Abstract: A manufacturing method of a display device includes forming light emitting components on a first substrate, the light emitting components include a first side and a second side, and the second side is away from the first substrate; forming a circuit layer on the first substrate and on the second side of the light emitting components; forming a first protective layer on the circuit layer and forming an insulating layer on the first protective layer; removing the first substrate after forming a second substrate on the insulating layer; forming a black matrix layer on the first side of the light emitting components, and the black matrix layer includes openings; forming light conversion layers in the openings of the black matrix layer; forming a second protective layer on the black matrix layer and the light conversion layers; and forming a third substrate on the second protective layer.

Abstract: A light-emitting device includes an epitaxial structure having a first surface and a second surface that is opposite to the first surface. The epitaxial structure includes, along a first direction from the first surface to the surface, a first-type semiconductor layer, an active layer, and a second-type semiconductor layer including a capping layer. The capping layer includes at least Ni number of sub-layers arranged in the first direction, where N1?2. Each of the sub-layers of the capping layer contains a material represented by Aly1Ga1-y1InP, where 0<y1?1. The capping layer has an Al content which increases and then remains constant along the first direction. A light-emitting apparatus includes the light-emitting device is also provided.

Abstract: An interconnect structure comprises a first dielectric layer, a first metal layer, a second dielectric layer, a metal via, and a second metal layer. The first dielectric layer is over a substrate. The first metal layer is over the first dielectric layer. The first metal layer comprises a first portion and a second portion spaced apart from the first portion. The second dielectric layer is over the first metal layer. The metal via has an upper portion in the second dielectric layer, a middle portion between the first and second portions of the first metal layer, and a lower portion in the first dielectric layer. The second metal layer is over the metal via. From a top view the second metal layer comprises a metal line having longitudinal sides respectively set back from opposite sides of the first portion of the first metal layer.

Abstract: An integrated circuit (IC) structure includes a semiconductor substrate, a first gate line, a second gate line, and a first auxiliary gate portion. The semiconductor substrate comprises a semiconductor fin. The semiconductor fin extends substantially along a first direction. The first gate line and the second gate line extend substantially along a second direction different form the first direction from a top view. The first auxiliary gate portion connects the first gate line to the second gate line from the top view.

Abstract: A microfluidic detection unit comprises at least one fluid injection section, a fluid storage section and a detection section. Each fluid injection section defines a fluid outlet; the fluid storage section is in gas communication with the atmosphere and defines a fluid inlet; the detection section defines a first end in communication with the fluid outlet and a second end in communication with the fluid inlet. A height difference is defined between the fluid outlet and the fluid inlet along the direction of gravity. When a first fluid is injected from the at least one fluid injection section, the first fluid is driven by gravity to pass through the detection section and accumulate to form a droplet at the fluid inlet, such that a state of fluid pressure equilibrium of the first fluid is established.

Abstract: The disclosure provides a limit device and a robot using the same. The limit device comprises a first connecting member, a transmission rod and a second connecting member. The first connecting member comprising a first main body portion and two first connecting elements. The two first connecting elements are arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod comprising a first end and a second end. The first end and the second end are arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member provided with two indexing buckles. The two indexing buckles are arranged at intervals, each of the indexing buckles comprises a first limiting groove and a second limiting groove.

Abstract: A power consumption monitoring device includes a sensor, a storage, and a processor. The sensor is configured to detect a power-consuming device quantity and a power consumption amount. The storage is configured to store the power-consuming device quantity and the power consumption amount. The processor is communicatively connected to the sensor and the storage. The processor is configured to calculate a power-consuming device idling indicator based on the power-consuming device quantity and the power consumption amount in a monitoring time interval, wherein the power-consuming device idling indicator is used for indicating a deviation status of the power-consuming device quantity and the power consumption amount. The processor is further configured to determine whether the power-consuming device idling indicator exceeds a warning threshold. In response to the power-consuming device idling indicator exceeding the warning threshold, the processor is further configured to generate a warning message.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A semiconductor device is provided. The semiconductor device comprises a first semiconductor die comprising a first capacitor, and a second semiconductor die in contact with the first semiconductor die and comprises a diode. The first semiconductor die and the second semiconductor die are arranged along a first direction, and a diode is configured to direct electrons accumulated at the first capacitor to a ground.

