxide thicknesses of the silicon dioxide layers and the scanning capacitance microscopic signals, an impedance ratio is calculated. The modulation voltage is applied to a third semiconductor capacitor including a dielectric layer to measure a third scanning capacitance microscopic signal. Finally, the equivalent oxide thickness of the dielectric layer is obtained according to the equivalent oxide thickness of the first silicon dioxide layer, the first scanning capacitance microscopic signal, third scanning capacitance microscopic signal, and the impedance ratio.

Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.

Abstract: A semiconductor device and method of manufacture are provided. In some embodiments isolation regions are formed by modifying a dielectric material of a dielectric layer such that a first portion of the dielectric layer is more readily removed by an etching process than a second portion of the dielectric layer. The modifying of the dielectric material facilitates subsequent processing steps that allow for the tuning of a profile of the isolation regions to a desired geometry based on the different material properties of the modified dielectric material.

Abstract: A microfluidic chip suitable for controlling movement and detecting position of a microfluid includes a first substrate, a second substrate, first scan lines, first signal lines, second scan lines, second signal lines, actuating units, and heating units. The first scan lines and the first signal lines are disposed on the first substrate. The second scan lines and the second signal lines are disposed on the second substrate. The actuating units each have a first active device and a driving electrode. The first active device is electrically connected to one of the first scan lines, one of the first signal lines, and the driving electrode. The heating units are respectively disposed corresponding to the actuating units, and each have a second active device and a negative temperature coefficient thermistor. The second active device is electrically connected to one of the second scan lines and one of the second signal lines.

Abstract: A pulse sensor and a pulse sensing system are provided. The pulse sensor includes a pressure sensing circuit, a reference circuit, and an output circuit. The pressure sensing circuit may sense a pulse vibration to generate a sensing signal. The reference circuit may generate a reference signal according to a base signal. A first input terminal of the output circuit is coupled to the pressure sensing circuit. A second input terminal of the output circuit is coupled to the reference circuit. The output circuit generates a pulse sensing current at an output terminal of the output circuit according to a difference between the sensing signal and the reference signal.

Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.

Abstract: A sensing component includes multiple piezoelectric pressure sensors. The piezoelectric pressure sensor includes a piezoelectric material layer, a thin film transistor array and an induced electrode. The piezoelectric material layer is configured to measure pulse at multiple positions to generate the corresponding multiple pulse signals. The thin film transistor array electrically coupled to the piezoelectric material layer includes multiple transistors. The transistor includes a first terminal, a second terminal and a control terminal. The first terminal is configured to receive one of the pulse signals. The second terminal coupled to a data line is configured to output a first sensing signal according to the one of the pulse signals. The control terminal is configured to receive a clock signal. The induced electrode coupled to the piezoelectric material layer is configured to receive another one of the pulse signals to output a second sensing signal.

Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.

Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.

Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.

Abstract: A fingerprint sensing panel and a fingerprint sensor thereof are provided. The fingerprint sensor includes first to third switches, a first capacitor, an impedance variation element and a sensing circuit. The first switch receives a system high voltage and is controlled by a pre-charge signal. The first capacitor is coupled between the first switch and a reference voltage. The impedance variation element is coupled between the first switch and the reference voltage, and an impedance value of the impedance variation element is changed according to a vertical distance between the impedance variation element and a skin surface. The second switch receives the system high voltage. The third switch receives a read signal. The sensing circuit is coupled to the third switch and provides a fingerprint determination voltage.

Abstract: A fingerprint-sensing apparatus is provided. The fingerprint-sensing apparatus includes a fingerprint-sensing pixel array and a plurality of read-out circuits. The fingerprint-sensing pixel array has a plurality of fingerprint-sensing pixel columns, and each of the plurality of fingerprint sensing pixel columns includes a plurality of fingerprint-sensing pixels. Each of the plurality of fingerprint-sensing pixels includes a scanning switch and a thermosensitive current generation circuit. The scanning switch is controlled by a row scanning signal. The thermosensitive current generation circuit generates a thermosensitive current according to the fingerprint-sensing pixel corresponding to a fingerprint ridge or a fingerprint valley. The plurality of read-out circuits is respectively coupled to the plurality of fingerprint-sensing pixel columns.

