Abstract: In a method for obtaining the equivalent oxide thickness of a dielectric layer, a first semiconductor capacitor including a first silicon dioxide layer and a second semiconductor capacitor including a second silicon dioxide layer are provided and a modulation voltage is applied to the semiconductor capacitors to measure a first scanning capacitance microscopic signal and a second scanning capacitance microscopic signal. According to the equivalent oxide thicknesses of the silicon dioxide layers and the scanning capacitance microscopic signals, an impedance ratio is calculated. The modulation voltage is applied to a third semiconductor capacitor including a dielectric layer to measure a third scanning capacitance microscopic signal. Finally, the equivalent oxide thickness of the dielectric layer is obtained according to the equivalent oxide thickness of the first silicon dioxide layer, the first scanning capacitance microscopic signal, third scanning capacitance microscopic signal, and the impedance ratio.

Abstract: A user selects a node that specifies an operation for a dataset. In response, a computer system displays data values for the dataset, in a grid in a data pane. The grid includes a first column and a second column. In the grid, the user edits a first data value in the first column in a first row. The user input changes the first data value to a replacement data value. The computer system identifies a second data value in the second column in the first row, and identifies one or more additional rows in the grid, whose data values for the first column and the second column match the first data value and the second data value. The computer system then updates the data value in the first column for a second row in the grid to the replacement data value.

Abstract: A light-emitting device comprises a substrate; a first light-emitting unit and a second light-emitting unit formed on the substrate, each of the first light-emitting unit and the second light-emitting unit comprises a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, wherein the first light-emitting unit comprises a first semiconductor mesa and a first surrounding part surrounding the first semiconductor mesa, and the second light-emitting unit comprises a second semiconductor mesa and a second surrounding part surrounding the second semiconductor mesa; a trench formed between the first light-emitting unit and the second light-emitting unit and exposing the substrate; a first insulating layer comprising a first opening on the first surrounding part and a second opening on the second semiconductor layer of the second light-emitting unit; and a connecting electrode comprising a first connecting part on the first

Abstract: Disclosed herein are humanized antibodies, antigen-binding fragments thereof, and antibody conjugates, that are capable of specifically binding to certain biantennary Lewis antigens, which antigens are expressed in a variety of cancers. The presently disclosed antibodies are useful to target antigen-expressing cells for treatment or detection of disease, including various cancers. Also provided are polynucleotides, vectors, and host cells for producing the disclosed antibodies and antigen-binding fragments thereof. Pharmaceutical compositions, methods of treatment and detection, and uses of the antibodies, antigen-binding fragments, antibody conjugates, and compositions are also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: An antimicrobial electrochemical fabric and a method for manufacturing the same are provided. The method for manufacturing the antimicrobial electrochemical fabric includes the following steps: providing an electro-spinning polymer solution, in which the electro-spinning polymer solution includes a polymer and a plurality of antimicrobial metal precursors; electro-spinning the electro-spinning polymer solution into a polymer fiber for formation of a sheet structure, in which the plurality of antimicrobial metal precursors are distributed on the polymer fiber; and reducing the plurality of antimicrobial metal precursors into a plurality of antimicrobial metal particles, so as to form the sheet structure into the antimicrobial electrochemical fabric.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A user selects a node that specifies an operation for a dataset. In response, a computer system displays data values for the dataset, in a grid in a data pane. The grid includes a first column and a second column. In the grid, the user edits a first data value in the first column in a first row. The user input changes the first data value to a replacement data value. The computer system identifies a second data value in the second column in the first row, and identifies one or more additional rows in the grid, whose data values for the first column and the second column match the first data value and the second data value. The computer system then updates the data value in the first column for a second row in the grid to the replacement data value.

Abstract: A method prepares data for subsequent analysis. The method displays a user interface that includes a plurality of panes, including a data flow pane and a data pane. The data flow pane includes a flow diagram having a plurality of nodes, each node specifying a respective primary operation or specifying a plurality of secondary operations to clean a respective data set. The data pane includes a plurality of data values in rows and columns. The data values correspond to a selected node in the data flow pane. A first user input selects a first data value in a first column and receives a second user input to edit a second data value in a second column according to one or more predefined conditions. The method then highlights the second column. When the predefined conditions are met, the method changes the second data value to a replacement data value.

Abstract: A three-finger mechanical gripper system is provided, which includes a torque sensor, a three-finger mechanical gripper, an image capturing module and a controller. The three-finger mechanical gripper is connected to the torque sensor. The controller is connected to the torque sensor, the three-finger mechanical gripper and the image capturing module. The image capturing module captures the image of a training object. The controller controls the three-finger mechanical gripper to grip the training object by a plurality of gripper postures respectively and calculates the torque information of each gripper posture according to the measured values of the torque sensor. Then, the controller performs a training process according to the image of the training object and the torque information of the gripper postures in order to obtain a training result of the training object.

