Patents by Inventor YU-LIANG SHAO

YU-LIANG SHAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145342
    Abstract: In an embodiment, a package includes an encapsulant laterally surrounding a first integrated circuit device and a second integrated circuit device, wherein the first integrated circuit device includes a die and a heat dissipation structure over the die; a sealant disposed over the heat dissipation structure; an adhesive disposed over the second integrated circuit device; and a lid disposed over the sealant and the adhesive, wherein the lid includes a first cooling passage and a second cooling passage, the first cooling passage including an opening at a bottom of the lid and aligned to the heat dissipation structure, the second cooling passage including channels aligned to the second integrated circuit device and being distant from the bottom of the lid.
    Type: Application
    Filed: January 10, 2023
    Publication date: May 2, 2024
    Inventors: Tung-Liang Shao, You-Rong Shaw, Yu-Sheng Huang, Chen-Hua Yu
  • Publication number: 20240105550
    Abstract: A device includes an integrated circuit die attached to a substrate; a lid attached to the integrated circuit die; a sealant on the lid; a spacer structure attached to the substrate adjacent the integrated circuit die; and a cooling cover attached to the spacer structure, wherein the cooling cover extends over the lid, wherein the cooling cover attached to the lid by the sealant. In an embodiment, the device includes a ring structure on the substrate, wherein the ring structure is between the spacer structure and the integrated circuit die.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 28, 2024
    Inventors: Tung-Liang Shao, Yu-Sheng Huang, Hung-Yi Kuo, Chen-Hua Yu
  • Publication number: 20240071965
    Abstract: A package includes a first package component including a semiconductor die, wherein the semiconductor die includes conductive pads, wherein the semiconductor die is surrounded by an encapsulant; an adaptive interconnect structure on the semiconductor die, wherein the adaptive interconnect structure includes conductive lines, wherein each conductive line physically and electrically contacts a respective conductive pad; and first bond pads, wherein each first bond pad physically and electrically contacts a respective conductive line; and a second package component including an interconnect structure, wherein the interconnect structure includes second bond pads, wherein each second bond pad is directly bonded to a respective first bond pad, wherein each second bond pad is laterally offset from a corresponding conductive pad which is electrically coupled to that second bond pad.
    Type: Application
    Filed: August 29, 2022
    Publication date: February 29, 2024
    Inventors: Tung-Liang Shao, Yu-Sheng Huang, Wen-Hao Cheng, Chen-Hua Yu
  • Patent number: 10070549
    Abstract: A removal assembly includes a main body, a positioning element, an elastic element, an actuating element, and a wrench element. The positioning element is movably disposed in an inner space of the main body, including a clasp part and an oblique side surface, and the clasp part extends out of the main body. The elastic element is disposed between the main body and the positioning element. The actuating element is pivotally installed in the inner space of the main body, including a pressing part and an abutting part, the pressing part extends out of the main body, and the abutting part abuts against the oblique side surface of the positioning element. The wrench element is connected to the main body, including a fixing part and a pivoting part.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: September 4, 2018
    Assignee: NEXTRONICS ENGINEERING CORP.
    Inventors: Hou-An Su, Yu-Liang Shao
  • Patent number: 9677584
    Abstract: A fixing screw structure for adjusting a fixing procedure used for fixing a panel to a casing, including a screw, an elastomer and a fixing frame. The screw includes a threaded portion and a tapered portion, and passes through the panel, and the threaded portion is screwed on the casing. The elastomer is annular and disposed around the screw, and has a taper hole corresponding to the tapered portion. The fixing frame is a hollow tube, and is fixed on the panel and positioned around the elastomer. When the screw is screwed, the tapered portion abuts the inner wall of the taper hole and the elastomer is expanded outwardly to fitly abut the inner wall of the fixing frame. The instant disclosure transforms the longitudinal screwing force into a transverse expanding force to fix the panel, thereby eliminating the cumulative tolerance of the casing and the panel.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: June 13, 2017
    Assignee: NEXTRONICS ENGINEERING CORP.
    Inventors: Hou-An Su, Yu-Liang Shao
  • Publication number: 20170042054
    Abstract: A removal assembly includes a main body, a positioning element, an elastic element, an actuating element, and a wrench element. The positioning element is movably disposed in an inner space of the main body, including a clasp part and an oblique side surface, and the clasp part extends out of the main body. The elastic element is disposed between the main body and the positioning element. The actuating element is pivotally installed in the inner space of the main body, including a pressing part and an abutting part, the pressing part extends out of the main body, and the abutting part abuts against the oblique side surface of the positioning element. The wrench element is connected to the main body, including a fixing part and a pivoting part.
    Type: Application
    Filed: December 17, 2015
    Publication date: February 9, 2017
    Inventors: HOU-AN SU, YU-LIANG SHAO
  • Publication number: 20170023037
    Abstract: A fixing screw structure for adjusting a fixing procedure used for fixing a panel to a casing, including a screw, an elastomer and a fixing frame. The screw includes a threaded portion and a tapered portion, and passes through the panel, and the threaded portion is screwed on the casing. The elastomer is annular and disposed around the screw, and has a taper hole corresponding to the tapered portion. The fixing frame is a hollow tube, and is fixed on the panel and positioned around the elastomer. When the screw is screwed, the tapered portion abuts the inner wall of the taper hole and the elastomer is expanded outwardly to fitly abut the inner wall of the fixing frame. The instant disclosure transforms the longitudinal screwing force into a transverse expanding force to fix the panel, thereby eliminating the cumulative tolerance of the casing and the panel.
    Type: Application
    Filed: October 21, 2015
    Publication date: January 26, 2017
    Inventors: HOU-AN SU, YU-LIANG SHAO