Abstract: A display device and a projector are provided. The display device includes a pixel light-emitting panel and multiple color conversion panels. The pixel light-emitting panel includes an N1 number of light-emitting pixel units distributed in an array, and the light-emitting pixel units are driven to emit light through a driver. A first color conversion panel includes an N2 number of first color pixels and an N3 number of first transparent pixels. The first color pixels and the first transparent pixels are disposed relative to the light-emitting pixel units. A second color conversion panel includes an N4 number of second color pixels and an N5 number of second transparent pixels. The second color pixels and the second transparent pixels are disposed relative to the light-emitting pixel units. The lights generated by at least part of the light-emitting pixel units sequentially pass through the first color pixels and the second transparent pixels to achieve the color conversion.

Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

Abstract: A method of cleaning wafer-cleaning brushes includes passing a wafer having a first polished main side and an opposing unpolished backside between a pair of substantially cylindrical shaped wafer-cleaning brushes are rotated about an axial direction of the brushes while passing the wafer between the pair of wafer-cleaning brushes. A cleaning solution is applied to the brushes while passing the wafer between the pair of wafer-cleaning brushes. While passing between the pair of brushes, the first polished main side of the wafer faces a first direction, the first direction is an opposite direction to which a polished side of a production wafer faces during a subsequent polished wafer cleaning operation. The substantially cylindrical shaped wafer-cleaning brushes include a plurality of protrusions on an external surface of the brushes, and the brushes contact the wafer at least a portion of time the wafer is passing between the pair of brushes.

Abstract: A system and method utilize directed self-assembly films, including block copolymers and solvents, to form features on a wafer. The solvents have high boiling points. The high boiling points of the solvents enable directed self-assembly processes to utilize very high temperature, rapid thermal annealing processes to generate a pattern of first and second polymer structures over a wafer from the directed self-assembly films. The pattern of the first and second polymer structures can be utilized to form the features on the wafer.

Abstract: A method for capturing a tool path, applicable to a machine tool having a controller and furnished with a tooling, includes the steps of: obtaining a data update frequency of the controller; calculating a feed rate of the controller, determining whether or not the feed rate is obtained, going to next step if positive, and going to the previous step if negative; reading G-codes of the controller to confirm the feed rate; and, based on the confirmed feed rate, recording machine coordinates transmitted from the controller for synthesizing a tool path file. The tool path file is used for simulation and analysis of machining of the machine tool. In addition, a device for capturing the tool path is also provided.

Abstract: A copper plating structure and a package structure including the same are provided, and the copper plating structure includes at least one first copper layer and at least one second copper layer. The first copper layer includes a (111) crystal plane, wherein a proportion of the (111) crystal plane in each of the first copper layers is 36% to 100%. The second copper layer is located on the first copper layer and includes a non-(111) crystal plane or includes a (111) crystal plane and a non-(111) crystal plane, wherein a proportion of the (111) crystal plane in each of the second copper layers is 0% to 57%.

Abstract: In a method of manufacturing a semiconductor device, an underlying structure is formed. A surface grafting layer is formed on the underlying structure. A photo resist layer is formed on the surface grafting layer. The surface grafting layer includes a coating material including a backbone polymer, a surface grafting unit coupled to the backbone polymer and an adhesion unit coupled to the backbone polymer.

Abstract: A method for capturing a tool path, applicable to a machine tool having a controller and furnished with a tooling, includes the steps of: obtaining a data update frequency of the controller; calculating a feed rate of the controller, determining whether or not the feed rate is obtained, going to next step if positive, and going to the previous step if negative; reading G-codes of the controller to confirm the feed rate; and, based on the confirmed feed rate, recording machine coordinates transmitted from the controller for synthesizing a tool path file. The tool path file is used for simulation and analysis of machining of the machine tool. In addition, a device for capturing the tool path is also provided.

Abstract: In a method of manufacturing a semiconductor device, an underlying structure is formed. A surface grafting layer is formed on the underlying structure. A photo resist layer is formed on the surface grafting layer. The surface grafting layer includes a coating material including a backbone polymer, a surface grafting unit coupled to the backbone polymer and an adhesion unit coupled to the backbone polymer.

Abstract: A tool monitoring method and a tool monitoring system are provided. The tool monitoring method includes extracting a first data and a second data of a tool of a machine tool, simulating and analyzing the first data to generate a comparison value, calculating the second data to obtain an actual value, and integrating and comparing the comparison value with the actual value to produce a comparison result for monitoring the operating condition of the tool.

Abstract: In a method of manufacturing a semiconductor device, an underlying structure is formed. A surface grafting layer is formed on the underlying structure. A photo resist layer is formed on the surface grafting layer. The surface grafting layer includes a coating material including a backbone polymer, a surface grafting unit coupled to the backbone polymer and an adhesion unit coupled to the backbone polymer.

