Abstract: A probe for testing a semiconductor device includes a post having a plate shape and connected to a test substrate. A beam has a first end connected to the post. A tip structure is connected to a second end of the beam. The post includes a front surface having a normal line extending in a first direction. A back surface is located opposite to the front surface. Bumps are disposed on the front surface and are spaced apart from each other. The beam extends in a second direction intersecting the first direction. Each of the bumps protrudes from the front surface in the first direction by a first length.

Abstract: A probe card assembly is provided as follows. A tile fixing substrate is disposed on a printed circuit board. A plurality of ceramic tiles is detachably attached to the tile fixing substrate. Each of the plurality of ceramic tiles comprises a plurality of probes. A plurality of alignment marks is fixed to the tile fixing substrate.

Abstract: A probe includes a beam and at least two tips. The beam transmits test signals to a device under test (DUT). The at least two tips are arranged on a first end portion of the beam in a direction at a predetermined angle to a length direction of the beam and contacts adjacent terminals of the DUT. The beam has a larger width that exceeds a sum of widths of the at least two tips in a width direction of the beam such that the probe has an improved current carrying capacity and is prevented from being damaged due to overcurrent.

Abstract: A probe includes a beam and at least two tips. The beam transmits test signals to a device under test (DUT). The at least two tips are arranged on a first end portion of the beam in a direction at a predetermined angle to a length direction of the beam and contacts adjacent terminals of the DUT. The beam has a larger width that exceeds a sum of widths of the at least two tips in a width direction of the beam such that the probe has an improved current carrying capacity and is prevented from being damaged due to overcurrent.

Abstract: A probe card assembly is provided as follows. A tile fixing substrate is disposed on a printed circuit board. A plurality of ceramic tiles is detachably attached to the tile fixing substrate. Each of the plurality of ceramic tiles comprises a plurality of probes. A plurality of alignment marks is fixed to the tile fixing substrate.

Abstract: A pogo pin may include a housing, a resilient connecting member and a switching unit. The housing may be arranged between a printed circuit board (PCB) and a probing head. The resilient connecting member may be arranged in the housing to electrically connect the PCB with the probing head. The switching unit may be provided in the housing to selectively cut off an electrical connection between the PCB and the probing head. Thus, because the PCB may not require additional switching substrates, the PCB may have a small size so that the probe card may also have a small size. A semiconductor device may be manufactured using the probe card.

Abstract: A pogo pin may include a housing, a resilient connecting member and a switching unit. The housing may be arranged between a printed circuit board (PCB) and a probing head. The resilient connecting member may be arranged in the housing to electrically connect the PCB with the probing head. The switching unit may be provided in the housing to selectively cut off an electrical connection between the PCB and the probing head. Thus, because the PCB may not require additional switching substrates, the PCB may have a small size so that the probe card may also have a small size. A semiconductor device may be manufactured using the probe card.

Abstract: A probe card includes a first circuit substrate electrically connected to a tester, the first circuit substrate having a first size, a second circuit substrate on a lower surface of the first circuit substrate and electrically connected to the first circuit substrate, the second circuit substrate having a second size smaller than the first size, a probe head under the second circuit substrate and electrically connected to the second circuit substrate, the probe head including a plurality of probes in contact with terminals of a device under test (DUT), and a probe holder under the first circuit substrate and supporting the probe head.