Patents by Inventor Yu-Liang TSENG

Yu-Liang TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical element driving mechanism having movable portion for holding lens
    Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Tool and method for particle removal
    Patent number: 11145427
    Abstract: A particle removal tool includes a workpiece holder and an optical tweezer. The workpiece holder is configured to support a workpiece. The optical tweezer is configured to emit a plurality of focused light beams to the workpiece, wherein the plurality of focused light beams are respectively converged to focal points between the optical tweezer and the workpiece, and are configured to take particles away from the workpiece.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: October 12, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Yu-Liang Tseng
  • TOOL AND METHOD FOR PARTICLE REMOVAL
    Publication number: 20210035700
    Abstract: A particle removal tool includes a workpiece holder and an optical tweezer. The workpiece holder is configured to support a workpiece. The optical tweezer is configured to emit a plurality of focused light beams to the workpiece, wherein the plurality of focused light beams are respectively converged to focal points between the optical tweezer and the workpiece, and are configured to take particles away from the workpiece.
    Type: Application
    Filed: July 1, 2020
    Publication date: February 4, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Yu-Liang Tseng
  • Inspection method and apparatus
    Patent number: 10871454
    Abstract: A method includes generating a primary radiation beam from a radiation source; splitting the primary beam into a first radiation beam and a second radiation beam; directing the first radiation beam onto a front side of a wafer; directing the second radiation beam onto a back side of a wafer; generating an image of the front side of the wafer by receiving a reflection of the first radiation beam reflected from the wafer; and generating an image of the back side of the wafer by receiving a reflection of the second radiation beam reflected from the wafer.
    Type: Grant
    Filed: February 16, 2019
    Date of Patent: December 22, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-Pin Chou, Yu-Liang Tseng
  • INSPECTION METHOD AND APPARATUS
    Publication number: 20200264111
    Abstract: A method includes generating a primary radiation beam from a radiation source; splitting the primary beam into a first radiation beam and a second radiation beam; directing the first radiation beam onto a front side of a wafer; directing the second radiation beam onto a back side of a wafer; generating an image of the front side of the wafer by receiving a reflection of the first radiation beam reflected from the wafer; and generating an image of the back side of the wafer by receiving a reflection of the second radiation beam reflected from the wafer.
    Type: Application
    Filed: February 16, 2019
    Publication date: August 20, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-Pin CHOU, Yu-Liang TSENG