Patents by Inventor Yu-Lin Wang

Yu-Lin Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230091364
    Abstract: A magnetic tunnel junction (MTJ) device includes two magnetic tunnel junction elements and a magnetic shielding layer. The two magnetic tunnel junction elements are arranged side by side. The magnetic shielding layer is disposed between the magnetic tunnel junction elements. A method of forming said magnetic tunnel junction (MTJ) device includes the following steps. An interlayer including a magnetic shielding layer is formed. The interlayer is etched to form recesses in the interlayer. The magnetic tunnel junction elements fill in the recesses. Or, a method of forming said magnetic tunnel junction (MTJ) device includes the following steps. A magnetic tunnel junction layer is formed. The magnetic tunnel junction layer is patterned to form magnetic tunnel junction elements. An interlayer including a magnetic shielding layer is formed between the magnetic tunnel junction elements.
    Type: Application
    Filed: December 2, 2022
    Publication date: March 23, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Wei Chen, Hui-Lin Wang, Yu-Ru Yang, Chin-Fu Lin, Yi-Syun Chou, Chun-Yao Yang
  • Publication number: 20230082845
    Abstract: An optical element driving mechanism is provided and includes a first movable part, a fixed assembly and a first driving assembly. The first movable part includes an optical element, and the first movable part is movable relative to the fixed assembly. The first driving assembly is configured to drive the first movable part to move relative to the fixed assembly. The fixed assembly includes a first base and a second base arranged along a first axis, and the first movable part moves along the first axis.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 16, 2023
    Inventors: Chao-Hsi WANG, Xuan-Huan SU, Yu-Chi KUO, Yueh-Lin LEE
  • Publication number: 20230077136
    Abstract: A backlight control method for a surface light-emitting device is provided. The backlight control method includes generating a plurality of driving currents to drive the surface light-emitting device such that a plurality of backlight zones generate a plurality of brightness values, measuring the plurality of brightness values of the plurality of backlight zones, calculating a plurality of uniformities of the plurality of backlight zones according to the plurality of brightness values and setting a plurality of target uniformities, generating a plurality of adjustment values according to the plurality of uniformities, the plurality of target uniformities and a plurality of adjustment coefficients corresponding to the plurality of backlight zones, and generating a plurality of adjusted driving currents to drive the plurality of backlight zones according to the plurality of adjustment values and the plurality of driving currents.
    Type: Application
    Filed: August 29, 2022
    Publication date: March 9, 2023
    Applicant: Radiant Opto-Electronics Corporation
    Inventors: Li-Fei Wang, Yu-Lin Hsieh, Sheng-Kai Fang, Pei-Ling Kao
  • Publication number: 20230063101
    Abstract: A driving mechanism is provided, including a base, a movable unit, and a movable part. The movable unit is movably disposed on the base and connected to an optical element. The movable part is movably disposed on the base and forms a passage. When the movable part moves from the first position to the second position relative to the base, the movable unit can slide relative to the base from its initial position through the passage to a closed position.
    Type: Application
    Filed: August 25, 2022
    Publication date: March 2, 2023
    Inventors: Chao-Hsi WANG, Yu-Chi KUO, Xuan-Huan SU, Yueh-Lin LEE
  • Publication number: 20230062162
    Abstract: A device includes a substrate, a contact, a first gate, a second gate, a dielectric feature between the gates, a via, and a conductive line. The gates are each adjacent the contact and aligned lengthwise with each other along a first direction. A first sidewall of the dielectric feature defines an end-wall of the first gate. A second sidewall of the dielectric feature defines an end-wall of the second gate. The conductive line extends along a second direction. A projection of the conductive line onto a top surface of the dielectric feature passes between the first and second sidewalls. The via interfaces with the contact along a second plane. The via has a first dimension on the second plane along the second direction; the contact has a second dimension on the second plane along the second direction. The first dimension is greater than the second dimension.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Inventors: Jui-Lin Chen, Yu-Kuan Lin, Ping-Wei Wang
  • Publication number: 20230057194
    Abstract: An electrical receptacle connector includes a metallic shell, an insulated housing in the metallic shell, a plurality of terminals at the insulated housing, and a metallic plate at the insulated housing. The terminals include two first terminal groups and two second terminal groups arranged in two rows, and the two rows are respectively arranged on the two faces of a tongue portion of the insulated housing. A length of each contact portion of each second terminal group is greater than a length of each contact portion of each first terminal group. The metallic plate is between the first terminal groups and the second terminal groups. The metallic plate has one or more extension portion between the contact portions of at least two adjacent terminals of one or more of the second terminal groups. The structural strength of the tongue portion can be improved by the extension portion.
    Type: Application
    Filed: August 17, 2022
    Publication date: February 23, 2023
    Inventors: Shu-Fen Wang, Yu-Chai Yeh, Guan-Lin Chen
  • Publication number: 20230053625
    Abstract: An electrical receptacle connector includes a metallic shell, an insulated housing in the metallic shell, a plurality of terminals at the insulated housing, and a metallic plate. The terminals are arranged in two rows, and the metallic plate is at the insulated housing and between the terminals in the two rows. The metallic plate includes a through hole at a front portion of the tongue portion. The through hole has several through portions and a communication portion between the through portions. By allowing that the communication portion to be in communication with the through portions to form a through hole in an elongated shape, the molding efficiency for forming the tongue portion with the filling of the plastic materials can be increased.
