Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, an isolation structure on the SDB structure, a first spacer adjacent to the isolation structure, a metal gate adjacent to the isolation structure, a shallow trench isolation (STI around the fin-shaped structure, and a second isolation structure on the STI. Preferably, a top surface of the first spacer is lower than a top surface of the isolation structure and a bottom surface of the first spacer is lower than a bottom surface of the metal gate.

Abstract: A method for fabricating a semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a first metal interconnection and a second metal interconnection in the first IMD layer; forming a channel layer on the first metal interconnection and the second metal interconnection; forming a magnetic tunneling junction (MTJ) stack on the channel layer; and removing the MTJ stack to form a MTJ.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a spacer around the gate structure; and forming a buffer layer adjacent to the gate structure. Preferably, the buffer layer includes a crescent moon shape and the buffer layer includes an inner curve, an outer curve, and a planar surface connecting the inner curve and an outer curve along a top surface of the substrate, in which the planar surface directly contacts the outer curve on an outer sidewall of the spacer.

Abstract: A method of forming a single-crystal group-III nitride is provided in the present invention. In some embodiments, the method includes the following steps. First, a molybdenum disulfide (MoS2) is formed on a remote substrate. Then, the MoS2 is transferred onto a substrate. Next, a sputtering operation is performed to epitaxially grow a single-crystal group-III nitride layer on the MoS2, so as to form the single-crystal group-III nitride layer on the substrate such as a Si substrate or a flexible substrate.

Abstract: A display device includes a supporting frame, a display panel, an optical film assembly, and a light-penetrated adhesive member. The supporting frame includes a first supporting portion, and the display panel is disposed on the supporting frame. The display panel includes a pixel region and a non-pixel region, and the non-pixel region is disposed outside of the pixel region. The optical film assembly is partially disposed between the first supporting portion and the display panel. The light-penetrated adhesive member is disposed between the first supporting portion of the supporting frame and the optical film assembly. The light-penetrated adhesive member includes a first portion disposed corresponding to the non-pixel region and a second portion disposed corresponding to the pixel region. The configuration can achieve the narrow border design, provide a sufficient structural strength, or improve the light leakage or shadow issue at the edge of the active area.

Abstract: A display device includes a supporting frame, a display panel, an optical film assembly, and a light-penetrated adhesive member. The supporting frame includes a first supporting portion, and the display panel is disposed on the supporting frame. The display panel includes a pixel region and a non-pixel region, and the non-pixel region is disposed outside of the pixel region. The optical film assembly is partially disposed between the first supporting portion and the display panel. The light-penetrated adhesive member is disposed between the first supporting portion of the supporting frame and the optical film assembly. The light-penetrated adhesive member includes a first portion disposed corresponding to the non-pixel region and a second portion disposed corresponding to the pixel region. The configuration can achieve the narrow border design, provide a sufficient structural strength, or improve the light leakage or shadow issue at the edge of the active area.

Abstract: A secondary optical element including a light incidence surface, a light emitting surface, and a connecting surface is provided. The light incidence surface includes a first and a second light incidence surfaces. The first light incidence surface is a curved surface recessed toward the light emitting surface. The light emitting surface is opposite to the light incidence surface and includes a first and a second light emitting surfaces. The first light emitting surface is a free-form surface recessed toward the light incidence surface or a flat surface. The second light emitting surface is a free-form surface. A diameter of the second light emitting surface is larger than a diameter of the second light incidence surface, and the connecting surface is connected between the second light incidence surface and the second light emitting surface. A light source module is also provided.

Abstract: An optical film adapted to be disposed over a light source is provided. The optical film includes a substrate, a plurality of columnar prismatic units, and a plurality of lenticular lenses. The substrate has a first surface and a second surface, wherein the first surface is located between the second surface and the light source. The columnar prismatic units comprises a plurality of columnar prisms protruding from the first surface or a plurality of prismatic recesses indented in the first surface, and the plurality of columnar prismatic units are arranged along a first direction and respectively extend along a second direction. The lenticular lenses are protruded from the second surface. The lenticular lenses are arranged along the first direction and respectively extend along the second direction. A light source module is also provided.

Abstract: A secondary optical element including a light incidence surface, a light emitting surface, and a connecting surface is provided. The light incidence surface includes a first and a second light incidence surfaces. The first light incidence surface is a curved surface recessed toward the light emitting surface. The light emitting surface is opposite to the light incidence surface and includes a first and a second light emitting surfaces. The first light emitting surface is a free-form surface recessed toward the light incidence surface or a flat surface. The second light emitting surface is a free-form surface. A diameter of the second light emitting surface is larger than a diameter of the second light incidence surface, and the connecting surface is connected between the second light incidence surface and the second light emitting surface. A light source module is also provided.