Abstract: A semiconductor device including a contact plug formed in a contact hole using a multi-stage contact etch process. The semiconductor device comprises a source/drain region over a semiconductor substrate, an oxide layer extension extending from the source/drain region toward a gate dielectric layer, and a contact plug extending through a dielectric layer over the source/drain region, the contact plug extending through a first etch stop layer and a second etch stop layer to a horizontal remaining portion of the oxide layer extension.

Abstract: A charging device includes a charging pile, a pulley set, a charging cable, a charging gun, and a positioning member. The charging pile has an inner space and a top opening. The pulley set is disposed in the inner space. The charging cable has a fixed end wound on the pulley set and a connecting end extending out of the inner space through the top opening. The charging gun includes a grip part, a charging connector, and a cable connecting part. The connecting end of the charging cable is inserted into the cable connecting part. The cable connecting part has a connecting hole and a limiting slot located in the connecting hole. The positioning member is sleeved on the connecting end and located in the connecting hole. The positioning member has a limiting part, and the limiting part is slidably disposed in the limiting slot.

Abstract: A user selects a node that specifies an operation for a dataset. In response, a computer system displays data values for the dataset, in a grid in a data pane. The grid includes a first column and a second column. In the grid, the user edits a first data value in the first column in a first row. The user input changes the first data value to a replacement data value. The computer system identifies a second data value in the second column in the first row, and identifies one or more additional rows in the grid, whose data values for the first column and the second column match the first data value and the second data value. The computer system then updates the data value in the first column for a second row in the grid to the replacement data value.

Abstract: A user selects a node that specifies an operation for a dataset. In response, a computer system displays data values for the dataset, in a grid in a data pane. The grid includes a first column and a second column. In the grid, the user edits a first data value in the first column in a first row. The user input changes the first data value to a replacement data value. The computer system identifies a second data value in the second column in the first row, and identifies one or more additional rows in the grid, whose data values for the first column and the second column match the first data value and the second data value. The computer system then updates the data value in the first column for a second row in the grid to the replacement data value.

Abstract: A method prepares data for subsequent analysis. The method displays a user interface that includes a plurality of panes, including a data flow pane and a data pane. The data flow pane includes a flow diagram having a plurality of nodes, each node specifying a respective primary operation or specifying a plurality of secondary operations to clean a respective data set. The data pane includes a plurality of data values in rows and columns. The data values correspond to a selected node in the data flow pane. A first user input selects a first data value in a first column and receives a second user input to edit a second data value in a second column according to one or more predefined conditions. The method then highlights the second column. When the predefined conditions are met, the method changes the second data value to a replacement data value.

Abstract: A three-finger mechanical gripper system is provided, which includes a torque sensor, a three-finger mechanical gripper, an image capturing module and a controller. The three-finger mechanical gripper is connected to the torque sensor. The controller is connected to the torque sensor, the three-finger mechanical gripper and the image capturing module. The image capturing module captures the image of a training object. The controller controls the three-finger mechanical gripper to grip the training object by a plurality of gripper postures respectively and calculates the torque information of each gripper posture according to the measured values of the torque sensor. Then, the controller performs a training process according to the image of the training object and the torque information of the gripper postures in order to obtain a training result of the training object.

Abstract: A lawn mower includes an electric motor, a driving assembly coupled to the electric motor, a blade assembly coupled to the driving assembly, a battery for providing electricity to the electric motor, a switch unit electrically connected to the electric motor and the battery, and a detecting unit. The detecting unit includes a sampling resistor electrically connected in series with the battery, and a trigger circuit electrically connected in parallel with the sampling resistor and configured to control the switch unit to make or break electrical connection between the electric motor and the battery according to detected voltage across the sampling resistor.

Abstract: An inductive electroacoustic transducer which includes a yoke, a magnetic circuit system disposing in the yoke, a vibration membrane which is driven by the magnetic circuit system, a cover coupled on one side of the yoke and it has a plurality of sound holes, and a circuit board which has a positive pole and a negative pole for importing acoustic electrical signals. The circuit board also has an inductive soldering disc and it is coupled to another side of the yoke. A portion of the yoke is connected to the inductive soldering disc with which it is conducted.

Abstract: An inductive electroacoustic transducer which includes a yoke, a magnetic circuit system disposing in the yoke, a vibration membrane which is driven by the magnetic circuit system, a cover coupled on one side of the yoke and it has a plurality of sound holes, and a circuit board which has a positive pole and a negative pole for importing acoustic electrical signals. The circuit board also has an inductive soldering disc and it is coupled to another side of the yoke. A portion of the yoke is connected to the inductive soldering disc with which it is conducted.

Abstract: A lawn mower includes an electric motor, a driving assembly coupled to the electric motor, a blade assembly coupled to the driving assembly, a battery for providing electricity to the electric motor, a switch unit electrically connected to the electric motor and the battery, and a detecting unit. The detecting unit includes a sampling resistor electrically connected in series with the battery, and a trigger circuit electrically connected in parallel with the sampling resistor and configured to control the switch unit to make or break electrical connection between the electric motor and the battery according to detected voltage across the sampling resistor.

