Patents by Inventor Yu-Lin Liao

Yu-Lin Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230360833
    Abstract: A magnetic device having a first coil and a second coil, wherein the first coil is wound in a first direction when viewed from the first terminal part of the first coil, and the second coil is wound in a second direction when viewed from the third terminal part of the second coil, wherein the first direction and the second direction are opposite to each other for canceling magnetic fluxes generated by the first coil and the second coil.
    Type: Application
    Filed: May 4, 2023
    Publication date: November 9, 2023
    Inventor: Yu-Lin Liao
  • Patent number: 10231351
    Abstract: A housing for an electronic device in the home or car includes a substrate and a composite layer. The composite layer is formed on a surface of the substrate. The composite layer includes an adhesive layer, an ink layer, and a protective layer. The adhesive layer is fully attached to the surface of the substrate. The ink layer is formed on a surface of the adhesive layer away from the substrate. The protective layer is formed on a surface of the ink layer away from the adhesive layer and the process is completed by half-curing and full curing processes. A method for making the housing also is provided.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: March 12, 2019
    Assignee: MiiCs & Partners (Shenzhen) Co., Ltd.
    Inventors: Hung-Chun Ma, Han-Lung Lee, Yu-Lin Liao, Chih-Jung Chang, Hung-Lien Yeh, Jih-Chen Liu, Feng-Yuen Dai
  • Publication number: 20180333937
    Abstract: A transfer film providing a textured finish to the surface of a glass object comprises a color ink layer, a texture layer attached to a surface of the ink layer, a metal layer attached to a surface of the texture layer opposite from and contacting the ink layer, and an adhesive layer attached to a surface of the metal layer opposite from and contacting the texture layer. A transfer sticker and a glass product using the transfer film are also provided.
    Type: Application
    Filed: July 11, 2017
    Publication date: November 22, 2018
    Inventors: WEI-TING CHEN, CHEN-CHU CHIANG, HAN-LUNG LEE, YI-ZHONG SHEU, HUNG-CHUN MA, YU-LIN LIAO, CHIH-JUNG CHANG, JIH-CHEN LIU, FENG-YUEN DAI
  • Patent number: 10118319
    Abstract: A mold assembly for forming a film includes a transparent bottom mold, a top mold, a case, and a lighting member. The transparent bottom mold defines a cavity for receiving a workpiece and a plurality of liquid compositions. The top mold is matched with the bottom mold to accommodate the workpiece between the bottom mold and the top mold. The case receives the bottom mold and the top mold placed therein. Air in the case is exhausted from the case to coat the plurality of liquid composition on the workpiece. The lighting member emits light on the liquid compositions to solidify the liquid compositions to form a film on the workpiece.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: November 6, 2018
    Assignee: ScienBiziP Consulting(Shenzhen)Co., Ltd.
    Inventors: Han-Lung Lee, Hung-Chun Ma, Yu-Lin Liao, Chih-Jung Chang
  • Publication number: 20180311996
    Abstract: A method of fabricating three-dimensional patterns on a workpiece includes steps of providing a transparent film and forming a three-dimensional patterns on the transparent film. A layer of adhesive is coated on the three-dimensional patterns. A heat transfer film is used in transferring the three-dimensional patterns from the heat transfer film to a main surface of the workpiece using a vacuum heat transfer printing method.
    Type: Application
    Filed: July 7, 2017
    Publication date: November 1, 2018
    Inventors: JIH-CHEN LIU, HUNG-CHUN MA, CHIH-JUNG CHANG, WEI-TING CHEN, YU-LIN LIAO, CHEN-CHU CHIANG, HAN-LUNG LEE, JAN-WAN CHANG, HAN-LUNG CHAO
  • Publication number: 20180301068
    Abstract: A method for manufacturing an oxidation-resistant glass-mounted photograph includes steps of providing a transparent base, the transparent base includes a front surface and a rear surface opposite to the front surface. A UV inkjet printer sprays UV-curable glue onto the rear surface of the transparent base to form a bonding layer, and an electronic file of a pattern layer is installed into the UV inkjet printer, a layer of UV-curable ink on the bonding layer is printed on the bonding layer using the UV inkjet printer according to the electronic file of the pattern layer. The layer of UV-curable ink is cured to form the pattern layer providing a representation of a desired image.
    Type: Application
    Filed: August 4, 2017
    Publication date: October 18, 2018
    Inventors: FENG-YUEN DAI, JIH-CHEN LIU, CHIH-JUNG CHANG, HUNG-CHUN MA, HAN-LUNG LEE, HAN-LUNG CHAO, YU-LIN LIAO, CHEN-CHU CHIANG, WEI-TING CHEN, JAN-WAN CHANG
  • Publication number: 20180141309
    Abstract: A method for manufacturing an imitation metallic decoration on an article includes providing a base layer with a first surface, applying a texture layer on the first surface; the texture layer including a second surface facing away from the first surface, and applying a complete metallic ink layer on the second surface. Hereby, a plastic article can be given a metallic appearance to match that, for example, of an actual metal used as another cover of the article.
