Abstract: A magnetic device having a first coil and a second coil, wherein the first coil is wound in a first direction when viewed from the first terminal part of the first coil, and the second coil is wound in a second direction when viewed from the third terminal part of the second coil, wherein the first direction and the second direction are opposite to each other for canceling magnetic fluxes generated by the first coil and the second coil.

Abstract: A housing for an electronic device in the home or car includes a substrate and a composite layer. The composite layer is formed on a surface of the substrate. The composite layer includes an adhesive layer, an ink layer, and a protective layer. The adhesive layer is fully attached to the surface of the substrate. The ink layer is formed on a surface of the adhesive layer away from the substrate. The protective layer is formed on a surface of the ink layer away from the adhesive layer and the process is completed by half-curing and full curing processes. A method for making the housing also is provided.

Abstract: A transfer film providing a textured finish to the surface of a glass object comprises a color ink layer, a texture layer attached to a surface of the ink layer, a metal layer attached to a surface of the texture layer opposite from and contacting the ink layer, and an adhesive layer attached to a surface of the metal layer opposite from and contacting the texture layer. A transfer sticker and a glass product using the transfer film are also provided.

Abstract: A mold assembly for forming a film includes a transparent bottom mold, a top mold, a case, and a lighting member. The transparent bottom mold defines a cavity for receiving a workpiece and a plurality of liquid compositions. The top mold is matched with the bottom mold to accommodate the workpiece between the bottom mold and the top mold. The case receives the bottom mold and the top mold placed therein. Air in the case is exhausted from the case to coat the plurality of liquid composition on the workpiece. The lighting member emits light on the liquid compositions to solidify the liquid compositions to form a film on the workpiece.

Abstract: A method of fabricating three-dimensional patterns on a workpiece includes steps of providing a transparent film and forming a three-dimensional patterns on the transparent film. A layer of adhesive is coated on the three-dimensional patterns. A heat transfer film is used in transferring the three-dimensional patterns from the heat transfer film to a main surface of the workpiece using a vacuum heat transfer printing method.

Abstract: A method for manufacturing an oxidation-resistant glass-mounted photograph includes steps of providing a transparent base, the transparent base includes a front surface and a rear surface opposite to the front surface. A UV inkjet printer sprays UV-curable glue onto the rear surface of the transparent base to form a bonding layer, and an electronic file of a pattern layer is installed into the UV inkjet printer, a layer of UV-curable ink on the bonding layer is printed on the bonding layer using the UV inkjet printer according to the electronic file of the pattern layer. The layer of UV-curable ink is cured to form the pattern layer providing a representation of a desired image.

Abstract: A method for manufacturing an imitation metallic decoration on an article includes providing a base layer with a first surface, applying a texture layer on the first surface; the texture layer including a second surface facing away from the first surface, and applying a complete metallic ink layer on the second surface. Hereby, a plastic article can be given a metallic appearance to match that, for example, of an actual metal used as another cover of the article.

Abstract: A mold assembly for forming a film includes a transparent bottom mold, a top mold, a case, and a lighting member. The transparent bottom mold defines a cavity for receiving a workpiece and a plurality of liquid compositions. The top mold is matched with the bottom mold to accommodate the workpiece between the bottom mold and the top mold. The case receives the bottom mold and the top mold placed therein. Air in the case is exhausted from the case to coat the plurality of liquid composition on the workpiece. The lighting member emits light on the liquid compositions to solidify the liquid compositions to form a film on the workpiece.

Abstract: A mold assembly for forming a film includes a transparent bottom mold, a top mold, a case, and a lighting member. The transparent bottom mold defines a cavity for receiving a work piece and a plurality of liquid compositions. The top mold is matched with the bottom mold to accommodate the work piece between the bottom mold and the top mold. The case receives the bottom mold and the top mold placed therein. Air in the case is exhausted from the case to coat the plurality of liquid composition on the work piece. The lighting member emits light on the liquid compositions to solidify the liquid compositions to form a film on the work piece.

Abstract: A automatic vacuum film transferring machine includes an upper mold that can be driven to moved up and down; at least one lower mold each corresponding to the upper mold and configured to support a component to be transferred; a transferring support member located below the upper mold, and configured to support one lower mold; a first sliding support member and a second sliding support member each located on and driven to slide along two opposite side of the transferring support member, the first and second sliding support member are driven to dock onto the transferring support member to transfer one lower mold.

Abstract: A mold assembly for forming a film includes a transparent bottom mold, a top mold, a case, and a lighting member. The transparent bottom mold defines a cavity for receiving a work piece and a plurality of liquid compositions. The top mold is matched with the bottom mold to accommodate the work piece between the bottom mold and the top mold. The case receives the bottom mold and the top mold placed therein. Air in the case is exhausted from the case to coat the plurality of liquid composition on the work piece. The lighting member emits light on the liquid compositions to solidify the liquid compositions to form a film on the work piece.

