Abstract: An overlay mark includes a previous layer mark and a current layer mark. The previous layer mark includes a plurality of first work zones. Each first working zone includes a first sub-region and a second sub-region, wherein the first sub-region is closer to a center point of the previous layer mark than the second sub-region. The previous layer mark includes a first mark and an auxiliary mark respectively in the first sub-region and the second sub-region of each first working zone. The current layer mark includes a plurality of second working zones. Each second working zone includes a first sub-region and a second sub-region. The current layer mark includes a second mark disposed in the second sub-region of each second working zone. The overlay mark may be applied in the process of manufacturing a 3D NAND flash memory with high capacity and high performance.

Abstract: A method of measuring chromaticity of a target object is implemented using a computer device that stores a plurality of light source spectrum datasets each associated with a specific object. The method includes: obtaining a captured color image of the target object; generating a spectral image based on the captured color image using a spectral transformation matrix; obtaining one of the plurality of light source spectrum datasets that is associated with the target object; and calculating a chromaticity dataset of the target object based on the spectral image and the one of the plurality of light source spectrum datasets.

Abstract: A method for measuring a thickness of a thin film layer disposed on a piece of glass is implemented using a computer device that stores a thin film image of the thin film layer, a surface dataset associated with a surface of the thin film layer, and a plurality of reference parameter sets each being associated with a specific thickness of the thin film layer, the method including: generating a spectral image dataset that includes spectral data associated with different pixels of the thin film image using a spectral transformation matrix; performing regression analysis on the surface dataset and the spectral image dataset, so as to obtain a thickness parameter set including a plurality of thickness parameters; and determining a thickness of the thin film layer using the thickness parameter set and the plurality of reference parameter sets.

Abstract: A method for detecting objects in hyperspectral imaging is revealed. First obtaining a hyperspectral imaging information by a reference image. Then converting an input image according to the hyperspectral imaging information to get a hyperspectral image. A plurality of hyperspectral eigenvalues is obtained after image analysis of the hyperspectral image. Next getting a plurality of dimensionality reduction eigenvalues by a principal component analysis (PCA). Then performing convolution operation on the dimensionality reduction eigenvalues to get a value of a convolution matrix for extracting a feature image from an image of an object to be detected in the input image. Generating an anchor box and a prediction box in the feature image to get a bounded image. Lastly matching and comparing the bounded image with a sample image to determine whether the input image is a target object image. Thereby the method provides assistance for physicians in gastrointestinal image diagnosis.

Abstract: A method of measuring chromaticity of a target object is implemented using a computer device that stores a plurality of light source spectrum datasets each associated with a specific object. The method includes: obtaining a captured color image of the target object; generating a spectral image based on the captured color image using a spectral transformation matrix; obtaining one of the plurality of light source spectrum datasets that is associated with the target object; and calculating a chromaticity dataset of the target object based on the spectral image and the one of the plurality of light source spectrum datasets.

Abstract: The present disclosure relates to a media broadcasting system, including a first broadcasting device, a second broadcasting device and a processing device. The first broadcasting device and the second broadcasting device are respectively arranged at a first side and a second side of the media broadcasting system. The processing device is electrically coupled to the first broadcasting device and the second broadcasting device, and is configured to receive a media. The processing device is configured to obtain a first channel audio signal and a second channel audio signal from the media according to a first position parameter corresponding to the first broadcasting device and a second position parameter corresponding to the second broadcasting device. The processing device is further configured to transmit the first channel audio signal to the first broadcasting device and the second channel audio signal to the second broadcasting device.

Abstract: The present disclosure relates to a media broadcasting system, including a first broadcasting device, a second broadcasting device and a processing device. The first broadcasting device and the second broadcasting device are respectively arranged at a first side and a second side of the media broadcasting system. The processing device is electrically coupled to the first broadcasting device and the second broadcasting device, and is configured to receive a media. The processing device is configured to obtain a first channel audio signal and a second channel audio signal from the media according to a first position parameter corresponding to the first broadcasting device and a second position parameter corresponding to the second broadcasting device. The processing device is further configured to transmit the first channel audio signal to the first broadcasting device and the second channel audio signal to the second broadcasting device.

Abstract: Interconnect structures and corresponding techniques for forming the interconnect structures are disclosed herein. An exemplary method includes forming a contact opening in a dielectric layer. The contact opening has sidewalls defined by the dielectric layer and a bottom defined by a conductive feature. An ALD-like nitrogen-containing plasma pre-treatment process is performed on the sidewalls (and, in some implementations, the bottom) of the contact opening. An ALD process is performed to form a titanium-and-nitrogen containing barrier layer over the sidewalls and the bottom of the contact opening. A cobalt-containing bulk layer is then formed over the titanium-and-nitrogen-containing barrier layer. A cycle of the ALD-like nitrogen-containing plasma pre-treatment process can include a nitrogen-containing plasma pulse phase and a purge phase. A cycle of the ALD process can include a titanium-containing pulse phase, a first purge phase, a nitrogen-containing plasma pulse phase, and a second purge phase.

