Abstract: Provided is a heat pipe, which has a simple construction but an excellent heat transfer performance. A loop-type heat pipe (1) has a loop-shaped fluid moving route, in which an evaporation portion (2), a vapor-rich pipe portion (4), a condensation portion (3) and a liquid-rich pipe portion (5) are sequentially connected. A nozzle portion (6) and a diffuser portion (7) are formed in that loop-shaped fluid moving route. As a result, a difference is made between the forward fluid resistance and the backward fluid resistance of the loop-shaped fluid moving route, thereby to form a one-directional steam flow in the loop-shaped fluid moving route.

Abstract: A heat dissipating device has a thermal board, at least one cooling fin, and a working fluid. The thermal board has at least one chamber and a passive one-way valve section. Each of the at least one chamber has a first inlet and at least one first outlet. Each of the at least one cooling fin has an inner space, at least one second inlet, and a second outlet. The second inlet is connected to the first outlet. The second outlet is connected to the first inlet. The working fluid is filled in the chamber and the inner space. The passive one-way valve section is configured to limit the working fluid to cycle in the chamber and the inner space along a single direction. The heat dissipating device facilitates the cycling capability of two phases flow coolant and provides a heat dissipating capability.

Abstract: A heat dissipation structure has a heat dissipation base and at least one heat conduction assembly mounted in a through hole of the heat dissipation base. Each of the at least one heat conduction assembly includes a resilient clamp and a heat pipe. When a transceiver is inserted in the through hole of the heat dissipation base, two heat conducting sections of the heat pipe are pushed by the resilient clamp to abut against the transceiver and the heat dissipation base respectively. Heat generated while the transceiver is operating can be quickly and efficiently conducted through the heat pipe to the heat dissipation base and then dissipated. Temperature increase of the transceiver can be effectively avoided and performance and reliability of the transceiver during operation can be ensured.

Abstract: A heat dissipation structure has a heat dissipation base and at least one heat conduction assembly mounted in a through hole of the heat dissipation base. Each of the at least one heat conduction assembly includes a resilient clamp and a heat pipe. When a transceiver is inserted in the through hole of the heat dissipation base, two heat conducting sections of the heat pipe are pushed by the resilient clamp to abut against the transceiver and the heat dissipation base respectively. Heat generated while the transceiver is operating can be quickly and efficiently conducted through the heat pipe to the heat dissipation base and then dissipated. Temperature increase of the transceiver can be effectively avoided and performance and reliability of the transceiver during operation can be ensured.