Patents by Inventor Yu Kyoung Choi

Yu Kyoung Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250132319
    Abstract: Disclosed are an electrode material for a secondary battery and a method of manufacturing the electrode material, capable of reducing lithium side reactions, simplifying processes, and reducing cracks caused by external impact. The electrode material for a secondary battery includes a bonding sheet, an active material layer, and a current collector. The bonding sheet includes a plurality of through-holes penetrating first and second surfaces opposite to each other. The active material layer includes a first layer covering the first surface, a second layer covering the second surface, and a connecting layer formed inside the through-holes to connect the first layer and the second layer. The current collector is attached to the second layer.
    Type: Application
    Filed: October 16, 2024
    Publication date: April 24, 2025
    Applicant: IRM CO.,LTD
    Inventor: Yu Kyoung CHOI
  • Publication number: 20250125336
    Abstract: An electrode for a secondary battery and a method for manufacturing the same are disclosed, which reduces lithium side reactions, has a simple process, and can reduce cracks caused by external impact. The electrode material for a secondary battery according to an exemplary embodiment of the present invention comprises a base film with a plurality of through holes, a binder and a current collector. The binder includes active material particles dispersed therein and is fixed to the through holes. The current collector is attached to the base film.
    Type: Application
    Filed: October 10, 2024
    Publication date: April 17, 2025
    Applicant: IRM CO.,LTD
    Inventor: Yu Kyoung CHOI
  • Patent number: 11596065
    Abstract: Provided are a polyimide film capable of reducing a dielectric constant of a substrate and reducing a thickness and forming a stable via with a low possibility of disconnection, a method for manufacturing the same, and an FPCB including the same. A polyimide film according to an exemplary embodiment of the present invention includes a polyimide layer and a plurality of fluororesin particles dispersed in the polyimide layer. The fluororesin particles have a spherical or flat shape.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: February 28, 2023
    Inventor: Yu Kyoung Choi
  • Publication number: 20220256697
    Abstract: Provided are a polyimide film capable of reducing a dielectric constant of a substrate and reducing a thickness and forming a stable via with a low possibility of disconnection, a method for manufacturing the same, and an FPCB including the same. A polyimide film according to an exemplary embodiment of the present invention includes a polyimide layer and a plurality of fluororesin particles dispersed in the polyimide layer. The fluororesin particles have a spherical or flat shape.
    Type: Application
    Filed: January 19, 2022
    Publication date: August 11, 2022
    Inventor: Yu Kyoung Choi