Abstract: A power converter includes a circuit board, a first magnetic core, and a housing. The circuit board includes an insulating substrate and a first coil conductor. The insulating substrate includes a first side surface. The first magnetic core includes a first magnetic core member and a second magnetic core member. A first side surface of the insulating substrate is opposed to a first portion of the housing and is spaced away from the first portion of the housing. The first magnetic core member and the second magnetic core member are both thermally connected to the first portion.

Abstract: Provided is a power conversion device, including: a casing having a recessed portion; a magnetic component accommodated in the recessed portion of the casing; a heat radiation plate, which covers an opening of the recessed portion of the casing, and is thermally coupled to the magnetic component; and a fixing band wound around the magnetic component and the heat radiation plate to fix the magnetic component to the heat radiation plate, wherein at least a part of the fixing band is accommodated in a band accommodating groove formed in the recessed portion of the casing. With this configuration, assembly dimensional tolerance caused between the magnetic component and the heat radiation plate can be eliminated and it is therefore possible to maintain high output and achieve downsizing.

Abstract: Provided is an electric power converter, including: a casing; a heat radiating plate having a first main surface and a second main surface; and a substrate which is fixed to the main surface and to which a heat generating component is mounted, wherein the casing has an inner wall surface in which a first tapered portion is formed, wherein the heat radiating plate includes a second tapered portion which is connected to the first tapered portion in a heat exchangeable manner and slid with respect to the first tapered portion, wherein the heat radiating plate is configured to be displaced in a first direction with respect to the casing by the second tapered portion being slid with respect to the first tapered portion, and wherein the heat generating component is connected to the casing in a heat exchangeable manner by the heat radiating plate being displaced in the first direction.

Abstract: A power converter includes a cooler, a housing, a cooling plate, an insulating heat dissipation member, and a circuit board. The housing includes a bottom, a sidewall, and an internal space. The bottom is connected to the cooler. The cooling plate is connected to the bottom so as to stand upright with respect to the bottom. The insulating heat dissipation member is disposed on the cooling plate. The circuit board is connected to the cooling plate with the insulating heat dissipation member interposed therebetween. The cooling plate, the insulating heat dissipation member, and the circuit board are accommodated in the internal space of the housing. The cooling plate is disposed with a gap from the sidewall.

Abstract: The present application has an object of restricting a temperature rise caused by heat generated by an electronic part or a connection member mounted on a substrate, and includes a first heat conducting member that thermally couples the bus bar extended to a housing side and the housing, a second heat conducting member that thermally couples a capacitor and the housing, and a third heat conducting member that thermally couples a semiconductor element and the housing, wherein each of the bus bar, the substrate, the capacitor, and the semiconductor element is cooled.

Abstract: A power converter includes a circuit board, a first magnetic core, and a housing. The circuit board includes an insulating substrate and a first coil conductor. The insulating substrate includes a first side surface. The first magnetic core includes a first magnetic core member and a second magnetic core member. A first side surface of the insulating substrate is opposed to a first portion of the housing and is spaced away from the first portion of the housing. The first magnetic core member and the second magnetic core member are both thermally connected to the first portion.

Abstract: Provided is an electric power converter, including: a casing; a heat radiating plate having a first main surface and a second main surface; and a substrate which is fixed to the main surface and to which a heat generating component is mounted, wherein the casing has an inner wall surface in which a first tapered portion is formed, wherein the heat radiating plate includes a second tapered portion which is connected to the first tapered portion in a heat exchangeable manner and slid with respect to the first tapered portion, wherein the heat radiating plate is configured to be displaced in a first direction with respect to the casing by the second tapered portion being slid with respect to the first tapered portion, and wherein the heat generating component is connected to the casing in a heat exchangeable manner by the heat radiating plate being displaced in the first direction.

Abstract: Provided is a power conversion device, including: a casing having a recessed portion; a magnetic component accommodated in the recessed portion of the casing; a heat radiation plate, which covers an opening of the recessed portion of the casing, and is thermally coupled to the magnetic component; and a fixing band wound around the magnetic component and the heat radiation plate to fix the magnetic component to the heat radiation plate, wherein at least a part of the fixing band is accommodated in a band accommodating groove formed in the recessed portion of the casing. With this configuration, assembly dimensional tolerance caused between the magnetic component and the heat radiation plate can be eliminated and it is therefore possible to maintain high output and achieve downsizing.

Abstract: The present application has an object of restricting a temperature rise caused by heat generated by an electronic part or a connection member mounted on a substrate, and includes a first heat conducting member that thermally couples the bus bar extended to a housing side and the housing, a second heat conducting member that thermally couples a capacitor and the housing, and a third heat conducting member that thermally couples a semiconductor element and the housing, wherein each of the bus bar, the substrate, the capacitor, and the semiconductor element is cooled.