Patents by Inventor Yu-Ling Wu

Yu-Ling Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240410001
    Abstract: The disclosure relates to methods for determining an endometrial status using a sample, for example, a blood plasma sample, from a subject, comprising: (a) performing an assay on the blood sample from the subject to determine a miRNA expression profile, wherein the miRNA expression profile comprises expression levels of a plurality of miRNA and (b) analyzing the miRNA expression profile to obtain a predictive score using a computer-based machine-learning model.
    Type: Application
    Filed: January 31, 2024
    Publication date: December 12, 2024
    Inventors: An Hsu, Pei-Yi Lin, Yu-Ling Chen, Ko-Wen Wu, Kuan-Chun Chen
  • Patent number: 12152969
    Abstract: Provided is a method for preparing a tissue section, including treating a tissue specimen with a clearing agent and at least one labeling agent to obtain a cleared and labeled tissue specimen; generating a three-dimensional (3D) image of the cleared and labeled tissue specimen; performing an image slicing procedure on the 3D image to generate a plurality of two-dimensional (2D) images; identifying a target 2D image among the plurality of 2D images to obtain a distance value of D1, which indicates the distance between the target 2D image and a predetermined surface of the 3D image; preparing a hardened tissue specimen from the cleared and labeled tissue specimen; and cutting the hardened tissue specimen near a predetermined site to obtain a tissue section, wherein the distance between the predetermined site and a surface of the hardened tissue specimen corresponding to the predetermined surface of the 3D image is D1.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: November 26, 2024
    Inventors: Ann-Shyn Chiang, Dah-Tsyr Chang, I-Ching Wang, Jia-Ling Yang, Shun-Chi Wu, Yen-Yin Lin, Yu-Chieh Lin
  • Patent number: 12137817
    Abstract: An interlocking mechanism for a seat and a back of a chair is provided. A seat body and a chair chassis are pivotally connected, and a pad plate is pivotally connected with the seat body. Thereby the pad plate is moved around a pivotal connection between itself and the seat body when users sit on the pad plate. While a front side of the pad plate is moved downward, it is inclined to an angle slowly by a pad spring connected with the pad plate. When the use is leaning on the chair back connected with the seat body, the seat body is moved backward with a pivotal connection between itself and the chair chassis. The pivotal connection between the seat body and the pad plate can push the pad plate upward so that the seat body is inclined with the chair back and the user sits more comfortably.
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: November 12, 2024
    Assignee: Comfordy Co., Ltd.
    Inventors: Yu-Ling Wu, Armin Roland Sander, Martin Potrykus
  • Publication number: 20240352584
    Abstract: The present disclosure generally provides an apparatus and method for gas diffuser support structure for a vacuum chamber. The gas diffuser support structure comprises a backing plate having a central bore, and a gas deflector having a length and a width unequal to the length coupled to the backing plate by a plurality of outward fasteners coupled to a plurality of outward threaded holes formed in the backing plate, in which a spacer is disposed between the backing plate and the gas deflector, and in which a length to width ratio of the gas deflector is about 0.1:1 to about 10:1.
    Type: Application
    Filed: March 27, 2024
    Publication date: October 24, 2024
    Inventors: Yu-Hsuan WU, Teng Mao WANG, Yan-Chi PAN, Yi-Jiun SHIU, Jrjyan Jerry CHEN, Cheng-yuan LIN, Hsiao-Ling YANG, Yu-Min WANG, Wen-Hao WU
  • Publication number: 20240355618
    Abstract: Various embodiments of the present application are directed towards a semiconductor-on-insulator (SOI) substrate. The SOI substrate includes a handle substrate; a device layer overlying the handle substrate; and an insulator layer separating the handle substrate from the device layer. The insulator layer meets the device layer at a first interface and meets the handle substrate at a second interface. The insulator layer comprises a getter material having a getter concentration profile. The handle substrate contains getter material and has a handle getter concentration profile. The handle getter concentration profile has a peak at the second interface and a gradual decline beneath the second interface until reaching a handle getter concentration.
    Type: Application
    Filed: July 2, 2024
    Publication date: October 24, 2024
    Inventors: Cheng-Ta Wu, Chia-Ta Hsieh, Kuo Wei Wu, Yu-Chun Chang, Ying Ling Tseng
  • Publication number: 20240341496
    Abstract: A chair assembly is provided. The chair assembly includes locking members arranged at a joint between a chair chassis and a seat back support and joints between the chair chassis and two armrests correspondingly. An assembly block of the locking member is formed on the chair chassis while an assembly groove of the locking member is formed in both the seat back support and the respective armrests for being fit on the assembly block of the chair chassis correspondingly. Now a tenon disposed on the assembly block is capable of being engaged with a locking hole arranged at the assembly groove. A positioning part elastically abuts against the opposite side walls of the assembly groove. Thereby assembly of the chair chassis with both the seat back support and the armrests is finished easily and quickly. The chair assembly is more comfortable and safe for users sitting thereon.
