Patents by Inventor Yu-Liang Tang

Yu-Liang Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250101151
    Abstract: A hydrocarbon resin polymer including a repeating unit (A) is derived from dicyclopentadiene (DCPD). The hydrocarbon resin polymer has a fluorine substituent, and the content of the fluorine substituent is 100 to 4500 ppm based on the total weight of the hydrocarbon resin polymer. A manufacturing method of the above hydrocarbon resin polymer. The manufacturing method includes polymerizing a mixture in the presence of a fluorine-containing compound, wherein the fluorine-containing compound is a boron trifluoride complex and the mixture includes a dicyclopentadiene. A substrate structure includes a resin layer, and a conductive layer disposed on the resin layer. The resin layer is formed from a resin composition including the above hydrocarbon resin polymer using a cross-linking process.
    Type: Application
    Filed: September 25, 2024
    Publication date: March 27, 2025
    Inventors: Chien-Han CHEN, Wei-Liang LEE, Ming-Hung LIAO, Yu-Tien CHEN, Yu-Chen HSU, Ka Chun AU-YEUNG, Chiung-Yao HUANG, Tzu-Yin HUANG, Yi-Hsuan TANG
  • Publication number: 20250066582
    Abstract: A resin composition includes 100 parts by weight of hydrocarbon resin polymers and 0.01 to 50 parts by weight of divinyl aromatic compound. A substrate structure includes a resin layer and a conductive layer disposed on the resin layer, wherein the resin layer is formed from the resin composition. A manufacturing method of the resin composition includes the following steps: providing a mixture, wherein the mixture includes a monovinyl aromatic compound and a divinyl aromatic compound, and optionally includes a bridged ring compound; polymerizing the mixture to form a crude composition; and purifying the crude composition to prepare the resin composition.
    Type: Application
    Filed: August 22, 2024
    Publication date: February 27, 2025
    Inventors: Yi-Hsuan TANG, Chien-Han CHEN, Wei-Liang LEE, Ming-Hung LIAO, Yu-Tien CHEN, Yu-Chen HSU, Tzu-Yuan SHIH, Ka Chun AU-YEUNG
  • Patent number: D438171
    Type: Grant
    Filed: July 14, 2000
    Date of Patent: February 27, 2001
    Assignee: TelePaq Technology Inc.
    Inventors: Yu-Liang Tang, Hsin-Fa Wang