Patents by Inventor Yu-Ling Yu

Yu-Ling Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Filter and capacitor using redistribution layer and micro bump layer
    Patent number: 9449945
    Abstract: An integrated circuit package includes a die. An electrically conductive layer comprises a redistribution layer (RDL) in the die, or a micro-bump layer above the die, or both. The micro bump layer comprises at least one micro-bump line. A filter comprises the electrically conductive layer. A capacitor comprises an electrode formed in the electrically conductive layer.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: September 20, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiao-Tsung Yen, Jhe-Ching Lu, Yu-Ling Yu, Chin-Wei Kuo, Min-Chie Jeng