Abstract: Interconnect structures and corresponding techniques for forming the interconnect structures are disclosed herein. An exemplary method includes forming a contact opening in a dielectric layer. The contact opening has sidewalls defined by the dielectric layer and a bottom defined by a conductive feature. An ALD-like nitrogen-containing plasma pre-treatment process is performed on the sidewalls (and, in some implementations, the bottom) of the contact opening. An ALD process is performed to form a titanium-and-nitrogen containing barrier layer over the sidewalls and the bottom of the contact opening. A cobalt-containing bulk layer is then formed over the titanium-and-nitrogen-containing barrier layer. A cycle of the ALD-like nitrogen-containing plasma pre-treatment process can include a nitrogen-containing plasma pulse phase and a purge phase. A cycle of the ALD process can include a titanium-containing pulse phase, a first purge phase, a nitrogen-containing plasma pulse phase, and a second purge phase.

Abstract: Interconnect structures and corresponding techniques for forming the interconnect structures are disclosed herein. An exemplary method includes forming a contact opening in a dielectric layer. The contact opening has sidewalls defined by the dielectric layer and a bottom defined by a conductive feature. An ALD-like nitrogen-containing plasma pre-treatment process is performed on the sidewalls (and, in some implementations, the bottom) of the contact opening. An ALD process is performed to form a titanium-and-nitrogen containing barrier layer over the sidewalls and the bottom of the contact opening. A cobalt-containing bulk layer is then formed over the titanium-and-nitrogen-containing barrier layer. A cycle of the ALD-like nitrogen-containing plasma pre-treatment process can include a nitrogen-containing plasma pulse phase and a purge phase. A cycle of the ALD process can include a titanium-containing pulse phase, a first purge phase, a nitrogen-containing plasma pulse phase, and a second purge phase.

Abstract: A semiconductor device includes a semiconductor substrate, a circuit unit and an align mark. The circuit unit is disposed on the semiconductor substrate. The align mark includes a first part and a second part respectively formed in the semiconductor substrate and adjacent to two opposite sides of the circuit unit, wherein the first part and the second part depart from each other for a predetermined distance along with a first direction.

Abstract: A semiconductor device includes a semiconductor substrate, a circuit unit and an align mark. The circuit unit is disposed on the semiconductor substrate. The align mark includes a first part and a second part respectively formed in the semiconductor substrate and adjacent to two opposite sides of the circuit unit, wherein the first part and the second part depart from each other for a predetermined distance along with a first direction.

Abstract: A supporting base for an electronic device includes a mounting plate and two standing pieces. The two standing pieces are rotatably fixed to the mounting plate. The two standing pieces can rotate from a closed position to an open position. When the two standing pieces are in the closed position, the mounting plate supports the electronic device in a first manner. When the two pieces are in the open position, the two pieces clamp the electronic device in a second manner. An electronic device assembly is also provided.

Abstract: A securing mechanism is configured to secure an electronic device. The electronic device includes a body, a power adapter and a first data cable connecting the body with the power adapter. The securing mechanism includes a base and a cover. The base includes a second data cable. The cover defines a limiting groove and a securing portion connected with the second data cable. The body is configured to be received in the limiting groove. The power adapter is configured to be inserted into the securing portion. The second data cable is configured to be inserted into a power supply.

Abstract: A securing mechanism is configured to secure an electronic device. The electronic device includes a body, a power adapter and a first data cable connecting the body with the power adapter. The securing mechanism includes a base and a cover. The base includes a second data cable. The cover defines a limiting groove and a securing portion connected with the second data cable. The body is configured to be received in the limiting groove. The power adapter is configured to be inserted into the securing portion. The second data cable is configured to be inserted into a power supply.

Abstract: A supporting base for an electronic device includes a mounting plate and two standing pieces. The two standing pieces are rotatably fixed to the mounting plate. The two standing pieces can rotate from a closed position to an open position. When the two standing pieces are in the closed position, the mounting plate supports the electronic device in a first manner. When the two pieces are in the open position, the two pieces clamp the electronic device in a second manner. An electronic device assembly is also provided.

Abstract: A wearable electronic device includes an electronic device enclosure and a host. The electronic device enclosure includes a mounting portion defining a receiving hole. The mounting portion includes a clipping member movably received in the receiving hole. The host includes a host body and an earplug extending from the host body. The host body is rotatably attached to the mounting portion, the earplug is received in the receiving hole, and the clipping member is engaged with the earplug to prevent the earplug from disengaging from the receiving hole.

Abstract: A videophone includes a camera, a deflecting plate, and a driving device. The camera is located on the deflecting plate. The deflecting plate includes a shaft. The camera includes a supporting post. The supporting post is substantially perpendicular to the shaft. The driving device can drive the supporting post and the shaft to rotate. The camera can rotate about the supporting post and the shaft to adjust angle of the camera. A camera assembly is also provided.

Abstract: Electronic device includes a main module, a sliding member, a resilient member, and an expansion module coupled to the main module. The main module includes a base, and the sliding member is slidably attached to the base. The resilient member is located between the sliding member and the base, and the expansion module includes a clipping member. The expansion module is moveable in a first direction to slide the sliding member in a second direction that is perpendicular to the first direction, and the resilient member is deformable to engage the sliding member with the clipping member.