Abstract: A lawn mower includes an electric motor, a driving assembly coupled to the electric motor, a blade assembly coupled to the driving assembly, a battery for providing electricity to the electric motor, a switch unit electrically connected to the electric motor and the battery, and a detecting unit. The detecting unit includes a sampling resistor electrically connected in series with the battery, and a trigger circuit electrically connected in parallel with the sampling resistor and configured to control the switch unit to make or break electrical connection between the electric motor and the battery according to detected voltage across the sampling resistor.

Abstract: An inductive electroacoustic transducer which includes a yoke, a magnetic circuit system disposing in the yoke, a vibration membrane which is driven by the magnetic circuit system, a cover coupled on one side of the yoke and it has a plurality of sound holes, and a circuit board which has a positive pole and a negative pole for importing acoustic electrical signals. The circuit board also has an inductive soldering disc and it is coupled to another side of the yoke. A portion of the yoke is connected to the inductive soldering disc with which it is conducted.

Abstract: An inductive electroacoustic transducer which includes a yoke, a magnetic circuit system disposing in the yoke, a vibration membrane which is driven by the magnetic circuit system, a cover coupled on one side of the yoke and it has a plurality of sound holes, and a circuit board which has a positive pole and a negative pole for importing acoustic electrical signals. The circuit board also has an inductive soldering disc and it is coupled to another side of the yoke. A portion of the yoke is connected to the inductive soldering disc with which it is conducted.

Abstract: A lawn mower includes an electric motor, a driving assembly coupled to the electric motor, a blade assembly coupled to the driving assembly, a battery for providing electricity to the electric motor, a switch unit electrically connected to the electric motor and the battery, and a detecting unit. The detecting unit includes a sampling resistor electrically connected in series with the battery, and a trigger circuit electrically connected in parallel with the sampling resistor and configured to control the switch unit to make or break electrical connection between the electric motor and the battery according to detected voltage across the sampling resistor.

Abstract: A cutting mold for removing two opposite superfluous rigid circuit boards from a rigid-flexible circuit board. A first cutter is connected to a first moldboard. A first barricade is connected to the first moldboard. The maximum vertical distance from the first barricade to the first moldboard exceeds that from the first cutter to the first moldboard. A second moldboard is opposite the first moldboard. The first and second moldboards move with respect to each other. A second cutter is connected to the second moldboard and corresponds to the first cutter. A second barricade is connected to the second moldboard and detachably abuts the first barricade. The maximum vertical distance from the second barricade to the second moldboard exceeds that from the second cutter to the second moldboard. The first and second cutters cut the superfluous rigid circuit boards when the first and second moldboards move toward each other.

Abstract: A cutting mold for removing two opposite superfluous rigid circuit boards from a rigid-flexible circuit board. A first cutter is connected to a first moldboard. A first barricade is connected to the first moldboard. The maximum vertical distance from the first barricade to the first moldboard exceeds that from the first cutter to the first moldboard. A second moldboard is opposite the first moldboard. The first and second moldboards move with respect to each other. A second cutter is connected to the second moldboard and corresponds to the first cutter. A second barricade is connected to the second moldboard and detachably abuts the first barricade. The maximum vertical distance from the second barricade to the second moldboard exceeds that from the second cutter to the second moldboard. The first and second cutters cut the superfluous rigid circuit boards when the first and second moldboards move toward each other.

Abstract: A method for manufacturing a rigid-flex board is disclosed. After the formation of each layer of the rigid-flex board, a laser-etched groove is formed at the interface between a rigid part and a bending area of the rigid-flex board. After the laser etching process, a circuit-board routing process is performed to remove materials along the sideward perimeter of the bending area. The exposed copper layer is then removed from inside the laser-etched groove. Thereafter, a redundancy rigid structure within the bending area is readily removed to expose the flex board within the bending area.

Abstract: A vibration unit includes a sound ring and a membrane attached to the sound ring. The membrane includes a rim for attachment to a shell of an acoustic device, a convex-concave annular region, a first non-planar connective region between the convex-concave annular region and the rim, a convex-concave circular region and a second non-planar connective region between the convex-concave circular region and the convex-concave annular region.

Abstract: The present invention provides a method for determining resist trim times in an etch process. In one embodiment of the invention, the method for determining resist trim times includes obtaining resist profile data and critical dimension (CD) data of a patterned resist layer using a scatterometer, in a step 520, and then obtaining an estimated trim time of the patterned resist layer using the resist profile data and critical dimension data, in steps 530-550.

Abstract: A wafer transfer chamber, such as a load-lock chamber used in a cluster processing tool for semiconductor devices that has reduced particle contamination problem is provided. In the wafer transfer chamber, a particle filter is provided to shield or isolate a wafer cassette during a chamber pumping and venting process such that not only particle contamination on the wafers situated in the wafer cassette can be drastically reduced, but also the cycle time or time for pumping and venting the load-lock chamber can be significantly reduced since turbulent flow in the chamber interior can be tolerated when the wafers are isolated from such flow which carries contaminating particles.