    Type: Application
    Filed: June 20, 2017
    Publication date: May 24, 2018
    Inventors: FENG-YUEN DAI, JIH-CHEN LIU, CHIH-JUNG CHANG, HUNG-CHUN MA, YU-LIN LIAO, YI-ZHONG SHEU, HAN-LUNG CHAO, JAN-WAN CHANG, WEI-TING CHEN, CHEN-CHU CHIANG
  • Publication number: 20180117799
    Abstract: A mold assembly for forming a film includes a transparent bottom mold, a top mold, a case, and a lighting member. The transparent bottom mold defines a cavity for receiving a workpiece and a plurality of liquid compositions. The top mold is matched with the bottom mold to accommodate the workpiece between the bottom mold and the top mold. The case receives the bottom mold and the top mold placed therein. Air in the case is exhausted from the case to coat the plurality of liquid composition on the workpiece. The lighting member emits light on the liquid compositions to solidify the liquid compositions to form a film on the workpiece.
    Type: Application
    Filed: December 26, 2017
    Publication date: May 3, 2018
    Inventors: HAN-LUNG LEE, HUNG-CHUN MA, YU-LIN LIAO, CHIH-JUNG CHANG
  • Patent number: 9889582
    Abstract: A mold assembly for forming a film includes a transparent bottom mold, a top mold, a case, and a lighting member. The transparent bottom mold defines a cavity for receiving a work piece and a plurality of liquid compositions. The top mold is matched with the bottom mold to accommodate the work piece between the bottom mold and the top mold. The case receives the bottom mold and the top mold placed therein. Air in the case is exhausted from the case to coat the plurality of liquid composition on the work piece. The lighting member emits light on the liquid compositions to solidify the liquid compositions to form a film on the work piece.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: February 13, 2018
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Han-Lung Lee, Hung-Chun Ma, Yu-Lin Liao, Chih-Jung Chang
  • Publication number: 20170361499
    Abstract: A automatic vacuum film transferring machine includes an upper mold that can be driven to moved up and down; at least one lower mold each corresponding to the upper mold and configured to support a component to be transferred; a transferring support member located below the upper mold, and configured to support one lower mold; a first sliding support member and a second sliding support member each located on and driven to slide along two opposite side of the transferring support member, the first and second sliding support member are driven to dock onto the transferring support member to transfer one lower mold.
    Type: Application
    Filed: August 31, 2016
    Publication date: December 21, 2017
    Inventors: HUNG-CHUN MA, YU-LIN LIAO, HAN-LUNG CHAO, HUNG-LIEN YEH, CHIH-JUNG CHANG, JIH-CHEN LIU, FENG-YUEN DAI
  • Publication number: 20160303782
    Abstract: A mold assembly for forming a film includes a transparent bottom mold, a top mold, a case, and a lighting member. The transparent bottom mold defines a cavity for receiving a work piece and a plurality of liquid compositions. The top mold is matched with the bottom mold to accommodate the work piece between the bottom mold and the top mold. The case receives the bottom mold and the top mold placed therein. Air in the case is exhausted from the case to coat the plurality of liquid composition on the work piece. The lighting member emits light on the liquid compositions to solidify the liquid compositions to form a film on the work piece.
    Type: Application
    Filed: August 21, 2015
    Publication date: October 20, 2016
    Inventors: HAN-LUNG LEE, HUNG-CHUN MA, YU-LIN LIAO, CHIH-JUNG CHANG
  • Publication number: 20160227658
    Abstract: A housing for an electronic device in the home or car includes a substrate and a composite layer. The composite layer is formed on a surface of the substrate. The composite layer includes an adhesive layer, an ink layer, and a protective layer. The adhesive layer is fully attached to the surface of the substrate. The ink layer is formed on a surface of the adhesive layer away from the substrate. The protective layer is formed on a surface of the ink layer away from the adhesive layer and the process is completed by half-curing and full curing processes. A method for making the housing also is provided.
    Type: Application
    Filed: April 29, 2015
    Publication date: August 4, 2016
    Inventors: HUNG-CHUN MA, HAN-LUNG LEE, YU-LIN LIAO, CHIH-JUNG CHANG, HUNG-LIEN YEH, JIH-CHEN LIU, FENG-YUEN DAI
  • Publication number: 20160121531
    Abstract: A housing includes a substrate and a protective layer. One surface of the substrate defines a groove. An interior wall of the groove defines at least one through hole passing through the substrate. The protective layer is formed on an interior wall of the groove and the surface of the substrate beside the groove. The protective layer is fully attached to the internal wall of the groove.
