Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw is in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

Abstract: The present invention provides a chip including a plurality of application circuits and a UART interface. The plurality of application circuits, configured to generate a plurality of data, respectively, wherein the plurality of data respectively generated by the plurality of application circuits are transmitted to another chip via the same UART interface.

Abstract: A manufacturing method of a wavelength-converting component includes providing a substrate, providing a wavelength-converting layer and providing a reflective layer. The reflective layer is disposed on the substrate. The wavelength-converting layer is disposed on a surface of the reflective layer away from the substrate. The wavelength-converting layer includes a wavelength-converting material and a second organic adhesive. The wavelength-converting material is mixed in the second organic adhesive. The second organic adhesive includes an aromatic polyimide. The wavelength-converting component manufactured by the method of the invention can improve mechanical properties such as shear strength, tensile strength and fatigue strength, temperature resistance and reflectivity, and can reduce rates of moisture absorption. The projection apparatus including the wavelength-converting component can reduce degradation in image brightness.

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

Abstract: A circuit board may include a pad board portion comprising one or more pads and a circuit module portion within the pad board portion and comprising a circuit electrically coupled to the one or more pads. The pad board portion and circuit module portion may be arranged such that they can be separated from each other in a manner such that the pad board portion is configured to electrically couple to a circuit module surface mounted to the pad board portion via the one or more pads and the circuit module portion is configured to electrically couple to a pad board via pads of the pad board.

Abstract: A method includes forming a doped region on a top portion of a substrate, forming a first epitaxial layer over the substrate, forming a recess in the first epitaxial layer, the recess being aligned to the doped region, performing a surface clean treatment in the recess, the surface clean treatment includes: oxidizing surfaces of the recess to form an oxide layer in the recess, and removing the oxide layer from the surfaces of the recess, and forming a second epitaxial layer in the recess.

Abstract: A method for Co-Reception (Co-Rx) operation of multiple transceiver radios sharing the same antenna and Low Noise Amplifier (LNA) is provided. A first receiver radio of a wireless communication device determines the first gain mode of an LNA based on the first signal indicator. A second receiver radio of the wireless communication device determines the second gain mode of the LNA based on the second signal indicator. The LNA is shared by the first receiver radio and the second receiver radio and is coupled to an antenna. A Packet Traffic Arbitration (PTA) circuitry of the wireless communication device configures the LNA to operate in the first gain mode or the second gain mode based on the priority levels of the first receiver radio and the second receiver radio.

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

Abstract: A scanning equipment includes a control module, a frame, a rod, two first scanning devices and a second scanning device. The frame connects the control module and has two opposite first ends. The frame is bendable such that the first ends are movable towards or away from each other. A second end of the rod connects one of the first ends. The first scanning devices are disposed at the first ends. The second scanning device is disposed at a third end of the rod. When the scanning equipment is in usage, the frame forms a long structure and the control module locates between the first scanning devices along a first direction. When the scanning equipment is in storage, the frame bends and the control module locates between the first scanning devices and the second scanning device along a second direction perpendicular to the first direction.

Abstract: Auto-focus method and a remote sensing satellite are disclosed. The satellite comprises at least a focal plane assembly (FPA) and a focus adjusting apparatus, the auto-focus method comprises: processing a point spread function (PSF) estimation to a multiple regions of a first image to generate multiple first estimated point spread functions; generating a first average point spread function according to the first estimated point spread functions; processing a Gaussian curve fitting to the first average PSF function and defining a first focus number; processing a PSF estimation to multiple regions of a second image to generate multiple second estimated PSF functions; generating a second average point spread function according to the second estimated point spread functions; processing a Gaussian curve fitting to the second average point spread function and defining a second focus number; and comparing the first focus number and the second focus number.

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

Abstract: A method includes forming a doped region on a top portion of a substrate, forming a first epitaxial layer over the substrate, forming a recess in the first epitaxial layer, the recess being aligned to the doped region, performing a surface clean treatment in the recess, the surface clean treatment includes: oxidizing surfaces of the recess to form an oxide layer in the recess, and removing the oxide layer from the surfaces of the recess, and forming a second epitaxial layer in the recess.

