Patents by Inventor Yu-Kun Hsiao

Yu-Kun Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8593561
    Abstract: A method and system for facilitating focusing of a camera module are disclosed. The camera module includes an image sensor, a lens cube, a barrel and an adjustable member. An adjustable member can be configured to fine-tune the focal length with respect to an image sensor, so that a lens cube with a shorter or longer focal length can be corrected and integrated into the camera module.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: November 26, 2013
    Assignees: Omnivision Technologies, Inc., Visera Technologies Company Limited
    Inventors: Li-Kai Lee, Yu-Kun Hsiao
  • Publication number: 20130170047
    Abstract: A microlens structure is provided. The microlens structure includes a microlens element having a first refraction index. A first film is disposed on the microlens element, wherein the first film has a second refraction index less than the first refraction index. A second film is disposed on the first film, wherein the second film has a third refraction index less than the second refraction index and greater than a refraction index of air. Further, a fabrication method of the microlens structure is also provided.
    Type: Application
    Filed: December 29, 2011
    Publication date: July 4, 2013
    Inventors: Fu-Tien WENG, Yu-Kun Hsiao
  • Publication number: 20120224094
    Abstract: A method and system for facilitating focusing of a camera module are disclosed. The camera module includes an image sensor, a lens cube, a barrel and an adjustable member. An adjustable member can be configured to fine-tune the focal length with respect to an image sensor, so that a lens cube with a shorter or longer focal length can be corrected and integrated into the camera module.
    Type: Application
    Filed: March 1, 2011
    Publication date: September 6, 2012
    Inventors: Li-Kai LEE, Yu-Kun HSIAO
  • Patent number: 7915903
    Abstract: A chip test method is disclosed and includes: loading chips on a chip tray and fastening a cover plate on the chip tray; loading the chip tray with the cover plate in a chip test device; aligning a probe card of the chip test device with a test unit of the chip tray; testing chips in the chip tray; sorting the passed chips from the failed chips.
    Type: Grant
    Filed: August 17, 2009
    Date of Patent: March 29, 2011
    Assignee: VisEra Technologies Company Limited
    Inventors: Sheng-Feng Lu, Yu-Kun Hsiao
  • Publication number: 20090302875
    Abstract: A chip test method is disclosed and includes: loading chips on a chip tray and fastening a cover plate on the chip tray; loading the chip tray with the cover plate in a chip test device; aligning a probe card of the chip test device with a test unit of the chip tray; testing chips in the chip tray; sorting the passed chips from the failed chips
    Type: Application
    Filed: August 17, 2009
    Publication date: December 10, 2009
    Inventors: Sheng-Feng Lu, Yu-Kun Hsiao
  • Patent number: 7595631
    Abstract: A chip test system including a probe card, a chip tray and a cover plate fastened on the chip tray. The chip tray comprises a socket, a chip contact area, an extension contact area, and an alignment contact point. The socket loads the testing chip and is customized for the tested chip. The chip contact area has a plurality of chip contact points to electrically contact the chip. The extension contact area has a plurality of extension contact points corresponding to the chip contact points to direct test signals into the chip and direct feedback signals out of the chip. The alignment point provides an alignment location for the probe card during the chip test.
    Type: Grant
    Filed: January 11, 2007
    Date of Patent: September 29, 2009
    Assignee: Visera Technologies Company Limited
    Inventors: Sheng-Feng Lu, Yu-Kun Hsiao
  • Publication number: 20080169831
    Abstract: A chip test system including a probe card, a chip tray and a cover plate fastened on the chip tray. The chip tray comprises a socket, a chip contact area, an extension contact area, and an alignment contact point. The socket loads the testing chip and is customized for the tested chip. The chip contact area has a plurality of chip contact points to electrically contact the chip. The extension contact area has a plurality of extension contact points corresponding to the chip contact points to direct test signals into the chip and direct feedback signals out of the chip. The alignment point provides an alignment location for the probe card during the chip test.
    Type: Application
    Filed: January 11, 2007
    Publication date: July 17, 2008
    Inventors: Sheng-Feng Lu, Yu-Kun Hsiao