Abstract: In a method of manufacturing a semiconductor device, an underlying structure is formed. A surface grafting layer is formed on the underlying structure. A photo resist layer is formed on the surface grafting layer. The surface grafting layer includes a coating material including a backbone polymer, a surface grafting unit coupled to the backbone polymer and an adhesion unit coupled to the backbone polymer.

Abstract: An isolated antibody or an antigen-binding fragment thereof having a specific binding affinity to an epitope located within the domain 1 or domain 3 of human vascular endothelial growth factor receptor 2 (VEGFR2; SEQ ID NO: 74) is disclosed. The epitope within the domain 3 of the VEGFR2 is located between amino acid residues 250 and 270 of SEQ ID NO: 74. Use of the antibody or antigen-binding fragment thereof in the manufacture of a medicament for inhibiting tumor growth, tumor angiogenesis, and/or inducing cancer cell cytotoxicity in a subject in need thereof is also disclosed. Also disclosed is a method of detecting the presence of VEGFR2 in a tumor vascular endothelial cell or a cancer cell in a biological sample.

Abstract: A system and a method for optimizing machining force of NC program is disclosed. The system includes a tool path acquisition unit and a NC program optimizing unit; the tool path acquisition unit is for acquiring a coordinate set of points composed by a coordinate information outputted by a controller, and modifying with respect to the coordinate set of points so as to form a tool path; the NC program optimizing unit is for analyzing machining force in accordance with the tool path, a tool information, a workpiece information and a machine tool characteristic information, and modifying with modified processing feed rates to generate an optimized NC program.

Abstract: A system and a method for optimizing machining force of NC program is disclosed. The system includes a tool path acquisition unit and a NC program optimizing unit; the tool path acquisition unit is for acquiring a coordinate set of points composed by a coordinate information outputted by a controller, and modifying with respect to the coordinate set of points so as to form a tool path; the NC program optimizing unit is for analyzing machining force in accordance with the tool path, a tool information, a workpiece information and a machine tool characteristic information, and modifying with modified processing feed rates to generate an optimized NC program.

Abstract: An isolated antibody or an antigen-binding fragment thereof having a specific binding affinity to an epitope located within the domain 1 or domain 3 of human vascular endothelial growth factor receptor 2 (VEGFR2; SEQ ID NO: 74) is disclosed. The epitope within the domain 3 of the VEGFR2 is located between amino acid residues 250 and 270 of SEQ ID NO: 74. Use of the antibody or antigen-binding fragment thereof in the manufacture of a medicament for inhibiting tumor growth, tumor angiogenesis, and/or inducing cancer cell cytotoxicity in a subject in need thereof is also disclosed. Also disclosed is a method of detecting the presence of VEGFR2 in a tumor vascular endothelial cell or a cancer cell in a biological sample.

Abstract: An apparatus for metal additive manufacturing and electrical discharging is used to machine a metal powder into a rigid body, and includes an apparatus frame unit, an additive manufacturing unit, and an electrical discharge machining unit. The additive manufacturing unit includes a powder applying unit for applying a layer of the metal powder onto a processing lift table of the apparatus frame unit, and a laser unit for heating a part of the metal powder within an imaginary contour line to form the rigid body. The electrical discharge machining unit includes a powder removing member for removing a part of the metal powder proximate to the imaginary contour line, and an electrode member for machining the rigid body via electrical discharge.

Abstract: Embodiments of mechanisms of a semiconductor structure are provided. The semiconductor device structure includes a substrate and a floating gate having a first sidewall and a second sidewall formed over the substrate. The semiconductor device further includes an insulating layer formed over the substrate to cover the first sidewall and an upper portion of the second sidewall of the floating gate. The semiconductor device further includes a control gate formed over the insulating layer. In addition, the floating gate is formed in a shark's fin shape.

Abstract: Embodiments of mechanisms of a semiconductor structure are provided. The semiconductor device structure includes a substrate and a floating gate having a first sidewall and a second sidewall formed over the substrate. The semiconductor device further includes an insulating layer formed over the substrate to cover the first sidewall and an upper portion of the second sidewall of the floating gate. The semiconductor device further includes a control gate formed over the insulating layer. In addition, the floating gate is formed in a shark's fin shape.

Abstract: The invention presents a single lens auto focus system of stereo image generation and a method thereof. The stereo three-dimensional (3D) image capturing method of a single lens auto focus camera, includes the steps of a) taking plural multi-focus images; b) estimating the plural multi-focus images to obtain a depth map and an all-in-focus image; c) mixing the depth map with plural background depth maps to obtain a mixed depth map; d) obtaining respectively a left image for left eye of user and a right image for right eye of user by means of depth image based rendering (DIBR); and e) outputting the left image and the right image, thereby displaying a stereo image onto a 3D display.