Patents by Inventor Yu-Liang Hsiao

Yu-Liang Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package with heatsink
    Patent number: 11694972
    Abstract: A semiconductor package includes a substrate, a semiconductor die mounted on the substrate, and a heatsink over the semiconductor die. The heatsink includes a roof portion and at least one connecting portion extending between the roof portion and the substrate. The at least one connecting portion includes a connection lead mounted on a connection pad of the substrate. The connection pad includes a first portion and a second portion spaced apart from each other, which are configured to electrically couple to different voltage signals, respectively, for detecting heatsink floating.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: July 4, 2023
    Assignee: MEDIATEK INC.
    Inventors: Kuang-Han Chang, Yu-Liang Hsiao, Chih-An Yang
  • SEMICONDUCTOR PACKAGE WITH HEATSINK
    Publication number: 20210384142
    Abstract: A semiconductor package includes a substrate, a semiconductor die mounted on the substrate, and a heatsink over the semiconductor die. The heatsink includes a roof portion and at least one connecting portion extending between the roof portion and the substrate. The at least one connecting portion includes a connection lead mounted on a connection pad of the substrate. The connection pad includes a first portion and a second portion spaced apart from each other, which are configured to electrically couple to different voltage signals, respectively, for detecting heatsink floating.
    Type: Application
    Filed: June 2, 2021
    Publication date: December 9, 2021
    Inventors: Kuang-Han Chang, Yu-Liang Hsiao, Chih-An Yang