Patents by Inventor Yu-Liang TSENG

Yu-Liang TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250031024
    Abstract: A method for reducing traffic of a bootstrap procedure in G3-PLC networks includes: a network domain having a first relay node (LBA); and a first external node (LBD) and enabling a beacon request transmission trickle mechanism according to a network domain search request (ADPM-DISCOVERY.request) instruction; wherein after the first relay node receives a first beacon request, the first relay node enables a beacon transmission trickle mechanism according to the first beacon request.
    Type: Application
    Filed: November 30, 2021
    Publication date: January 23, 2025
    Inventors: YU-LIANG TSENG, JIE-MIN CAO
  • Publication number: 20250030450
    Abstract: A method for wireless channel frequency hopping synchronization in a PLC-RF integrated network having a first node, a second node, at least one PLC media and a RF media includes one of following characteristics: the first node uses the PLC media to transmit first frequency hopping data, and the second node receives the first frequency hopping data and then uses the first frequency hopping data to transmit or receive a packet on the RF media; the first node uses the PLC media to transmit second frequency hopping data, and the second node receives the second frequency hopping data and then transmits the second frequency hopping data on the PLC media; and the first node uses the RF media to transmit third frequency hopping data, and the second node receives the third frequency hopping data and then transmits the third frequency hopping data on the PLC media.
    Type: Application
    Filed: December 1, 2021
    Publication date: January 23, 2025
    Inventors: YING-YU CHEN, YU-LIANG TSENG, CHIEN-TSE YU
  • Patent number: 11145427
    Abstract: A particle removal tool includes a workpiece holder and an optical tweezer. The workpiece holder is configured to support a workpiece. The optical tweezer is configured to emit a plurality of focused light beams to the workpiece, wherein the plurality of focused light beams are respectively converged to focal points between the optical tweezer and the workpiece, and are configured to take particles away from the workpiece.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: October 12, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Yu-Liang Tseng
  • Publication number: 20210035700
    Abstract: A particle removal tool includes a workpiece holder and an optical tweezer. The workpiece holder is configured to support a workpiece. The optical tweezer is configured to emit a plurality of focused light beams to the workpiece, wherein the plurality of focused light beams are respectively converged to focal points between the optical tweezer and the workpiece, and are configured to take particles away from the workpiece.
    Type: Application
    Filed: July 1, 2020
    Publication date: February 4, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Yu-Liang Tseng
  • Patent number: 10871454
    Abstract: A method includes generating a primary radiation beam from a radiation source; splitting the primary beam into a first radiation beam and a second radiation beam; directing the first radiation beam onto a front side of a wafer; directing the second radiation beam onto a back side of a wafer; generating an image of the front side of the wafer by receiving a reflection of the first radiation beam reflected from the wafer; and generating an image of the back side of the wafer by receiving a reflection of the second radiation beam reflected from the wafer.
    Type: Grant
    Filed: February 16, 2019
    Date of Patent: December 22, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-Pin Chou, Yu-Liang Tseng
  • Publication number: 20200264111
    Abstract: A method includes generating a primary radiation beam from a radiation source; splitting the primary beam into a first radiation beam and a second radiation beam; directing the first radiation beam onto a front side of a wafer; directing the second radiation beam onto a back side of a wafer; generating an image of the front side of the wafer by receiving a reflection of the first radiation beam reflected from the wafer; and generating an image of the back side of the wafer by receiving a reflection of the second radiation beam reflected from the wafer.
    Type: Application
    Filed: February 16, 2019
    Publication date: August 20, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-Pin CHOU, Yu-Liang TSENG