Abstract: A housing for an electronic device in the home or car includes a substrate and a composite layer. The composite layer is formed on a surface of the substrate. The composite layer includes an adhesive layer, an ink layer, and a protective layer. The adhesive layer is fully attached to the surface of the substrate. The ink layer is formed on a surface of the adhesive layer away from the substrate. The protective layer is formed on a surface of the ink layer away from the adhesive layer and the process is completed by half-curing and full curing processes. A method for making the housing also is provided.

Abstract: A housing includes a substrate and a protective layer. One surface of the substrate defines a groove. An interior wall of the groove defines at least one through hole passing through the substrate. The protective layer is formed on an interior wall of the groove and the surface of the substrate beside the groove. The protective layer is fully attached to the internal wall of the groove.

Abstract: A monolithic power splitter is used to split a pair of input differential signals into two pairs of output differential signals in the present invention. The monolithic power splitter has two input terminals to receive a pair of input differential signals, and it has two one-by-two power splitters integrated in one single chip to split a pair of input differential signals into two pairs of output differential signals with equal power. And, the monolithic power splitter has four output terminals to output two pairs of output differential signals. In one embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on the same surface of the substrate. In another embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on opposite surfaces of the substrate. The monolithic power splitter can be used as a power combiner based on the reciprocal property of the power splitter circuit.

Abstract: A monolithic power splitter is used to split a pair of input differential signals into two pairs of output differential signals in the present invention. The monolithic power splitter has two input terminals to receive a pair of input differential signals, and it has two one-by-two power splitters integrated in one single chip to split a pair of input differential signals into two pairs of output differential signals with equal power. And, the monolithic power splitter has four output terminals to output two pairs of output differential signals. In one embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on the same surface of the substrate. In another embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on opposite surfaces of the substrate. The monolithic power splitter can be used as a power combiner based on the reciprocal property of the power splitter circuit.

Abstract: The invention discloses a diplexer formed from the combination of a first filter and a second filter, wherein both the first filter and the second filter have at least one through-hole via inductor. The diplexer has an input terminal to receive an input signal. The first filter has a first terminal electrically connected to the input terminal and a second terminal to generate a first output signal; the second filter has a third terminal electrically connected to the input terminal and a fourth terminal to generate a second output signal. The diplexer has a first output terminal electrically connected to the second terminal of the first filter to output the first output signal and a second output terminal electrically connected to the fourth terminal of the second filter to output the second output signal.

Abstract: The invention discloses a diplexer formed from the combination of a first filter and a second filter, wherein both the first filter and the second filter have at least one through-hole via inductor. The diplexer has an input terminal to receive an input signal. The first filter has a first terminal electrically connected to the input terminal and a second terminal to generate a first output signal; the second filter has a third terminal electrically connected to the input terminal and a fourth terminal to generate a second output signal. The diplexer has a first output terminal electrically connected to the second terminal of the first filter to output the first output signal and a second output terminal electrically connected to the fourth terminal of the second filter to output the second output signal.

Abstract: A flash preventing substrate and a method for fabricating the same are proposed. A core defined with a plurality of substrate units is prepared. A circuit patterning process is performed to form circuit structures on the core corresponding to the substrate units, plating buses between the adjacent substrate units and electrically connected to the circuit structures, and a molding ring surrounding all the substrate units. The molding ring is located at a position predetermined for contacting the substrate with a mold. A solder mask layer covers the circuit structures, the plating buses and the molding ring, and is formed with a plurality of openings therein, such that predetermined portions of the circuit structures are exposed via the openings and serve as electrical input/output connections. During a molding process, the mold can tightly abut against the solder mask layer covering the molding ring to prevent outward flashes of an encapsulating material.

Abstract: A flash preventing substrate and a method for fabricating the same are proposed. A core defined with a plurality of substrate units is prepared. A circuit patterning process is performed to form circuit structures on the core corresponding to the substrate units, plating buses between the adjacent substrate units and electrically connected to the circuit structures, and a molding ring surrounding all the substrate units. The molding ring is located at a position predetermined for contacting the substrate with a mold. A solder mask layer covers the circuit structures, the plating buses and the molding ring, and is formed with a plurality of openings therein, such that predetermined portions of the circuit structures are exposed via the openings and serve as electrical input/output connections. During a molding process, the mold can tightly abut against the solder mask layer covering the molding ring to prevent outward flashes of an encapsulating material.