Abstract: Disclosed are calibration techniques that can be implemented by a device that conducts biological tests. In certain embodiments, the device for testing a biological specimen includes a receiving mechanism to receive a carrier, a camera module arranged to capture imagery of the carrier, and a processor. Some examples of the processor can detect a calibration mode trigger. In calibration mode, the processor can divide the captured imagery into segments and selectively perform one or more calibration procedures for each segment. Then, the processor records a calibration result for each segment.

Abstract: A light emitting device includes a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element. The second reflective layer has an outer diameter. A top surface of the second reflective layer is lower than a top surface of the light emitting element. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer. The encapsulating layer is directly contact with the outer diameter.

Abstract: A light emitting device includes a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element. The second reflective layer has an outer diameter. A top surface of the second reflective layer is lower than a top surface of the light emitting element. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer. The encapsulating layer is directly contact with the outer diameter.

Abstract: The present disclosure provides a light emitting device including a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element, and the second reflective layer has an outer diameter. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer, and the height is 0.1 to 0.5 times the outer diameter. The present disclosure also provides a backlight and a display panel.

Abstract: The present disclosure provides a light emitting device including a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element, and the second reflective layer has an outer diameter. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer, and the height is 0.1 to 0.5 times the outer diameter. The present disclosure also provides a backlight and a display panel.

Abstract: Embodiments of mechanisms for forming a film deposition tool are provided. The film deposition tool includes a plasma source and a substrate processing region connected to the plasma source. The film deposition tool also includes a pedestal for supporting a substrate in the substrate processing region, wherein the substrate is prepared to be deposited with a film. The film deposition tool further includes electrodes embedded in the pedestal and separated from each other. The film deposition tool also includes a direct current bias system having variable voltage sources. The variable voltage sources are electrically connected to the electrodes, respectively, for providing direct current voltages to the electrodes independently.

Abstract: A controllable release composition is provided, including a polymer substrate and an active ingredient, in which the polymer substrate is a polymer blend including a biodegradable polyester, polyanhydride, and/or polyether, and the active ingredient includes a radioactive agent or a chemotherapeutic agent. The controllable release composition is useful for cancer therapy, particularly for solid cancer treatment.

Abstract: A slider having an advanced air bearing can employ control features that permit control of the flow-field streamline direction and thus enable an indirect mass transfer that flushes any accumulated lubricant out of the advanced air bearing. These control features can be located at the air bearing surface or at any recessed height from the air bearing surface. Moreover, these control features can also dislodge and move locations of flow-field stagnation.

Abstract: A flow control device for a data storage system to reduce flow induced vibration. The flow control device includes a plurality of streamline flow passages to reduce turbulent flow in a flow field along a disc surface. Thus, air flow induced by rotation of data discs is directed through the plurality of streamline flow passages to reduce turbulence to limit excitation or vibration of the head and suspension components.

Abstract: A multi-layer tire for a baby stroller comprises an EVA (Ethylene-Vinyl Acetate Copolymer) foam tire inner tube and a rubber layer incorporated with a wheel hub. The wheel hub comprises a recess along the edge for the EVA foam tire inner tube to grab and secure thereat, whereas the EVA foam tire inner tube is formed with a pair of grooves at respective sides and wrapped by the rubber layer which comprises a pair of ribs at respective sides engaging with the grooves of the EVA foam tire inner tube to hold the rubber layer and the EVA foam tire inner tube securely.

Abstract: A disc head slider includes a longitudinal axis, a recessed region, and first and second elongated rails extending generally parallel to the longitudinal axis and being disposed about the recessed region. Each rail forms a respective bearing surface. First and second elongated depressions extend along the first and second rails, respectively, and each has a depression floor which is recessed relative to the respective bearing surface. First and second convergent channels are recessed within the first and second rails, respectively, relative to the respective bearing surfaces, and include a leading channel end open to fluid flow from the first and second depressions, respectively, channel side walls and a trailing channel end closed to the fluid flow and positioned forward of a portion of the respective bearing surface.