    Type: Application
    Filed: April 11, 2023
    Publication date: October 17, 2024
    Inventors: YU-LING WU, MARTIN POTRYKUS, ARMIN ROLAND SANDER
  • Publication number: 20240339564
    Abstract: A semiconductor device includes a semiconductor stack; a substrate formed on the semiconductor stack, including a lower surface connected to the semiconductor stack, an upper surface opposite to the lower surface, and a side surface between the lower surface and the upper surface, wherein the side surface includes a mirror area, a first scribing area, and a first crack area, the mirror area is closer to the lower surface than the first scribing area to the lower surface, and the first scribing area is located between the mirror area and the first crack area; an optical structure on the upper surface of the substrate; and a reflective structure on a side surface of the first scribing area and the first crack area, wherein the first scribing area is arranged below the upper surface of the substrate with a distance less than or equal to ΒΌ of a thickness of the substrate.
    Type: Application
    Filed: April 3, 2024
    Publication date: October 10, 2024
    Inventors: Wei-Che WU, Chih-Hao CHEN, Yu-Ling LIN, Chao-Hsing CHEN, Yong-Yang CHEN
  • Patent number: 12062539
    Abstract: Various embodiments of the present application are directed towards a semiconductor-on-insulator (SOI) substrate. The SOI substrate includes a handle substrate; a device layer overlying the handle substrate; and an insulator layer separating the handle substrate from the device layer. The insulator layer meets the device layer at a first interface and meets the handle substrate at a second interface. The insulator layer comprises a getter material having a getter concentration profile. The handle substrate contains getter material and has a handle getter concentration profile. The handle getter concentration profile has a peak at the second interface and a gradual decline beneath the second interface until reaching a handle getter concentration.
    Type: Grant
    Filed: June 2, 2023
    Date of Patent: August 13, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Ta Wu, Chia-Ta Hsieh, Kuo Wei Wu, Yu-Chun Chang, Ying Ling Tseng
  • Publication number: 20240258187
    Abstract: In an embodiment, a device includes: a first integrated circuit die having a first contact region and a first non-contact region; an encapsulant contacting sides of the first integrated circuit die; a dielectric layer contacting the encapsulant and the first integrated circuit die, the dielectric layer having a first portion over the first contact region, a second portion over the first non-contact region, and a third portion over a portion of the encapsulant; and a metallization pattern including: a first conductive via extending through the first portion of the dielectric layer to contact the first integrated circuit die; and a conductive line extending along the second portion and third portion of the dielectric layer, the conductive line having a straight portion along the second portion of the dielectric layer and a first meandering portion along the third portion of the dielectric layer.
    Type: Application
    Filed: April 10, 2024
    Publication date: August 1, 2024
    Inventors: Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu
  • Patent number: 12046506
    Abstract: In one example aspect, the present disclosure is directed to a method. The method includes receiving a workpiece having a conductive feature over a semiconductor substrate, forming a sacrificial material layer over the conductive feature, removing first portions of the sacrificial material layer to form line trenches and to expose a top surface of the conductive feature in one of the line trenches; forming line features in the line trenches, removing second portions of the sacrificial material layer to form gaps between the line features, and forming dielectric features in the gaps, the dielectric features enclosing an air gap.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: July 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Hsin Chan, Cai-Ling Wu, Chang-Wen Chen, Po-Hsiang Huang, Yu-Yu Chen, Kuan-Wei Huang, Jr-Hung Li, Jay Chiu, Ting-Kui Chang
  • Patent number: 12048164
    Abstract: A memory array and an operation method of the memory array are provided. The memory array includes first and second ferroelectric memory devices formed along a gate electrode, a channel layer and a ferroelectric layer between the gate electrode and the channel layer. The ferroelectric memory devices include: a common source/drain electrode and two respective source/drain electrodes, separately in contact with a side of the channel layer opposite to the ferroelectric layer, wherein the common source/drain electrode is disposed between the respective source/drain electrodes; and first and second auxiliary gates, capacitively coupled to the channel layer, wherein the first auxiliary gate is located between the common source/drain electrode and one of the respective source/drain electrodes, and the second auxiliary gate is located between the common source/drain electrode and the other respective source/drain electrode.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: July 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Ling Lu, Chen-Jun Wu, Ya-Yun Cheng, Sheng-Chih Lai, Yi-Ching Liu, Yu-Ming Lin, Feng-Cheng Yang, Chung-Te Lin
  • Publication number: 20240138572
    Abstract: An interlocking mechanism for a seat and a back of a chair is provided. A seat body and a chair chassis are pivotally connected, and a pad plate is pivotally connected with the seat body. Thereby the pad plate is moved around a pivotal connection between itself and the seat body when users sit on the pad plate. While a front side of the pad plate is moved downward, it is inclined to an angle slowly by a pad spring connected with the pad plate. When the use is leaning on the chair back connected with the seat body, the seat body is moved backward with a pivotal connection between itself and the chair chassis. The pivotal connection between the seat body and the pad plate can push the pad plate upward so that the seat body is inclined with the chair back and the user sits more comfortably.