Abstract: A sensing component includes multiple piezoelectric pressure sensors. The piezoelectric pressure sensor includes a piezoelectric material layer, a thin film transistor array and an induced electrode. The piezoelectric material layer is configured to measure pulse at multiple positions to generate the corresponding multiple pulse signals. The thin film transistor array electrically coupled to the piezoelectric material layer includes multiple transistors. The transistor includes a first terminal, a second terminal and a control terminal. The first terminal is configured to receive one of the pulse signals. The second terminal coupled to a data line is configured to output a first sensing signal according to the one of the pulse signals. The control terminal is configured to receive a clock signal. The induced electrode coupled to the piezoelectric material layer is configured to receive another one of the pulse signals to output a second sensing signal.

Abstract: A fingerprint sensing panel and a fingerprint sensor thereof are provided. The fingerprint sensor includes first to third switches, a first capacitor, an impedance variation element and a sensing circuit. The first switch receives a system high voltage and is controlled by a pre-charge signal. The first capacitor is coupled between the first switch and a reference voltage. The impedance variation element is coupled between the first switch and the reference voltage, and an impedance value of the impedance variation element is changed according to a vertical distance between the impedance variation element and a skin surface. The second switch receives the system high voltage. The third switch receives a read signal. The sensing circuit is coupled to the third switch and provides a fingerprint determination voltage.

Abstract: A fingerprint-sensing apparatus is provided. The fingerprint-sensing apparatus includes a fingerprint-sensing pixel array and a plurality of read-out circuits. The fingerprint-sensing pixel array has a plurality of fingerprint-sensing pixel columns, and each of the plurality of fingerprint sensing pixel columns includes a plurality of fingerprint-sensing pixels. Each of the plurality of fingerprint-sensing pixels includes a scanning switch and a thermosensitive current generation circuit. The scanning switch is controlled by a row scanning signal. The thermosensitive current generation circuit generates a thermosensitive current according to the fingerprint-sensing pixel corresponding to a fingerprint ridge or a fingerprint valley. The plurality of read-out circuits is respectively coupled to the plurality of fingerprint-sensing pixel columns.

Abstract: An identification recognition device includes a light emission module, a light sensing module, a pulse scanning unit, a fingerprint scanning unit and a controller. The light sensing module is used to generate first light currents and second light currents according to first reflecting light and second reflecting light. The pulse scanning unit is used to generate data of current variance of the object and the fingerprint scanning unit is used to generate features of fingerprint of the object. The controller is used to control the light emission module to emit the first incident light and to emit the second incident light when the object has a pulse according to the data of current variance of the object, and determine if the object passes the identification recognition test according to the features of fingerprint of the object.

Abstract: A three-dimensional display device includes a display panel and a barrier structure. The barrier structure is located at one side of the display panel. Besides, the barrier structure includes a plurality of barrier patterns and a plurality of transparent slits. The barrier patterns and the transparent slits are arranged alternately. In particular, the barrier patterns include a photoelectric conversion structure.

Abstract: An identification recognition device includes a light emission module, a light sensing module, a pulse scanning unit, a fingerprint scanning unit and a controller. The light sensing module is used to generate first light currents and second light currents according to first reflecting light and second reflecting light. The pulse scanning unit is used to generate data of current variance of the object and the fingerprint scanning unit is used to generate features of fingerprint of the object. The controller is used to control the light emission module to emit the first incident light and to emit the second incident light when the object has a pulse according to the data of current variance of the object, and determine if the object passes the identification recognition test according to the features of fingerprint of the object.

Abstract: A touch-screen system including a stylus, a display panel and a touch module is disclosed herein. The stylus includes a magnetic component. The touch-sensing module is disposed within the display panel. The touch-sensing module includes a plurality of sensing units distributed at different locations as an array over the display panel. Each of the sensing units includes a Hall induction plate for sensing a magnetic field established by the magnetic component and forming an induction output voltage. The touch module detects a touch position of the stylus according to the induction output voltages from the sensing units.