    Type: Application
    Filed: August 17, 2022
    Publication date: February 23, 2023
    Inventors: Shu-Fen Wang, Yu-Chai Yeh, Guan-Lin Chen
  • Publication number: 20230058301
    Abstract: An electrical receptacle connector includes a metallic shell, an insulated housing in the metallic shell, a plurality of terminals at the insulated housing, and a metallic plate. The terminals are arranged in two rows, and the metallic plate is at the insulated housing and between the terminals in the two rows. The metallic plate includes a first through hole, several second through holes, and several communication holes. By allowing that the communication holes to be in communication with the first through hole and the second through holes in the metallic plate, the molding efficiency for forming the tongue portion with the filling of the plastic materials can be increased.
    Type: Application
    Filed: August 17, 2022
    Publication date: February 23, 2023
    Inventors: Shu-Fen Wang, Yu-Chai Yeh, Guan-Lin Chen
  • Publication number: 20230038528
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.
    Type: Application
    Filed: October 18, 2022
    Publication date: February 9, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Patent number: 11573454
    Abstract: A display apparatus including a circuit board, a plurality of light-emitting devices and a display panel is provided. The light-emitting devices are disposed on the circuit board and electrically connected to the circuit board. The display panel is disposed on the light-emitting devices. The display panel includes a peripheral light-shielding pattern. An opening portion of the peripheral light-shielding pattern defines an active area of the display panel. A physical portion of the peripheral light-shielding pattern defines a non-active area of the display panel. An optical axis of a light-emitting surface of at least one of the light-emitting devices is located at a junction of the active area and the non-active area, at the non-active area, or at the active area and a side wall of the at least one of the light-emitting devices is located at the junction of the active area and the non-active area.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: February 7, 2023
    Assignee: Coretronic Corporation
    Inventors: Yu-Yu Liu, Tao-Lin Wang, Wen-Pin Yang, Chen-Hung Lin, Chung-Cheng Lin, Guan-Jr Huang
  • Publication number: 20230016073
    Abstract: A foldable electronic device includes a first casing, a second casing, a hinge structure and a foldable display. The hinge structure connects the first casing and the second casing, and includes a plurality of supporting blocks, a plurality of first hinge blocks and a plurality of second hinge blocks. The supporting blocks are arranged side by side between the first casing and the second casing. The first hinge blocks and the second hinge blocks are respectively arranged at two sides of the supporting blocks. One of the first hinge blocks connects two of the supporting blocks adjacent to each other. One of the second hinge blocks connects two of the supporting blocks adjacent to each other. The foldable display includes a first bonding portion secured to the first casing, a second bonding portion secured to the second casing and a foldable portion aligned to the hinge structure.
    Type: Application
    Filed: September 27, 2022
    Publication date: January 19, 2023
    Applicant: Acer Incorporated
    Inventors: Hui-Ping Sun, Wei-Chih Wang, Chun-Hung Wen, Yu-Cheng Shih, Yen-Chou Chueh, Chi-Tai Ho, Kuan-Lin Chen, Chun-Hsien Chen, Chih-Heng Tsou
  • Patent number: 11552241
    Abstract: A method for fabricating a semiconductor device includes the steps of: forming a first metal interconnection on a substrate; forming a stop layer on the first metal interconnection; removing the stop layer to form a first opening; forming an electromigration enhancing layer in the first opening; and forming a second metal interconnection on the electromigration enhancing layer. Preferably, top surfaces of the electromigration enhancing layer and the stop layer are coplanar.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: January 10, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Po-Kai Hsu, Hung-Yueh Chen, Yu-Ping Wang
  • Publication number: 20230005963
    Abstract: A driving circuit film configured to be bond at a periphery region of a display panel. The driving circuit film includes a flexible substrate, a gate driving circuit and a source driver. The gate driving circuit is disposed on the flexible substrate, and the gate driving circuit includes a Thin-Film Transistor. The source driver is disposed on the flexible substrate.
