Abstract: An electronic component includes a first support member having a third main surface and a fourth main surface, at least a partial portion of the third main surface supporting at least a partial portion of the second main surface of the semiconductor substrate, and a second support member having a fifth main surface and a sixth main surface, at least a partial portion of the fifth main surface supporting at least a partial portion of the fourth main surface of the first support member. In a case where the electronic component is seen through from a direction perpendicular to the first main surface, the semiconductor substrate has a first region and a second region adjoining an outer side of the first region, the semiconductor substrate does not overlap any of the first support member and the second support member in the first region.

Abstract: An electronic component is provided. The component includes: a base member, a Peltier element; a semiconductor element placed on a placement surface of the base member via the Peltier element; and a frame member arranged so as to surround a side surface of the semiconductor element. A first electrode provided in the semiconductor element is connected, via a conductive wire, to a second electrode provided in the frame member, and the base member and the frame member are bonded by a bonding member having a lower thermal conductivity than the base member.

Abstract: An electronic component including a support substrate and a photoelectric conversion substrate is provided. The photoelectric conversion substrate includes a photoelectric conversion region and a peripheral region in which a first electrode is arranged. The first electrode is connected to a second electrode arranged on the support substrate via a wire. A first portion, arranged on the photoelectric conversion substrate, of the wire includes at least one bent portion, the wire is arranged within a range of not more than 200 ?m from a surface of the first electrode, and a portion, from the first electrode to a first height, of the first portion has a maximum angle not larger than 30° with respect to a normal direction of the surface where the first height is ½ of a maximum height of the wire from the surface.

Abstract: An electronic component includes a substrate provided with a semiconductor element, a frame body provided over the substrate, and a lid body fixed to the frame body. The frame body has a first face in contact with the substrate and a second face facing the lid body. The second face includes a first region to which the lid body is bonded, a second region located inside the first region and provided with a concave portion, and a third region located inside the second region and provided with a convex portion. A height of a tip of the convex portion is lower than a height of a bonding face between the frame body and the lid body and is higher than a height of a bottom of the concave portion.

Abstract: An electronic component includes a substrate having a first surface, a circuit board having a second surface facing the first surface, and an optical member having a third surface facing the first surface. The first surface of the substrate has a central region where a plurality of elements are arranged, the second surface of the circuit board is arranged above the first surface so as not to cover the central region, the third surface of the optical member is arranged above the central region without intervening the circuit board so as to have a space between the first surface and the third surface, and a plurality of microlenses are arranged on the third surface of the optical member.

Abstract: An electronic component includes a cooling member, a semiconductor substrate, and a base member in which the cooling member and the semiconductor substrate are placed, wherein the cooling member is arranged between the base member and the semiconductor substrate, wherein the semiconductor substrate includes a first electrode, wherein the base member includes a second electrode, wherein the first electrode and the second electrode are connected by a conductive wire, and wherein balls are formed on both of a bonded portion of the first electrode and the conductive wire, and a bonded portion of the second electrode and the conductive wire.

Abstract: Provided is a signal processing device including a first substrate, a signal generation circuit arranged in the first substrate and configured to generate a reference signal to be used for comparison with a signal output from a pixel, a circuit element arranged in the first substrate and different from the signal generation circuit, and a contact region in which a contact connecting the first substrate and a wiring layer arranged over the first substrate is arranged. In a plan view with respect to the first substrate, the contact region is arranged between the signal generation circuit and the circuit element.

Abstract: An electronic component comprising a base, an electronic device including a first surface having a region facing the base and a second surface on an opposite side to the first surface, a support arranged between the electronic device and the base, a conductive wire connecting a first terminal arranged in the second surface and a second terminal arranged in a third surface of the base, and a resin member arranged to cover the conductive wire, is provided. The support includes a fourth surface facing the first surface, a fifth surface on an opposite side to the fourth surface and a side surface. The resin member covers at least part of the side surface, and the support includes a chamfered portion between the side surface and at least one of the fourth principal surface and the fifth principal surface.

Abstract: An electronic component includes a first support member having a third main surface and a fourth main surface, at least a partial portion of the third main surface supporting at least a partial portion of the second main surface of the semiconductor substrate, and a second support member having a fifth main surface and a sixth main surface, at least a partial portion of the fifth main surface supporting at least a partial portion of the fourth main surface of the first support member. In a case where the electronic component is seen through from a direction perpendicular to the first main surface, the semiconductor substrate has a first region and a second region adjoining an outer side of the first region, the semiconductor substrate does not overlap any of the first support member and the second support member in the first region.

Abstract: An electronic component that includes a base body with an electronic device placed on a placement surface, and a lid including a surface facing the electronic device and fixed to the base body, is provided. On the surface of the lid, a thin film in contact with the surface is arranged. In an orthogonal projection with respect to the placement surface, the thin film comprises a first portion including a region which overlaps the electronic device, and a second portion arranged so as to surround the first portion and including an outer edge of the thin film, and the second portion applies, to a portion of the lid in contact with the second portion, a force in a direction from a center of the thin film toward the outer edge.