Abstract: A cutting mold for removing two opposite superfluous rigid circuit boards from a rigid-flexible circuit board. A first cutter is connected to a first moldboard. A first barricade is connected to the first moldboard. The maximum vertical distance from the first barricade to the first moldboard exceeds that from the first cutter to the first moldboard. A second moldboard is opposite the first moldboard. The first and second moldboards move with respect to each other. A second cutter is connected to the second moldboard and corresponds to the first cutter. A second barricade is connected to the second moldboard and detachably abuts the first barricade. The maximum vertical distance from the second barricade to the second moldboard exceeds that from the second cutter to the second moldboard. The first and second cutters cut the superfluous rigid circuit boards when the first and second moldboards move toward each other.

Abstract: A cutting mold for removing two opposite superfluous rigid circuit boards from a rigid-flexible circuit board. A first cutter is connected to a first moldboard. A first barricade is connected to the first moldboard. The maximum vertical distance from the first barricade to the first moldboard exceeds that from the first cutter to the first moldboard. A second moldboard is opposite the first moldboard. The first and second moldboards move with respect to each other. A second cutter is connected to the second moldboard and corresponds to the first cutter. A second barricade is connected to the second moldboard and detachably abuts the first barricade. The maximum vertical distance from the second barricade to the second moldboard exceeds that from the second cutter to the second moldboard. The first and second cutters cut the superfluous rigid circuit boards when the first and second moldboards move toward each other.

Abstract: A method for manufacturing a rigid-flex board is disclosed. After the formation of each layer of the rigid-flex board, a laser-etched groove is formed at the interface between a rigid part and a bending area of the rigid-flex board. After the laser etching process, a circuit-board routing process is performed to remove materials along the sideward perimeter of the bending area. The exposed copper layer is then removed from inside the laser-etched groove. Thereafter, a redundancy rigid structure within the bending area is readily removed to expose the flex board within the bending area.

Abstract: A vibration unit includes a sound ring and a membrane attached to the sound ring. The membrane includes a rim for attachment to a shell of an acoustic device, a convex-concave annular region, a first non-planar connective region between the convex-concave annular region and the rim, a convex-concave circular region and a second non-planar connective region between the convex-concave circular region and the convex-concave annular region.

Abstract: The present invention provides a method for determining resist trim times in an etch process. In one embodiment of the invention, the method for determining resist trim times includes obtaining resist profile data and critical dimension (CD) data of a patterned resist layer using a scatterometer, in a step 520, and then obtaining an estimated trim time of the patterned resist layer using the resist profile data and critical dimension data, in steps 530-550.

Abstract: A wafer transfer chamber, such as a load-lock chamber used in a cluster processing tool for semiconductor devices that has reduced particle contamination problem is provided. In the wafer transfer chamber, a particle filter is provided to shield or isolate a wafer cassette during a chamber pumping and venting process such that not only particle contamination on the wafers situated in the wafer cassette can be drastically reduced, but also the cycle time or time for pumping and venting the load-lock chamber can be significantly reduced since turbulent flow in the chamber interior can be tolerated when the wafers are isolated from such flow which carries contaminating particles.

Abstract: An undesirable side effect of some processes that are used for forming dual gate devices is the formation of defects at the interface between the two oxide layers of different thickness. This problem has been solved by preceding the HF wet dip (that is used to thin out a selected area of oxide) with exposure of the photoresist to a low power plasma that includes some oxygen. This treatment removes unsaturated chemical bonds from the resist surface and prevents the formation of SiC based defects. Such defects could cause polysilicon lines to short or open, depending on their size.

Abstract: A method for forming on a substrate employed within a microelectronics fabrication a planarized inter-level metal dielectric (IMD) layer employing spin-on-glass (SOG) dielectric material, with attenuated etching damage to underlying layers. There is provided a substrate upon which is formed a patterned microelectronics layer over which is formed an inter-level metal dielectric (IMD) layer comprising a first silicon oxide dielectric layer and a second spin-on-glass (SOG) dielectric layer. The IMD layer is then planarized by plasma etchback method employing an etch cycle interrupted by an inert gas flushing step and substrate backside cooling by helium gas to control substrate temperature and etching reaction rates, resulting in attenuated damage to underlying layers resulting from over-etching of the IMD layer.

Abstract: A wafer transfer chamber, such as a load-lock chamber used in a cluster processing tool for semiconductor devices that has reduced particle contamination problem is provided. In the wafer transfer chamber, a particle filter is provided to shield or isolate a wafer cassette during a chamber pumping and venting process such that not only particle contamination on the wafers situated in the wafer cassette can be drastically reduced, but also the cycle time or time for pumping and venting the load-lock chamber can be significantly reduced since turbulent flow in the chamber interior can be tolerated when the wafers are isolated from such flow which carries contaminating particles.

Abstract: A novel energy producing flexible material is provided particularly suited for high altitude and stratospheric applications. The flexible energy producing covering includes a flexible solar cell layer, a flexible substrate which preferably matches the shape and size of the airship gore as well and an electrically conductive conduit disposed in a flexible electrically non-conductive adhesive connecting the flexible solar cell substrate to the airship substrate. Preferably two electrically conductive conduits are provided between the substrate layer and the flexible solar cell layer with the electrically conductive conduits being insulated from one another by the non-conductive adhesive. The novel process provided by the invention for joining the airship substrate to the flexible solar cell substrate includes heat, pressure and the selection of substrate materials and in certain applications the use of a vacuum.