Abstract: In semiconductor manufacturing, deionized (DI) water or another process fluid is flowed through a nonmetallic pipe and onto a semiconductor wafer. Static electric charge is discharged from the DI water or other process fluid flowing through the nonmetallic pipe via an electrically conductive material disposed on an outside of the nonmetallic pipe. The electrically conductive material disposed on the outside of the nonmetallic pipe is electrically grounded. The nonmetallic pipe may comprise fluoropolymer (PFA) based tubing. In some embodiments, the nonmetallic pipe includes: a PFA-NE pipe connected with a chamber or housing containing the wafer, and a second pipe connected with the PFA-NE pipe by a pipe connector, in which the second pipe is more electrically insulating than the PFA-NE pipe.

Abstract: Disclosed herein are compounds designed and used in the degradation of pathogenic protein aggregates and oligomers, thus these compounds are suitable for use as medicaments for preventing and/or treating neurodegenerative diseases such as amyotrophic lateral sclerosis (ALS), frontotemporal lobar degeneration (FTLD), Alzheimer's disease (AD), and Huntington's disease (HD).

Abstract: In semiconductor manufacturing, deionized (DI) water or another process fluid is flowed through a nonmetallic pipe and onto a semiconductor wafer. Static electric charge is discharged from the DI water or other process fluid flowing through the nonmetallic pipe via an electrically conductive material disposed on an outside of the nonmetallic pipe. The electrically conductive material disposed on the outside of the nonmetallic pipe is electrically grounded. The nonmetallic pipe may comprise fluoropolymer (PFA) based tubing. In some embodiments, the nonmetallic pipe includes: a PFA-NE pipe connected with a chamber or housing containing the wafer, and a second pipe connected with the PFA-NE pipe by a pipe connector, in which the second pipe is more electrically insulating than the PFA-NE pipe.

Abstract: Disclosed is an LED luminous structure for backlight source with good light emitting efficiency and color light rendering and capable of preventing oxidation or affects overall light quality. The LED luminous structure includes a base, a blue LED chip, a green LED chip, a red phosphor and an encapsulation. The blue and green LED chips are installed on the base, and the red phosphor absorbs is excited by a light emitted from the blue LED chip to produce a red light. The encapsulation is for packaging the aforementioned components. The red phosphor has a particle size of 20-30 ?m, and the encapsulation has a moisture permeability of 10-20 g/m2.24h and an oxygen permeability smaller than 1000 cm3/m2.24h.atm to lower the chance of oxidizing the red phosphor and improve the stability, brightness and color gamut of the LED luminous structure by limiting the range of the particle size.

Abstract: Disclosed is an LED luminous structure for backlight source with good light emitting efficiency and color light rendering and capable of preventing oxidation or affects overall light quality. The LED luminous structure includes a base, a blue LED chip, a green LED chip, a red phosphor and an encapsulation. The blue and green LED chips are installed on the base, and the red phosphor absorbs is excited by a light emitted from the blue LED chip to produce a red light. The encapsulation is for packaging the aforementioned components. The red phosphor has a particle size of 20-30 ?m, and the encapsulation has a moisture permeability of 10-20 g/m2.24h and an oxygen permeability smaller than 1000 cm3/m2.24h.atm to lower the chance of oxidizing the red phosphor and improve the stability, brightness and color gamut of the LED luminous structure by limiting the range of the particle size.