Abstract: An electronic component includes an electronic device and a container configured to house the electronic device. The container includes a support configured to support the electronic device, and a quartz plate having a principal plane facing the electronic device, and an angle ? formed by the principal plane and an optical axis of the quartz plate satisfies |3|°<?<|42|° or |48|°<?<|87|°.

Abstract: The photoelectric conversion device includes a pixel including a photoelectric conversion element and outputting a signal corresponding to an amount of charge generated in the photoelectric conversion element, an output line from which a signal of the pixel is output, a clip circuit constituting a source follower circuit and including a transistor having a source connected to the output line and an interconnection connected to a gate of the transistor, and a voltage supply circuit configured to supply a first voltage and a second voltage to the interconnection. A driving power when the interconnection is controlled to the first voltage by the voltage supply circuit and a driving power when the interconnection is controlled to the second voltage by the voltage supply circuit is different.

Abstract: A conversion apparatus includes a conversion unit, a first transistor configured to receive a charge in the conversion unit at a gate thereof, a second transistor connected to the gate, a signal line configured such that a signal is output from the first transistor thereto, a third transistor provided in a path between the signal line and the first transistor, a first line configured to supply a potential for turning off the second transistor, a second line configured to supply a potential for turning off the third transistor that is a common potential also used as the potential for turning off the second transistor, and an isolator connected to the first line and the second line.

Abstract: An electronic module comprises a substrate including a first surface and a second surface on a side opposite to the first surface, the second surface including a first region and a second region surrounding the first region, an electronic device attached to the first surface, a component attached to the first region of the second surface, a lid member positioned to face the electronic device, and a frame member attached to the substrate to support the lid member. A first member and a second member having a higher thermal conductivity than the first member are disposed at least on the second surface. At least a part of the second member is positioned to face the second region. At least a part of the first member is positioned between the second member and the component.

Abstract: A photoelectric conversion device includes a structure in which first and second substrates are stacked. The first substrate includes pixels, first vertical signal lines extending parallel to a first direction, and first joints respectively electrically connected to the first vertical signal lines. The second substrate includes second joints respectively electrically connected to the first joints, second vertical signal lines arranged so as to extend parallel to the first direction, column circuits respectively electrically connected to the second vertical signal lines, connecting lines respectively electrically connected to the second joints, and extending parallel to a second direction orthogonal to the first direction, and an interlayer connection configured to electrically connect each of the second vertical signal lines and the corresponding connecting line of the connecting lines.

Abstract: A photoelectric conversion apparatus comprises a first substrate having a light-receiving array and a plurality of driving lines for supplying control signals to the array and a second substrate having a first circuit that includes a driver circuit group configured to generate the control signals and is configured to function as a vertical scanning circuit which supplies the control signals to at least some of the driving lines and a second circuit including a circuit group having the same arrangement as that of the driver circuit group. The second circuit overlaps the at least some driving lines. The at least some driving lines include a driving line not electrically connected to the second circuit. The second substrate includes, at a position overlapping the second circuit, an electrically conductive line used for power supply or transfer of a signal different from the control signals.

Abstract: Provided is a photoelectric conversion device including a pixel array in which pixels, each of the pixels including a photoelectric conversion element, are arranged in columns, a signal line that is arranged corresponding to one of the columns in the pixel array and to which a signal from the pixel is output, a current source configured to supply the signal line with a driving current; a current adjusting unit configured to control the driving current into a current amount including a first current amount and a second current amount greater than the first current amount, and an assisting element configured to assist a change in a current flowing through the signal line when the driving current changes from the first current amount to the second current amount. The first current amount is a current amount in a state where the driving current is disconnected.

Abstract: The photoelectric conversion device includes a pixel including a photoelectric conversion element and outputting a signal corresponding to an amount of charge generated in the photoelectric conversion element, an output line from which a signal of the pixel is output, a clip circuit constituting a source follower circuit and including a transistor having a source connected to the output line and an interconnection connected to a gate of the transistor, and a voltage supply circuit configured to supply a first voltage and a second voltage to the interconnection. A driving power when the interconnection is controlled to the first voltage by the voltage supply circuit and a driving power when the interconnection is controlled to the second voltage by the voltage supply circuit is different.

Abstract: A conversion apparatus includes a conversion unit, a first transistor configured to receive a charge in the conversion unit at a gate thereof, a second transistor connected to the gate, a signal line configured such that a signal is output from the first transistor thereto, a third transistor provided in a path between the signal line and the first transistor, a first line configured to supply a potential for turning off the second transistor, a second line configured to supply a potential for turning off the third transistor that is a common potential also used as the potential for turning off the second transistor, and an isolator connected to the first line and the second line.

Abstract: Provided is a signal processing device including a first substrate, a signal generation circuit arranged in the first substrate and configured to generate a reference signal to be used for comparison with a signal output from a pixel, a circuit element arranged in the first substrate and different from the signal generation circuit, and a contact region in which a contact connecting the first substrate and a wiring layer arranged over the first substrate is arranged. In a plan view with respect to the first substrate, the contact region is arranged between the signal generation circuit and the circuit element.