Abstract: A method for fabricating an integrated circuit device is provided. The method includes depositing a first dielectric layer; depositing a second dielectric layer over the first dielectric layer; etching a trench opening in the second dielectric layer, wherein the trench opening exposes a first sidewall of the second dielectric layer and a second sidewall of the second dielectric layer, the first sidewall of the second dielectric layer extends substantially along a first direction, and the second sidewall of the second dielectric layer extends substantially along a second direction different from the first direction in a top view; forming a via etch stop layer on the first sidewall of the second dielectric layer, wherein the second sidewall of the second dielectric layer is free from coverage by the via etch stop layer; forming a conductive line in the trench opening; and forming a conductive via over the conductive line.

Abstract: A memory cell structure includes a transistor structure and a capacitor structure, where the capacitor structure includes a hydrogen absorption layer. The hydrogen absorption layer absorbs hydrogen, which prevents or reduces the likelihood of the hydrogen diffusing into an underlying metal-oxide channel of the transistor structure. In this way, the hydrogen absorption layer minimizes and/or reduces the likelihood of hydrogen contamination in the metal-oxide channel, which may enable a low current leakage to be achieved for the memory cell structure and reduces the likelihood of data corruption and/or failure of the memory cell structure, among other examples.

Abstract: A micro light-emitting element is provided. The micro light-emitting element includes a first-type semiconductor having a bottom surface and a light-emitting layer disposed on the first-type semiconductor. The micro light-emitting element also includes a second-type semiconductor disposed on the light-emitting layer and an intrinsic semiconductor disposed on the second-type semiconductor and made of the same material as the second-type semiconductor. The intrinsic semiconductor has a top surface relative to the bottom surface. The sidewalls of the first-type semiconductor, the light-emitting layer, the second-type semiconductor, and the intrinsic semiconductor form a continuous side surface, and the side surface connects the bottom surface to the top surface.

Abstract: A display device and a projector are provided. The display device includes a pixel light-emitting panel and multiple color conversion panels. The pixel light-emitting panel includes an N1 number of light-emitting pixel units distributed in an array, and the light-emitting pixel units are driven to emit light through a driver. A first color conversion panel includes an N2 number of first color pixels and an N3 number of first transparent pixels. The first color pixels and the first transparent pixels are disposed relative to the light-emitting pixel units. A second color conversion panel includes an N4 number of second color pixels and an N5 number of second transparent pixels. The second color pixels and the second transparent pixels are disposed relative to the light-emitting pixel units. The lights generated by at least part of the light-emitting pixel units sequentially pass through the first color pixels and the second transparent pixels to achieve the color conversion.

Abstract: A chair assembly is provided. The chair assembly includes locking members arranged at a joint between a chair chassis and a seat back support and joints between the chair chassis and two armrests correspondingly. An assembly block of the locking member is formed on the chair chassis while an assembly groove of the locking member is formed in both the seat back support and the respective armrests for being fit on the assembly block of the chair chassis correspondingly. Now a tenon disposed on the assembly block is capable of being engaged with a locking hole arranged at the assembly groove. A positioning part elastically abuts against the opposite side walls of the assembly groove. Thereby assembly of the chair chassis with both the seat back support and the armrests is finished easily and quickly. The chair assembly is more comfortable and safe for users sitting thereon.

Abstract: Interconnect structures for front-to-front stacked chips/dies and methods of fabrication thereof are disclosed herein. An exemplary system on integrated circuit (SoIC) includes a first die that is front-to-front bonded with a second die, for example, by bonding a first topmost metallization layer of a first frontside multilayer interconnect of the first die to a second topmost metallization layer of a second frontside multilayer interconnect of the second die. A through via extends partially through the first frontside multilayer interconnect of the first die, through a device layer of the first die, through a backside power rail of the first die, and through a carrier substrate. The backside power rail is between the carrier substrate and the device layer, and the backside power rail may be a portion of a backside multilayer interconnect of the first die. The through via may be connected to a redistribution layer (RDL) structure.

Abstract: A method includes forming a first multilayer interconnect structure over a first side of a device layer, forming a first portion of a second multilayer interconnect structure under a second side of the device layer, forming a trench that extends through the second dielectric layer, the device layer, and the first dielectric layer, forming a conductive structure in the trench, and forming a second portion of the second multilayer interconnect structure under the first portion of the second multilayer interconnect structure. The second portion of the second multilayer interconnect structure includes patterned metal layers disposed in a third dielectric layer, and wherein one or more of the patterned metal layers are in electrical connection with the conductive structure.

Abstract: In semiconductor manufacturing, deionized (DI) water or another process fluid is flowed through a nonmetallic pipe and onto a semiconductor wafer. Static electric charge is discharged from the DI water or other process fluid flowing through the nonmetallic pipe via an electrically conductive material disposed on an outside of the nonmetallic pipe. The electrically conductive material disposed on the outside of the nonmetallic pipe is electrically grounded. The nonmetallic pipe may comprise fluoropolymer (PFA) based tubing. In some embodiments, the nonmetallic pipe includes: a PFA-NE pipe connected with a chamber or housing containing the wafer, and a second pipe connected with the PFA-NE pipe by a pipe connector, in which the second pipe is more electrically insulating than the PFA-NE pipe.

Abstract: An interlocking mechanism for a seat and a back of a chair is provided. A seat body and a chair chassis are pivotally connected, and a pad plate is pivotally connected with the seat body. Thereby the pad plate is moved around a pivotal connection between itself and the seat body when users sit on the pad plate. While a front side of the pad plate is moved downward, it is inclined to an angle slowly by a pad spring connected with the pad plate. When the use is leaning on the chair back connected with the seat body, the seat body is moved backward with a pivotal connection between itself and the chair chassis. The pivotal connection between the seat body and the pad plate can push the pad plate upward so that the seat body is inclined with the chair back and the user sits more comfortably.

