Abstract: Provided is a bicycle handlebar grip assembly for mounting on a handlebar of a bicycle handlebar, the bicycle handlebar grip assembly including at least one handgrip body for arranging on a handlebar, such as the end thereof, for a rider to thereby hold the handlebar, fixing means for fixing the bicycle handlebar grip assembly to the handlebar, such as for the purpose of securing or clamping this, and a coupling connection for coupling the handgrip body to the fixing means

Abstract: A cell region of a semiconductor device includes a first and second isolation dummy gates extending along a first direction. The semiconductor device further includes a first gate extending along the first direction and between the first isolation dummy gate and the second isolation dummy gate. The semiconductor device includes a second gate extending along the first direction, the second gate being between the first isolation dummy gate and the second isolation dummy gate relative to a second direction perpendicular to the first direction. The semiconductor device also includes a first active region and a second active region. The first active region extending in the second direction between the first isolation dummy gate and the second isolation dummy gate. The first active region has a first length in the second direction, and the second active region has a second length in the second direction different from the first length.

Abstract: A method for generating a customized WRONoC topology is proposed, which is executed by a computer, the method comprising using the computer to perform the following: providing design rules, design specs and a pre-assignment netlist; performing a topology initialization which an initial topology with a minimum number of MRRs is generated according to the netlist; performing a critical path-aware SA optimization to optimize the topology; and performing a wavelength assignment such that the wavelength used by each signal is determined.

Abstract: An electronic package and a manufacturing method thereof are provided, in which a first electronic element and a second electronic element are embedded in a packaging layer, and a circuit structure is formed on the packaging layer and electrically connected to the first electronic element and the second electronic element, where the circuit structure has a heat dissipation portion thermally connected to the first electronic element. Therefore, the heat energy generated by the first electronic element can be quickly dissipated to the outside via the heat dissipation portion, so as to avoid the problem of affecting the operation of the second electronic element due to overheating of the packaging layer.

Abstract: An electronic package and a manufacturing method thereof are provided, in which a first electronic element and a second electronic element are embedded in an encapsulation layer, and a circuit structure is disposed on the encapsulation layer and electrically connected to the first electronic element and the second electronic element. The circuit structure has a hollow area corresponding to the first electronic element, and a heat dissipation structure is disposed in the hollow area to thermally connect the first electronic element. Therefore, the heat energy generated by the first electronic element can be quickly dissipated to the outside via the heat dissipation structure, so as to avoid the problem of affecting the operation of the second electronic element due to the overheating of the encapsulation layer.

Abstract: An integrated circuit (IC) device includes a master latch circuit having a data output, a slave latch circuit having a data input electrically coupled to the data output of the master latch circuit, and a clock circuit electrically coupled to the master latch circuit and the slave latch circuit. The slave latch circuit is physically between the master latch circuit and at least a part of the clock circuit.

Abstract: Embodiments are directed to an electronic device that includes a cover and a haptic module positioned below the cover. The haptic module includes a substrate positioned below the cover and offset from the cover, a spacer positioned between the substrate and the cover and coupling the substrate to the cover, and a piezoelectric element positioned on a surface of the substrate and offset from the cover to define a gap between the piezoelectric element and the cover. The electronic device can also include a sensor coupled to the cover and configured to detect an input, and a processing unit operably coupled to the piezoelectric element and configured to cause the piezoelectric element to deflect the cover in response to the sensor detecting the input.

Abstract: Semiconductor die assemblies with sidewall protection, and associated methods and systems are disclosed. In one embodiment, a semiconductor die assembly includes an interface die with a low-k dielectric layer and a stack of semiconductor dies attached to the interface die. The semiconductor die assembly also includes a molding structure that protects sidewalls of the interface die and sidewalls of the semiconductor dies. In some embodiments, the semiconductor die assembly includes a passivation layer attached to the interface die opposite to the stack of semiconductor dies. Further, the passivation layer may include a sidewall surface coplanar with an outer sidewall surface of the molding structure. The passivation layer may include a ledge underneath the molding structure, which is uncovered by the interface die. The semiconductor die assembly may include a NCF material at the sidewalls of the stack of semiconductor dies, where the molding structure surrounds the NCF material.

Abstract: A Y-type gauze positioning rod is adapted to be disposed in a Y-type gauze so as to position the Y-type gauze to an affected region. The Y-type gauze positioning rod includes a Y-type flexible body having a holder and two supporting branches. The two supporting branches are connected to the holder and separated from each other. A Y-type gauze positioning assembly is further provided.

Abstract: A Y-type gauze positioning rod is adapted to be disposed in a Y-type gauze so as to position the Y-type gauze to an affected region. The Y-type gauze positioning rod includes a Y-type flexible body having a holder and two supporting branches. The two supporting branches are connected to the holder and separated from each other. A Y-type gauze positioning assembly is further provided.

Abstract: A method for producing polyploid plants of orchids includes the steps of: providing a protocorm or protocom-like body (PLB) of an orchid, the protocorm or PLB having an upper portion with a growing point and a lower portion without any growing point; cutting the protocorm or PLB approximately at a point of half height to separate the upper portion; subculturing the lower portion of the protocorm or PLB in an inducing medium, and putting a cut surface of the lower portion of the protocorm or PLB to face upward so that one or more next-generation PLBs grow from the cut surface of the lower portion. The method characterized in using no antimicrotubule agent can simplify the entire process of orchid polyploidy breeding, and can be used in mass-production of the stable polyploid plants.

Abstract: A method for producing polyploid plants of orchids includes the steps of: providing a protocorm or protocom-like body (PLB) of an orchid, the protocorm or PLB having an upper portion with a growing point and a lower portion without any growing point; cutting the protocorm or PLB approximately at a point of half height to separate the upper portion; subculturing the lower portion of the protocorm or PLB in an inducing medium, and putting a cut surface of the lower portion of the protocorm or PLB to face upward so that one or more next-generation PLBs grow from the cut surface of the lower portion. The method characterized in using no antimicrotubule agent can simplify the entire process of orchid polyploidy breeding, and can be used in mass-production of the stable polyploid plants.