Abstract: A method includes forming a doped region on a top portion of a substrate, forming a first epitaxial layer over the substrate, forming a recess in the first epitaxial layer, the recess being aligned to the doped region, performing a surface clean treatment in the recess, the surface clean treatment includes: oxidizing surfaces of the recess to form an oxide layer in the recess, and removing the oxide layer from the surfaces of the recess, and forming a second epitaxial layer in the recess.

Abstract: A structure to increase the breakdown voltage of the high electron mobility transistor is provided to solve the problem of function loss under a high voltage state. The structure includes a substrate, a conducting layer located on the substrate, a gate insulating layer and an electric-field-dispersion layer. The upper portion of the conducting layer is an electron supply layer, and the lower portion of the conducting layer is an electron tunnel layer. The gate insulating layer is laminated on the electron supply layer. The electric-field-dispersion layer is laminated on the gate insulating layer. The dielectric constant of the electric-field-dispersion layer is smaller than that of the gate insulating layer. A gate electrode is located between the electric-field-dispersion layer and the gate insulating layer. A source and a drain electrodes are respectively electrically connected to the electric-field-dispersion layer, the gate insulating layer, the electron supply layer, and the electron tunnel layer.

Abstract: A thin film transistor is used to solve a problem of low process efficiency of the conventional thin film transistor in preventing hydrogen diffusion. The thin film transistor includes a substrate, multilayer thin films laminated on the substrate, and at least one fluorine-containing thin film laminated in substitution for the multilayer thin films. Each of the multilayer thin films is a gate insulating layer, an active layer, a buffer layer, and a dielectric layer or a protective layer. Each of the at least one fluorine-containing thin film is a fluorine-doped insulating layer, a fluorine-doped active layer, a fluorine-doped buffer layer, and a fluorine-doped dielectric layer or a fluorine-doped protective layer. The invention further discloses a method for manufacturing the thin film transistor.

Abstract: Auto-focus method and a remote sensing satellite are disclosed. The satellite comprises at least a focal plane assembly (FPA) and a focus adjusting apparatus, the auto-focus method comprises: processing a point spread function (PSF) estimation to a multiple regions of a first image to generate multiple first estimated point spread functions; generating a first average point spread function according to the first estimated point spread functions; processing a Gaussian curve fitting to the first average PSF function and defining a first focus number; processing a PSF estimation to multiple regions of a second image to generate multiple second estimated PSF functions; generating a second average point spread function according to the second estimated point spread functions; processing a Gaussian curve fitting to the second average point spread function and defining a second focus number; and comparing the first focus number and the second focus number.

Abstract: A structure to increase the breakdown voltage of the high electron mobility transistor is provided to solve the problem of function loss under a high voltage state. The structure includes a substrate, a conducting layer located on the substrate, a gate insulating layer and an electric-field-dispersion layer. The upper portion of the conducting layer is an electron supply layer, and the lower portion of the conducting layer is an electron tunnel layer. The gate insulating layer is laminated on the electron supply layer. The electric-field-dispersion layer is laminated on the gate insulating layer. The dielectric constant of the electric-field-dispersion layer is smaller than that of the gate insulating layer. A gate electrode is located between the electric-field-dispersion layer and the gate insulating layer. A source and a drain electrodes are respectively electrically connected to the electric-field-dispersion layer, the gate insulating layer, the electron supply layer, and the electron tunnel layer.

Abstract: A manufacturing method of a wavelength-converting component includes providing a substrate, providing a wavelength-converting layer and providing a reflective layer. The reflective layer is disposed on the substrate. The wavelength-converting layer is disposed on a surface of the reflective layer away from the substrate. The wavelength-converting layer includes a wavelength-converting material and a second organic adhesive. The wavelength-converting material is mixed in the second organic adhesive. The second organic adhesive includes an aromatic polyimide. The wavelength-converting component manufactured by the method of the invention can improve mechanical properties such as shear strength, tensile strength and fatigue strength, temperature resistance and reflectivity, and can reduce rates of moisture absorption. The projection apparatus including the wavelength-converting component can reduce degradation in image brightness.