    Type: Application
    Filed: December 30, 2014
    Publication date: May 5, 2016
    Inventors: HUNG-CHUN MA, FENG-YUEN DAI, CHIH-JUNG CHANG, YU-LIN LIAO, HAN-LUNG LEE, JIH-CHEN LIU
  • Patent number: 9148114
    Abstract: A monolithic power splitter is used to split a pair of input differential signals into two pairs of output differential signals in the present invention. The monolithic power splitter has two input terminals to receive a pair of input differential signals, and it has two one-by-two power splitters integrated in one single chip to split a pair of input differential signals into two pairs of output differential signals with equal power. And, the monolithic power splitter has four output terminals to output two pairs of output differential signals. In one embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on the same surface of the substrate. In another embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on opposite surfaces of the substrate. The monolithic power splitter can be used as a power combiner based on the reciprocal property of the power splitter circuit.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: September 29, 2015
    Assignee: CYNTEC Co., Ltd.
    Inventors: Shih-Hsien Tseng, Yu-Lin Liao
  • Publication number: 20150048897
    Abstract: A monolithic power splitter is used to split a pair of input differential signals into two pairs of output differential signals in the present invention. The monolithic power splitter has two input terminals to receive a pair of input differential signals, and it has two one-by-two power splitters integrated in one single chip to split a pair of input differential signals into two pairs of output differential signals with equal power. And, the monolithic power splitter has four output terminals to output two pairs of output differential signals. In one embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on the same surface of the substrate. In another embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on opposite surfaces of the substrate. The monolithic power splitter can be used as a power combiner based on the reciprocal property of the power splitter circuit.
    Type: Application
    Filed: October 30, 2014
    Publication date: February 19, 2015
    Inventors: Shih-Hsien Tseng, YU-LIN LIAO
  • Patent number: 8884717
    Abstract: The invention discloses a diplexer formed from the combination of a first filter and a second filter, wherein both the first filter and the second filter have at least one through-hole via inductor. The diplexer has an input terminal to receive an input signal. The first filter has a first terminal electrically connected to the input terminal and a second terminal to generate a first output signal; the second filter has a third terminal electrically connected to the input terminal and a fourth terminal to generate a second output signal. The diplexer has a first output terminal electrically connected to the second terminal of the first filter to output the first output signal and a second output terminal electrically connected to the fourth terminal of the second filter to output the second output signal.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: November 11, 2014
    Assignee: Cyntec Co., Ltd.
    Inventors: Yu-Lin Liao, Ian-Chun Cheng
  • Publication number: 20130271239
    Abstract: The invention discloses a diplexer formed from the combination of a first filter and a second filter, wherein both the first filter and the second filter have at least one through-hole via inductor. The diplexer has an input terminal to receive an input signal. The first filter has a first terminal electrically connected to the input terminal and a second terminal to generate a first output signal; the second filter has a third terminal electrically connected to the input terminal and a fourth terminal to generate a second output signal. The diplexer has a first output terminal electrically connected to the second terminal of the first filter to output the first output signal and a second output terminal electrically connected to the fourth terminal of the second filter to output the second output signal.
    Type: Application
    Filed: January 15, 2013
    Publication date: October 17, 2013
    Inventors: Yu-Lin Liao, Ian-Chun Cheng
  • Patent number: 7141868
    Abstract: A flash preventing substrate and a method for fabricating the same are proposed. A core defined with a plurality of substrate units is prepared. A circuit patterning process is performed to form circuit structures on the core corresponding to the substrate units, plating buses between the adjacent substrate units and electrically connected to the circuit structures, and a molding ring surrounding all the substrate units. The molding ring is located at a position predetermined for contacting the substrate with a mold. A solder mask layer covers the circuit structures, the plating buses and the molding ring, and is formed with a plurality of openings therein, such that predetermined portions of the circuit structures are exposed via the openings and serve as electrical input/output connections. During a molding process, the mold can tightly abut against the solder mask layer covering the molding ring to prevent outward flashes of an encapsulating material.
    Type: Grant
    Filed: February 15, 2005
    Date of Patent: November 28, 2006
    Assignee: Siliconware Precision Industries Co., Ltd
    Inventors: Yu-Lin Liao, Chien-Te Chen
  • Publication number: 20060125075
    Abstract: A flash preventing substrate and a method for fabricating the same are proposed. A core defined with a plurality of substrate units is prepared. A circuit patterning process is performed to form circuit structures on the core corresponding to the substrate units, plating buses between the adjacent substrate units and electrically connected to the circuit structures, and a molding ring surrounding all the substrate units. The molding ring is located at a position predetermined for contacting the substrate with a mold. A solder mask layer covers the circuit structures, the plating buses and the molding ring, and is formed with a plurality of openings therein, such that predetermined portions of the circuit structures are exposed via the openings and serve as electrical input/output connections. During a molding process, the mold can tightly abut against the solder mask layer covering the molding ring to prevent outward flashes of an encapsulating material.
    Type: Application
    Filed: February 15, 2005
    Publication date: June 15, 2006
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yu-Lin Liao, Chien-Te Chen