Abstract: A chair assembly is provided. The chair assembly includes locking members arranged at a joint between a chair chassis and a seat back support and joints between the chair chassis and two armrests correspondingly. An assembly block of the locking member is formed on the chair chassis while an assembly groove of the locking member is formed in both the seat back support and the respective armrests for being fit on the assembly block of the chair chassis correspondingly. Now a tenon disposed on the assembly block is capable of being engaged with a locking hole arranged at the assembly groove. A positioning part elastically abuts against the opposite side walls of the assembly groove. Thereby assembly of the chair chassis with both the seat back support and the armrests is finished easily and quickly. The chair assembly is more comfortable and safe for users sitting thereon.

Abstract: An interlocking mechanism for a seat and a back of a chair is provided. A seat body and a chair chassis are pivotally connected, and a pad plate is pivotally connected with the seat body. Thereby the pad plate is moved around a pivotal connection between itself and the seat body when users sit on the pad plate. While a front side of the pad plate is moved downward, it is inclined to an angle slowly by a pad spring connected with the pad plate. When the use is leaning on the chair back connected with the seat body, the seat body is moved backward with a pivotal connection between itself and the chair chassis. The pivotal connection between the seat body and the pad plate can push the pad plate upward so that the seat body is inclined with the chair back and the user sits more comfortably.

Abstract: A chair base is revealed. A round bulge is formed on a center of a bottom surface of a bottom plate and a limit portion is gradually flattened from the round bulge toward a periphery of the bottom plate. A base body is disposed on a top surface of the bottom plate while a cover is used for covering the base body therein and enclosing the periphery of the bottom plate. Thereby the bottom plate, the base body, and the cover are connected and fixed by one another. While in use, users rock the chair by the round bulge on the bottom plate in response to their shifts in center of gravity. A rock angle of the chair is limited by the limit portion. Thereby the users will not tip the chair over while rocking the chair violently and safety in use is ensured.

Abstract: A chair base is revealed. A round bulge is formed on a center of a bottom surface of a bottom plate and a limit portion is gradually flattened from the round bulge toward a periphery of the bottom plate. A base body is disposed on a top surface of the bottom plate while a cover is used for covering the base body therein and enclosing the periphery of the bottom plate. Thereby the bottom plate, the base body, and the cover are connected and fixed by one another. While in use, users rock the chair by the round bulge on the bottom plate in response to their shifts in center of gravity. A rock angle of the chair is limited by the limit portion. Thereby the users will not tip the chair over while rocking the chair violently and safety in use is ensured.

Abstract: A chair back and seat assembly is revealed. The assembly includes a seat base having an assembly recess with two long locking hole on two side walls, and a back support which includes a connection portion on one end and a driving member at the connection portion and connected with locking bars of the connection portion. During assembly, a pull plate of the driving member is pushed by a recess opening of the assembly recess when the connection portion of the back support is mounted into the recess opening of the assembly recess. Thus the driving member is moved backward and driving the two pre-retracted locking bars to be protruding and further locked by the locking holes of the assembly recess. Thereby the assembly is completed easily and conveniently. The design also prevents the seat base and the back support from unexpected loosening while seated.

Abstract: A reclining seatback support device which mainly includes at least one seatback support and a seatback body is revealed. The seatback body and an upper end of the seatback support are provided with pivot bracket portions pivotally connected to each other while a lower part of the seatback body and the seatback support are connected by a swing arm. When a user is sitting and lying down on the back, the seatback body is rotated around the pivot axis where the seatback body is pivotally connected to the upper end of the seatback support and then reclined at a certain angle. By elastic segments of the seatback body and the swing arm between the lower part of the seatback body and the seatback support for pulling and limiting the seatback body, the user can lean on the seatback body comfortably and safely.

Abstract: The present invention discloses a structure for rapidly assembling a chair back and a chair seat. It comprises a chair seat underframe having a first engaging portion and an assembling channel and a chair back stand having a second engaging portion and an assembling block for correspondingly engaging with the assembling channel. The assembling channel has two protrusions at two lateral walls and the assembling block has two engaging grooves at two laterals for positioning and engaging with the two protrusions. The assembling channel of the chair seat underframe has an engaging hole, and a telescopic pin disposed at a bottom of the assembling block is positioned and engaged with the engaging hole. The assembling channel of the chair seat underframe and the assembling block of the chair back stand are further screwed together by a screwing member.

Abstract: A twistable chair backrest frame is disclosed herein. It has a hollow section and two opposite elastic supporting ribs at a right side and a left side of the hollow section.

Abstract: The present invention provides a pharmaceutical composition for inhibiting pathologic angiogenesis and/or cell proliferative disorder. The pharmaceutical composition of the present invention comprises an effective amount of LECT2 protein or analogue thereof, and a pharmaceutically acceptable carrier.

Abstract: A portable, automated telephone line test device includes a test module which applies test signals to a telephone line to be tested and detects electrical characteristics of the telephone line, and a user interface module. The user interface module includes a microprocessor, a display, a keyboard and a program memory in accordance with a standard microcomputer architecture. The processor of the user interface module is programmed to control the test module to perform a pre-programmed sequence of tests. The display provides indications of the tests being performed. The programmed sequence is varied by the device according to test results. Depending on the results obtained, the device also provides interpretative diagnostic messages and instructs the user to carry out additional test procedures.