    Type: Application
    Filed: July 1, 2022
    Publication date: January 5, 2023
    Inventors: Yung-Sheng CHANG, Wei-Tsung CHEN, Yu-Lin WANG
  • Patent number: 11545521
    Abstract: A magnetic tunnel junction (MTJ) device includes two magnetic tunnel junction elements and a magnetic shielding layer. The two magnetic tunnel junction elements are arranged side by side. The magnetic shielding layer is disposed between the magnetic tunnel junction elements. A method of forming said magnetic tunnel junction (MTJ) device includes the following steps. An interlayer including a magnetic shielding layer is formed. The interlayer is etched to form recesses in the interlayer. The magnetic tunnel junction elements fill in the recesses. Or, a method of forming said magnetic tunnel junction (MTJ) device includes the following steps. A magnetic tunnel junction layer is formed. The magnetic tunnel junction layer is patterned to form magnetic tunnel junction elements. An interlayer including a magnetic shielding layer is formed between the magnetic tunnel junction elements.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: January 3, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Wei Chen, Hui-Lin Wang, Yu-Ru Yang, Chin-Fu Lin, Yi-Syun Chou, Chun-Yao Yang
  • Patent number: 11545560
    Abstract: A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a first spacer and a second spacer around the gate structure; forming a recess adjacent to two sides of the second spacer; performing a cleaning process to trim the second spacer for forming a void between the first spacer and the substrate; and forming an epitaxial layer in the recess.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: January 3, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Wei-Chih Chuang, Chia-Jong Liu, Kuang-Hsiu Chen, Chung-Ting Huang, Chi-Hsuan Tang, Kai-Hsiang Wang, Bing-Yang Jiang, Yu-Lin Cheng, Chun-Jen Chen, Yu-Shu Lin, Jhong-Yi Huang, Chao-Nan Chen, Guan-Ying Wu
  • Publication number: 20220413340
    Abstract: A display apparatus including a circuit board, a plurality of light-emitting devices and a display panel is provided. The light-emitting devices are disposed on the circuit board and electrically connected to the circuit board. The display panel is disposed on the light-emitting devices. The display panel includes a peripheral light-shielding pattern. An opening portion of the peripheral light-shielding pattern defines an active area of the display panel. A physical portion of the peripheral light-shielding pattern defines a non-active area of the display panel. An optical axis of a light-emitting surface of at least one of the light-emitting devices is located at a junction of the active area and the non-active area, at the non-active area, or at the active area and a side wall of the at least one of the light-emitting devices is located at the junction of the active area and the non-active area.
    Type: Application
    Filed: June 21, 2022
    Publication date: December 29, 2022
    Applicant: Coretronic Corporation
    Inventors: Yu-Yu Liu, Tao-Lin Wang, Wen-Pin Yang, Chen-Hung Lin, Chung-Cheng Lin, Guan-Jr Huang
  • Publication number: 20220406961
    Abstract: A micro light-emitting device has an epitaxial die having a top surface, a bottom surface and a plurality of sidewalls connected between the top surface and the bottom surface. A roughness of at least one part of the surface of at least one of the sidewalls is smaller than or equal to 10 nm, or an etch-pit density of the at least one part of the surface is smaller than 108/cm2, or a flatness tolerance of the at least one part of the surface is greater than 0.1 times a thickness of the epitaxial die. Therefore, the serious attenuation of the peak external quantum efficiency is prevented due to the sidewall damage effect after the light-emitting device is miniaturized.
    Type: Application
    Filed: November 1, 2021
    Publication date: December 22, 2022
    Inventors: Shen-Jie WANG, Yu-Yun LO, Yen-Lin LAI, Tzu-Yang LIN
  • Patent number: 11523220
    Abstract: The present disclosure relates to a media broadcasting system, including a first broadcasting device, a second broadcasting device and a processing device. The first broadcasting device and the second broadcasting device are respectively arranged at a first side and a second side of the media broadcasting system. The processing device is electrically coupled to the first broadcasting device and the second broadcasting device, and is configured to receive a media. The processing device is configured to obtain a first channel audio signal and a second channel audio signal from the media according to a first position parameter corresponding to the first broadcasting device and a second position parameter corresponding to the second broadcasting device. The processing device is further configured to transmit the first channel audio signal to the first broadcasting device and the second channel audio signal to the second broadcasting device.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: December 6, 2022
    Assignee: ATEN INTERNATIONAL CO., LTD.
    Inventors: Yi-Kang Lee, Yu-Lin Liu, Ding-Yuan Wang, Yu-Yang Lin
  • Patent number: 11508904
    Abstract: A method for fabricating semiconductor device includes the steps of: forming a first magnetic tunneling junction (MTJ) on a substrate; forming a first liner on the MTJ; forming a second liner on the first liner; forming an inter-metal dielectric (IMD) layer on the MTJ, and forming a metal interconnection in the IMD layer, the second liner, and the first liner to electrically connect the MTJ. Preferably, the first liner and the second liner are made of different materials.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: November 22, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Patent number: 11503728
    Abstract: A foldable electronic device includes a first casing, a second casing, a hinge structure and a foldable display. The hinge structure connects the first casing and the second casing, and includes a plurality of supporting blocks, a plurality of first hinge blocks and a plurality of second hinge blocks. The supporting blocks are arranged side by side between the first casing and the second casing. The first hinge blocks and the second hinge blocks are respectively arranged at two sides of the supporting blocks. One of the first hinge blocks connects two of the supporting blocks adjacent to each other. One of the second hinge blocks connects two of the supporting blocks adjacent to each other. The foldable display includes a first bonding portion secured to the first casing, a second bonding portion secured to the second casing and a foldable portion aligned to the hinge structure.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: November 15, 2022
    Assignee: Acer Incorporated
    Inventors: Hui-Ping Sun, Wei-Chih Wang, Chun-Hung Wen, Yu-Cheng Shih, Yen-Chou Chueh, Chi-Tai Ho, Kuan-Lin Chen, Chun-Hsien Chen, Chih-Heng Tsou