    Type: Application
    Filed: October 26, 2022
    Publication date: May 2, 2024
    Inventors: YU-LING WU, ARMIN ROLAND SANDER, MARTIN POTRYKUS
  • Patent number: 11805917
    Abstract: A chair base is revealed. A round bulge is formed on a center of a bottom surface of a bottom plate and a limit portion is gradually flattened from the round bulge toward a periphery of the bottom plate. A base body is disposed on a top surface of the bottom plate while a cover is used for covering the base body therein and enclosing the periphery of the bottom plate. Thereby the bottom plate, the base body, and the cover are connected and fixed by one another. While in use, users rock the chair by the round bulge on the bottom plate in response to their shifts in center of gravity. A rock angle of the chair is limited by the limit portion. Thereby the users will not tip the chair over while rocking the chair violently and safety in use is ensured.
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: November 7, 2023
    Assignee: Comfordy Co., Ltd.
    Inventor: Yu-Ling Wu
  • Publication number: 20230292927
    Abstract: A chair base is revealed. A round bulge is formed on a center of a bottom surface of a bottom plate and a limit portion is gradually flattened from the round bulge toward a periphery of the bottom plate. A base body is disposed on a top surface of the bottom plate while a cover is used for covering the base body therein and enclosing the periphery of the bottom plate. Thereby the bottom plate, the base body, and the cover are connected and fixed by one another. While in use, users rock the chair by the round bulge on the bottom plate in response to their shifts in center of gravity. A rock angle of the chair is limited by the limit portion. Thereby the users will not tip the chair over while rocking the chair violently and safety in use is ensured.
    Type: Application
    Filed: March 18, 2022
    Publication date: September 21, 2023
    Inventor: YU-LING WU
  • Patent number: 11672347
    Abstract: A chair back and seat assembly is revealed. The assembly includes a seat base having an assembly recess with two long locking hole on two side walls, and a back support which includes a connection portion on one end and a driving member at the connection portion and connected with locking bars of the connection portion. During assembly, a pull plate of the driving member is pushed by a recess opening of the assembly recess when the connection portion of the back support is mounted into the recess opening of the assembly recess. Thus the driving member is moved backward and driving the two pre-retracted locking bars to be protruding and further locked by the locking holes of the assembly recess. Thereby the assembly is completed easily and conveniently. The design also prevents the seat base and the back support from unexpected loosening while seated.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: June 13, 2023
    Assignee: Comfordy Co., Ltd.
    Inventor: Yu-Ling Wu
  • Patent number: 11337525
    Abstract: A reclining seatback support device which mainly includes at least one seatback support and a seatback body is revealed. The seatback body and an upper end of the seatback support are provided with pivot bracket portions pivotally connected to each other while a lower part of the seatback body and the seatback support are connected by a swing arm. When a user is sitting and lying down on the back, the seatback body is rotated around the pivot axis where the seatback body is pivotally connected to the upper end of the seatback support and then reclined at a certain angle. By elastic segments of the seatback body and the swing arm between the lower part of the seatback body and the seatback support for pulling and limiting the seatback body, the user can lean on the seatback body comfortably and safely.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: May 24, 2022
    Assignee: Comfordy Co., Ltd.
    Inventors: Yu-Ling Wu, Armin Roland Sander, Luca Mazzon
  • Patent number: 11213132
    Abstract: The present invention discloses a structure for rapidly assembling a chair back and a chair seat. It comprises a chair seat underframe having a first engaging portion and an assembling channel and a chair back stand having a second engaging portion and an assembling block for correspondingly engaging with the assembling channel. The assembling channel has two protrusions at two lateral walls and the assembling block has two engaging grooves at two laterals for positioning and engaging with the two protrusions. The assembling channel of the chair seat underframe has an engaging hole, and a telescopic pin disposed at a bottom of the assembling block is positioned and engaged with the engaging hole. The assembling channel of the chair seat underframe and the assembling block of the chair back stand are further screwed together by a screwing member.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: January 4, 2022
    Assignee: Comfordy Co., Ltd.
    Inventors: Yu-Ling Wu, Armin Roland Sander, Cyrille Jehan Charier
  • Patent number: 11051624
    Abstract: A twistable chair backrest frame is disclosed herein. It has a hollow section and two opposite elastic supporting ribs at a right side and a left side of the hollow section.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: July 6, 2021
    Assignee: Comfordy Co., Ltd.
    Inventors: Yu-Ling Wu, Armin Roland Sander, Cyrille Jehan Charier
  • Patent number: D910359
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: February 16, 2021
    Assignee: Comfordy Co., Ltd.
    Inventors: Yu-Ling Wu, Armin Roland Sander, Cyrille Jehan Charier
  • Patent number: D1044550
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: October 1, 2024
    Assignee: YUN YUN AI BABY CAMERA CO., LTD.
    Inventors: Shih-Yun Shen, Hsin-Yi Lin, Tzu-Ling Liang, Huan-Yun Wu, Meng-Ta Chiang, Yu-Chiao Wang