Abstract: An electronic device and a method of manufacturing the electronic device are provided. The method of manufacturing the electronic device includes the following steps: providing a circuit board; performing a first pre-bending step on the circuit board so that the circuit board is bent to have a first radius of curvature; providing a back frame having a second radius of curvature; attaching the circuit board having the first radius of curvature to the back frame through an adhesive. A difference between the first radius of curvature and the second radius of curvature is within 10%.

Abstract: An electronic device is provided, including an electronic element, and a protective substrate. The protective substrate includes a concave portion, and a flat portion. The concave portion has a concave surface and a convex surface that is opposite to the concave surface. The flat portion is connected to the concave portion. The electronic element overlaps the concave portion and is arranged under the convex surface.

Abstract: An electronic device is disclosed. The electronic device includes a first substrate, a circuit assembly, a second substrate, a first adhesive layer, and a second adhesive layer. The circuit assembly is disposed on the first substrate. The second substrate is disposed on the circuit assembly. The first adhesive layer is disposed between the circuit assembly and the first substrate. The first adhesive layer has a first outer profile. The second adhesive layer is disposed between the circuit assembly and the second substrate. The second adhesive layer has a second outer profile. The first outer profile and the second outer profile correspond to a same side of the electronic device. At least a portion of the first outer profile and at least a portion of the second outer profile are non-overlapped.